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HGX3082EIM

Public Made by Adom

by adom

HGSEMI RS-485/RS-422 ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentcommunication interface chip-uart-485-232hgx3082eimfactory-2.0.0extractor-text
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Contents

README

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HGX3082EIM

HGSEMI · RS-485/RS-422 ICs · SOP-8

HGX3082EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high when A-B is at least -50mV and low when A-B is at most -200mV.
2 RE input Receiver output enable: RO is active when RE is low and high-impedance when RE is high; RE high with DE low enters low-power shutdown, and RE has a hot-plug input structure.
3 DE input Driver output enable: driver outputs are active when DE is high and high-impedance when DE is low; DE has a hot-plug input structure.
4 DI input Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground reference for the device.
6 A bidirectional Non-inverting receiver input and non-inverting driver output (A/Y) on the RS-485 bus.
7 B bidirectional Inverting receiver input and inverting driver output (B/Z) on the RS-485 bus.
8 VCC power_in Positive supply: 4.5V to 5.5V; decouple with a 0.1µF capacitor to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Communication Interface Chip/UART/485/232
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
电源电压 VCC 4.5 5.5 V 5
差分驱动器输出 RL=54Ω (RS-485) VOD 2.1 V Fig.1, RL=54Ω (RS-485) 5
差分驱动器输出 RL=100Ω (RS-422) VOD 2.7 V Fig.1, RL=100Ω (RS-422) 5
差分驱动器输出电压的幅度变化 ΔVOD 0.2 V Fig.1, RL=100Ω or RL=54Ω 5
驱动器共模输出电压 VOC 3 V Fig.1, RL=100Ω or RL=54Ω 5
共模电压的幅度变化 ΔVOC 0.2 V Fig.1, RL=100Ω or RL=54Ω 5
输入高电压 VIH 2 V DE, DI, RE 5
输入低电压 VIL 0.8 V DE, DI 5
输入电流 IIN -1 1 μA DE, DI, RE 5
输入电流（A,B）全双工 VIN=12V IA, IB 125 μA DE=GND, VCC=GND or VCC, VIN=12V 5
输入电流（A,B）全双工 VIN=-7V IA, IB -75 μA DE=GND, VCC=GND or VCC, VIN=-7V 5
输出漏电流（Y,Z）全双工 VIN=12V IO 125 μA DE=GND, VCC=GND or VCC, VIN=12V 5
输出漏电流（Y,Z）全双工 VIN=-7V IO -100 μA DE=GND, VCC=GND or VCC, VIN=-7V 5
驱动器短路输出电流 0≦VOUT≦12V IOSD 250 mA 0≦VOUT≦12V 5
驱动器短路输出电流 -7≦VOUT≦VCC IOSD -250 mA -7≦VOUT≦Vcc 5
驱动器短路回馈限制输出电流（高侧） IOSDF 20 mA Vcc-1V≦VOUT≦Vcc+0.5V 5
驱动器短路回馈限制输出电流（低侧） IOSDF -20 mA -0.5V≦VOUT≦+1V 5
接收器输出低压 VOL 0.4 V IO= 4mA, VID=-200mV 5
接收器端三态输出电流 IOZR -1 1 μA 0≦VO≦VCC 5
接收器差分阈值电压 VTH -200 -125 -50 mV -7V≦VCM≦12V 5
供应电流 无负载 RE=VCC, DE=VCC, DE=VCC 分支 (典型) Icc 530 900 μA No load, RE=VCC, DI=GND or VCC, DE=VCC 6
供应电流 无负载 RE=VCC, DE=GND Icc 475 600 μA No load, RE=VCC, DE=GND 6
供应电流 无负载 RE=GND, DE=VCC Icc 530 1000 μA No load, RE=GND, DI=GND or VCC, DE=VCC 6
供应电流 无负载 RE=GND, DE=GND Icc 475 800 μA No load, RE=GND, DE=GND 6
待机模式中的供应电流 ISHDN 0.05 10 μA DE=GND, RE=VCC 6
热关断温度 TTS 165 ℃ 5
热关断迟滞 TTSH 15 ℃ 5
驱动器使能到输出低 tDZL 3500 ns Fig.3 and 6, CL=100pF, S2 closed 6
从低到驱动器无效时间 tDLZ 100 ns Fig.3 and 6, CL=15pF, S2 closed 6
从高到驱动器无效时间 tDHZ 100 ns Fig.3 and 6, CL=15pF, S3 closed 6
从待机到输出高的驱动器使能 tDZH(SHDN) 5500 ns Fig.3 and 6, CL=15pF, S3 closed 6
从待机到输出低的驱动器使能 tDZL(SHDN) 5500 ns Fig.3 and 6, CL=15pF, S2 closed 6
待机时间 tSHDN 50 350 700 ns note 4 6
接收器传输延迟 tRPLH, tRPHL 200 ns Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 7
差分接收器输出的上升和下降时间不对称度 tRSKEW -30 30 ns Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 7
接收器使能到输出低 tRZL 50 ns Fig.4 and 9, S1=-1.5V, S2 to VCC 7
接收器使能到输出高 tRZH 50 ns Fig.4 and 9, S1=+1.5V, S2 to GND 7
接收器从低到无效时间 tRLZ 50 ns Fig.4 and 9, S1=-1.5V, S2 to VCC 7
接收器从高到无效时间 tRHZ 50 ns Fig.4 and 9, S1=+1.5V, S2 to GND 7
从待机到输出高的接收器使能 tRZH(SHDN) 5500 ns Fig.4 and 9, S1=-1.5V, S2 to VCC 7
从待机到输出低的接收器使能 tRZL(SHDN) 5500 ns Fig.4 and 9, S1=+1.5V, S2 to GND 7
待机时间（接收器） tSHDN 50 700 ns note 4 7
电源电压（绝对最大） VCC 6 V 4
控制输入电压 RE, DE RE, DE -0.3 6 V 4
驱动器输入电压 DI DI -0.3 6 V 4
驱动器输出电压 A,B,Y,Z A,B,Y,Z -7 12 V 4
接收器输入电压 A,B A,B -7 12 V 4
连续功耗 8SOP 500 mW TA=+70℃, 8SOP 4
储存温度 -65 150 ℃ 4
引脚温度（焊接） TLEAD 260 ℃ soldering 10s 4
工作温度范围（工业级 EI） -40 85 ℃ HGX308_EI 4

CAD (KiCad official)

  • Symbol: HGX3082EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hgx3082eim-etched.step / hgx3082eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgx3082eim.step / hgx3082eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (28 pp, sha256 f6d3ad97a8f240e8, retrieved 2026-10-27, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF