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Ray Publish 0.1.0 80c0904 7d ago

HGV8551M5

HGSEMI · Operational Amplifier · SOT-23-5

HGV8551M5 from HGSEMI, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT output Amplifier output with rail-to-rail swing, driving up to 65mA output current (60mA short-circuit limit).
2 VSS power_in Negative supply or ground; the datasheet allows single supply 1.8V to 5.5V or dual ±0.9V to ±2.75V.
3 IN+ input Non-inverting input with rail-to-rail common-mode range from VSS-0.1V to VDD+0.1V.
4 IN- input Inverting input with rail-to-rail common-mode range from VSS-0.1V to VDD+0.1V.
5 VDD power_in Positive supply, 1.8V to 5.5V (absolute maximum 7.5V); bypass with a 0.1µF ceramic capacitor placed close to the pin.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOT-23-5
Category Amplifiers/Comparators
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage VOS 1 30 µV VS = +5V, VCM = +2.5V, VO = +2.5V, TA = +25℃ (table header) 4
Input Offset Voltage Drift ∆VOS/∆T 10 50 nV/℃ VS = +5V, VCM = +2.5V, VO = +2.5V, TA = +25℃ (table header) 4
Power Supply Voltage (VDD to Vss) VDD to Vss -0.5 7.5 V 3
PDB Input Voltage 7 V 3
Operating Temperature Range -40 85 °C 3
Junction Temperature 160 °C 3
Storage Temperature Range -55 150 °C 3
Lead Temperature 260 °C soldering, 10 sec 3
Package Thermal Resistance, SOT-23-5 θJA 190 °C/W TA = +25℃, SOT-23-5 3
ESD Susceptibility HBM 6 KV HBM 3
ESD Susceptibility MM 400 V MM 3
Single Supply Operating Voltage 1.8 5.5 V single supply 7
Dual Supply Operating Voltage 0.9 2.75 V dual supply, each supply ±0.9V to ±2.75V 7

CAD (KiCad official)

  • Symbol: HGV8551M5
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: hgv8551m5-etched.step / hgv8551m5-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgv8551m5.step / hgv8551m5.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (14 pp, sha256 15ddc9477dd7d599, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF