component
HGV8552MM
Public Made by Adomby adom
HGSEMI Operational Amplifier, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HGV8552MM
HGSEMI · Operational Amplifier · MSOP-8
HGV8552MM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTA | output | Channel A amplifier output with rail-to-rail swing, operating from a 1.8V to 5.5V single supply. |
| 2 | INA- | input | Channel A inverting input, rail-to-rail with common-mode range of VSS-0.1V to VDD+0.1V. |
| 3 | INA+ | input | Channel A non-inverting input, rail-to-rail with common-mode range of VSS-0.1V to VDD+0.1V. |
| 4 | VSS | power_in | Negative supply or ground; for dual supplies ±0.9V to ±2.75V, bypass with a 0.1µF ceramic capacitor. |
| 5 | INB+ | input | Channel B non-inverting input, rail-to-rail with common-mode range of VSS-0.1V to VDD+0.1V. |
| 6 | INB- | input | Channel B inverting input, rail-to-rail with common-mode range of VSS-0.1V to VDD+0.1V. |
| 7 | OUTB | output | Channel B amplifier output with rail-to-rail swing, operating from a 1.8V to 5.5V single supply. |
| 8 | VDD | power_in | Positive supply, 1.8V to 5.5V single supply (absolute max 7.5V); place a 0.1µF ceramic capacitor close to the pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power Supply Voltage (VDD to Vss) | -0.5 | 7.5 | V | 3 | |||
| Operating Temperature Range | -40 | 85 | °C | 3 | |||
| Junction Temperature | 160 | °C | 3 | ||||
| Storage Temperature Range | -55 | 150 | °C | 3 | |||
| Lead Temperature (soldering, 10sec) | 260 | °C | soldering, 10 sec | 3 | |||
| PDB Input Voltage | 7 | V | 3 | ||||
| ESD Susceptibility HBM | 6 | KV | HBM | 3 | |||
| ESD Susceptibility MM | 400 | V | MM | 3 | |||
| Single-supply operating voltage | 1.8 | 5.5 | V | single supply (Features) | 1 | ||
| Input Offset Voltage (VOS) | VOS | 1 | 30 | µV | 4 | ||
| Input Offset Voltage Drift (ΔVOS/ΔT) | ΔVOS/ΔT | 10 | 50 | nV/℃ | 4 | ||
| Package Thermal Resistance, MSOP-8 | θJA | 216 | °C/W | TA=+25℃ | 3 | ||
| Input Bias Current (IB) | IB | 20 | pA | 4 | |||
| Input Offset Current (IOS) | IOS | 10 | pA | 4 | |||
| Common-Mode Rejection Ratio (CMRR) | CMRR | 110 | dB | VCM = 0V to 5V | 4 | ||
| Large Signal Voltage Gain (AVO) | AVO | 145 | dB | RL = 10kΩ, VO = 0.3V to 4.7V | 4 | ||
| Output Voltage High (VOH) | VOH | 4.998 | V | RL = 100kΩ to - VS | 4 | ||
| Output Voltage High (VOH) | VOH | 4.994 | V | RL = 10kΩ to - VS | 4 | ||
| Output Voltage Low (VOL) | VOL | 2 | mV | RL = 100kΩ to + VS | 4 | ||
| Output Voltage Low (VOL) | VOL | 5 | mV | RL = 10kΩ to + VS | 4 | ||
| Short Circuit Limit (ISC) | ISC | 60 | mA | RL =10Ω to - VS | 4 | ||
| Output Current (IO) | IO | 65 | mA | 4 | |||
| Power Supply Rejection Ratio (PSRR) | PSRR | 115 | dB | VS = 2.5V to 5.5V | 4 | ||
| Quiescent Current (IQ) | IQ | 180 | µA | VO = 0V, RL = 0Ω | 4 | ||
| Gain-Bandwidth Product (GBP) | GBP | 1.8 | MHz | G = +100 | 4 | ||
| Slew Rate (SR) | SR | 0.95 | V/µs | RL = 10kΩ | 4 | ||
| Overload Recovery Time | 0.1 | ms | 4 | ||||
| Voltage Noise (en p-p) | en p-p | 0.3 | µVP-P | 0Hz to 10Hz | 4 | ||
| Voltage Noise Density (en) | en | 38 | nV Hz | f = 1kHz | 4 |
CAD (KiCad official)
- Symbol:
HGV8552MM - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
hgv8552mm-etched.step/hgv8552mm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hgv8552mm.step/hgv8552mm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (14 pp, sha256
5fbbb583df3651ad, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HGV8552MM
