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HGV8552AIMM
Public Made by Adomby adom
HGSEMI Precision Op Amps, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HGV8552AIMM
HGSEMI · Precision Op Amps · MSOP-8
HGV8552AIMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTA | output | Amplifier A output, rail-to-rail swing. |
| 2 | INA- | input | Amplifier A inverting input; common-mode range extends 100mV beyond supply rails (VSS-0.1V to VDD+0.1V). |
| 3 | INA+ | input | Amplifier A non-inverting input; common-mode range extends 100mV beyond supply rails (VSS-0.1V to VDD+0.1V). |
| 4 | VSS | power_in | Negative supply (ground in single-supply operation); bypass with 0.1µF ceramic capacitor in dual-supply operation. |
| 5 | INB+ | input | Amplifier B non-inverting input; common-mode range extends 100mV beyond supply rails (VSS-0.1V to VDD+0.1V). |
| 6 | INB- | input | Amplifier B inverting input; common-mode range extends 100mV beyond supply rails (VSS-0.1V to VDD+0.1V). |
| 7 | OUTB | output | Amplifier B output, rail-to-rail swing. |
| 8 | VDD | power_in | Positive supply, 1.8V to 5.5V single supply (absolute max 7.5V VDD to VSS); place 0.1µF ceramic bypass capacitor close to this pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage | VOS | 1 | 30 | µV | 3 | ||
| Input Offset Voltage Drift | ΔVOS/ΔT | 10 | 50 | nV/℃ | 3 | ||
| Power Supply Voltage (VDD to Vss) | VDD to Vss | -0.5 | 7.5 | V | 2 | ||
| PDB Input Voltage | PDB | 7 | V | Minimum is printed as Vss-0.5V (not a fixed value) | 2 | ||
| Operating Temperature Range | -40 | 85 | °C | 2 | |||
| Junction Temperature | 160 | °C | 2 | ||||
| Storage Temperature Range | -55 | 150 | °C | 2 | |||
| Lead Temperature | 260 | °C | soldering, 10 sec | 2 | |||
| ESD Susceptibility HBM | 6 | kV | HBM | 2 | |||
| ESD Susceptibility MM | 400 | V | MM | 2 | |||
| Package Thermal Resistance θJA (MSOP-8) | θJA | 216 | °C/W | TA=+25℃, MSOP-8 | 2 | ||
| Single-Supply Operating Voltage | VDD | 1.8 | 5.5 | V | Single-supply operation | 1 | |
| Dual-Supply Operating Voltage | VDD/VSS | 0.9 | 2.75 | V | Dual-supply operation (±) | 6 |
CAD (KiCad official)
- Symbol:
HGV8552AIMM - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
hgv8552aimm-etched.step/hgv8552aimm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hgv8552aimm.step/hgv8552aimm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (12 pp, sha256
551c94bce1b83c29, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HGV8552AIMM
**HGSEMI** · Precision Op Amps · MSOP-8
HGV8552AIMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTA | output | Amplifier A output, rail-to-rail swing. |
| 2 | INA- | input | Amplifier A inverting input; common-mode range extends 100mV beyond supply rails (VSS-0.1V to VDD+0.1V). |
| 3 | INA+ | input | Amplifier A non-inverting input; common-mode range extends 100mV beyond supply rails (VSS-0.1V to VDD+0.1V). |
| 4 | VSS | power_in | Negative supply (ground in single-supply operation); bypass with 0.1µF ceramic capacitor in dual-supply operation. |
| 5 | INB+ | input | Amplifier B non-inverting input; common-mode range extends 100mV beyond supply rails (VSS-0.1V to VDD+0.1V). |
| 6 | INB- | input | Amplifier B inverting input; common-mode range extends 100mV beyond supply rails (VSS-0.1V to VDD+0.1V). |
| 7 | OUTB | output | Amplifier B output, rail-to-rail swing. |
| 8 | VDD | power_in | Positive supply, 1.8V to 5.5V single supply (absolute max 7.5V VDD to VSS); place 0.1µF ceramic bypass capacitor close to this pin. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage | VOS | | 1 | 30 | µV | | 3 |
| Input Offset Voltage Drift | ΔVOS/ΔT | | 10 | 50 | nV/℃ | | 3 |
| Power Supply Voltage (VDD to Vss) | VDD to Vss | -0.5 | | 7.5 | V | | 2 |
| PDB Input Voltage | PDB | | | 7 | V | Minimum is printed as Vss-0.5V (not a fixed value) | 2 |
| Operating Temperature Range | | -40 | | 85 | °C | | 2 |
| Junction Temperature | | | | 160 | °C | | 2 |
| Storage Temperature Range | | -55 | | 150 | °C | | 2 |
| Lead Temperature | | | | 260 | °C | soldering, 10 sec | 2 |
| ESD Susceptibility HBM | | | | 6 | kV | HBM | 2 |
| ESD Susceptibility MM | | | | 400 | V | MM | 2 |
| Package Thermal Resistance θJA (MSOP-8) | θJA | | 216 | | °C/W | TA=+25℃, MSOP-8 | 2 |
| Single-Supply Operating Voltage | VDD | 1.8 | | 5.5 | V | Single-supply operation | 1 |
| Dual-Supply Operating Voltage | VDD/VSS | 0.9 | | 2.75 | V | Dual-supply operation (±) | 6 |
## CAD (KiCad official)
- Symbol: `HGV8552AIMM`
- Footprint: `Package_SO:MSOP-8_3x3mm_P0.65mm`
- 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files: `hgv8552aimm-etched.step` / `hgv8552aimm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hgv8552aimm.step` / `hgv8552aimm.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590440720021684224) (12 pp, sha256 `551c94bce1b83c29`, retrieved 2026-10-16, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hgv8552aimm-datasheet.pdf)