**HGSEMI** · Operational Amplifier · MSOP-8
HGV8552MM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTA | output | Channel A amplifier output with rail-to-rail swing, operating from a 1.8V to 5.5V single supply. |
| 2 | INA- | input | Channel A inverting input, rail-to-rail with common-mode range of VSS-0.1V to VDD+0.1V. |
| 3 | INA+ | input | Channel A non-inverting input, rail-to-rail with common-mode range of VSS-0.1V to VDD+0.1V. |
| 4 | VSS | power_in | Negative supply or ground; for dual supplies ±0.9V to ±2.75V, bypass with a 0.1µF ceramic capacitor. |
| 5 | INB+ | input | Channel B non-inverting input, rail-to-rail with common-mode range of VSS-0.1V to VDD+0.1V. |
| 6 | INB- | input | Channel B inverting input, rail-to-rail with common-mode range of VSS-0.1V to VDD+0.1V. |
| 7 | OUTB | output | Channel B amplifier output with rail-to-rail swing, operating from a 1.8V to 5.5V single supply. |
| 8 | VDD | power_in | Positive supply, 1.8V to 5.5V single supply (absolute max 7.5V); place a 0.1µF ceramic capacitor close to the pin. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power Supply Voltage (VDD to Vss) | | -0.5 | | 7.5 | V | | 3 |
| Operating Temperature Range | | -40 | | 85 | °C | | 3 |
| Junction Temperature | | | | 160 | °C | | 3 |
| Storage Temperature Range | | -55 | | 150 | °C | | 3 |
| Lead Temperature (soldering, 10sec) | | | | 260 | °C | soldering, 10 sec | 3 |
| PDB Input Voltage | | | | 7 | V | | 3 |
| ESD Susceptibility HBM | | 6 | | | KV | HBM | 3 |
| ESD Susceptibility MM | | 400 | | | V | MM | 3 |
| Single-supply operating voltage | | 1.8 | | 5.5 | V | single supply (Features) | 1 |
| Input Offset Voltage (VOS) | VOS | | 1 | 30 | µV | | 4 |
| Input Offset Voltage Drift (ΔVOS/ΔT) | ΔVOS/ΔT | | 10 | 50 | nV/℃ | | 4 |
| Package Thermal Resistance, MSOP-8 | θJA | | 216 | | °C/W | TA=+25℃ | 3 |
| Input Bias Current (IB) | IB | | 20 | | pA | | 4 |
| Input Offset Current (IOS) | IOS | | 10 | | pA | | 4 |
| Common-Mode Rejection Ratio (CMRR) | CMRR | | 110 | | dB | VCM = 0V to 5V | 4 |
| Large Signal Voltage Gain (AVO) | AVO | | 145 | | dB | RL = 10kΩ, VO = 0.3V to 4.7V | 4 |
| Output Voltage High (VOH) | VOH | | 4.998 | | V | RL = 100kΩ to - VS | 4 |
| Output Voltage High (VOH) | VOH | | 4.994 | | V | RL = 10kΩ to - VS | 4 |
| Output Voltage Low (VOL) | VOL | | 2 | | mV | RL = 100kΩ to + VS | 4 |
| Output Voltage Low (VOL) | VOL | | 5 | | mV | RL = 10kΩ to + VS | 4 |
| Short Circuit Limit (ISC) | ISC | | 60 | | mA | RL =10Ω to - VS | 4 |
| Output Current (IO) | IO | | 65 | | mA | | 4 |
| Power Supply Rejection Ratio (PSRR) | PSRR | | 115 | | dB | VS = 2.5V to 5.5V | 4 |
| Quiescent Current (IQ) | IQ | | 180 | | µA | VO = 0V, RL = 0Ω | 4 |
| Gain-Bandwidth Product (GBP) | GBP | | 1.8 | | MHz | G = +100 | 4 |
| Slew Rate (SR) | SR | | 0.95 | | V/µs | RL = 10kΩ | 4 |
| Overload Recovery Time | | | 0.1 | | ms | | 4 |
| Voltage Noise (en p-p) | en p-p | | 0.3 | | µVP-P | 0Hz to 10Hz | 4 |
| Voltage Noise Density (en) | en | | 38 | | nV Hz | f = 1kHz | 4 |
## CAD (KiCad official)
- Symbol: `HGV8552MM`
- Footprint: `Package_SO:MSOP-8_3x3mm_P0.65mm`
- 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files: `hgv8552mm-etched.step` / `hgv8552mm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hgv8552mm.step` / `hgv8552mm.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8762804595007733760) (14 pp, sha256 `5fbbb583df3651ad`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hgv8552mm-datasheet.pdf)