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HGV8544M

HGSEMI · Operational Amplifier · SOP-14

HGV8544M from HGSEMI, in a SOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT A output Output of amplifier A (rail-to-rail output, up to 30 mA at 5 V).
2 -IN A input Inverting input of amplifier A; rail-to-rail input range, input voltage GND to VS.
3 +IN A input Non-inverting input of amplifier A; rail-to-rail input range, input voltage GND to VS.
4 V+ power_in Positive supply, 2.7 V to 5.5 V single supply (absolute maximum 6 V).
5 +IN B input Non-inverting input of amplifier B; rail-to-rail input range, input voltage GND to VS.
6 -IN B input Inverting input of amplifier B; rail-to-rail input range, input voltage GND to VS.
7 OUT B output Output of amplifier B (rail-to-rail output, up to 30 mA at 5 V).
8 OUT C output Output of amplifier C (rail-to-rail output, up to 30 mA at 5 V).
9 -IN C input Inverting input of amplifier C; rail-to-rail input range, input voltage GND to VS.
10 +IN C input Non-inverting input of amplifier C; rail-to-rail input range, input voltage GND to VS.
11 V- power_in Negative supply / ground for single-supply operation.
12 +IN D input Non-inverting input of amplifier D; rail-to-rail input range, input voltage GND to VS.
13 -IN D input Inverting input of amplifier D; rail-to-rail input range, input voltage GND to VS.
14 OUT D output Output of amplifier D (rail-to-rail output, up to 30 mA at 5 V).

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-14
Category Amplifiers/Comparators
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VS 6 V 6
Differential input voltage -6 6 V 6
Storage temperature range -65 150 °C 6
Operating temperature range -40 125 °C 6
Junction temperature range -65 150 °C 6
Lead temperature (soldering) 300 °C Soldering, 60 s 6
Thermal resistance junction-to-ambient, 14-pin SOP (M) θJA 120 ℃/W Worst case, device soldered on circuit board 6
Thermal resistance junction-to-case, 14-pin SOP (M) θJC 36 ℃/W 6
Input offset voltage VOS 1 6 mV 3
Input offset voltage VOS 7 mV −40°C ≤ TA ≤ +125°C 3
Input bias current IB 4 60 pA 3
Input bias current IB 100 pA −40°C ≤ TA ≤ +85°C 3
Input bias current IB 1000 pA −40°C ≤ TA ≤ +125°C 3
Input offset current IOS 0.1 30 pA 3
Input offset current IOS 50 pA −40°C ≤ TA ≤ +85°C 3
Input offset current IOS 500 pA −40°C ≤ TA ≤ +125°C 3
Input voltage range 0 2.7 V 3
Common-mode rejection ratio CMRR 40 45 dB VCM = 0 V 至 2.7 V 3
Common-mode rejection ratio CMRR 38 dB −40°C ≤ TA ≤ +125°C 3
Large-signal voltage gain AVO 100 500 V/mV RL = 100 kΩ, VO = 0.5 V 至 2.2 V 3
Large-signal voltage gain AVO 50 V/mV −40°C ≤ TA ≤ +85°C 3
Large-signal voltage gain AVO 2 V/mV −40°C ≤ TA ≤ +125°C 3
Input offset voltage drift ΔVOS/ΔT 4 μV/°C −40°C ≤ TA ≤ +125°C 3
Input bias current drift ΔIB/ΔT 100 fA/°C −40°C ≤ TA ≤ +85°C 3
Input bias current drift ΔIB/ΔT 2000 fA/°C −40°C ≤ TA ≤ +125°C 3
Input offset current drift ΔIOS/ΔT 25 fA/°C −40°C ≤ TA ≤ +125°C 3
High-level output voltage VOH 2.575 2.65 V IL = 1 mA 3
High-level output voltage VOH 2.55 V −40°C ≤ TA ≤ +125°C 3
Low-level output voltage VOL 35 100 mV IL = 1 mA 3
Low-level output voltage VOL 125 mV −40°C ≤ TA ≤ +125°C 3
Output current IOUT 15 mA VOUT = VS − 1 V 3
Short-circuit output current ISC -20 20 mA 3
Closed-loop output impedance ZOUT 50 Ω f = 200 kHz, AV = 1 3
Power supply rejection ratio PSRR 65 76 dB VS = 2.5 V 6 V 3
Power supply rejection ratio PSRR 60 dB −40°C ≤ TA ≤ +125°C 3
Supply current per amplifier ISY 38 55 μA VO = 0 V 3
Supply current per amplifier ISY 75 μA −40°C ≤ TA ≤ +125°C 3
Slew rate SR 0.4 0.75 V/μs RL = 100 kΩ 3
Settling time tS 5 μs 至 0.1%(1V 阶跃) 3
Gain-bandwidth product GBP 980 kHz 3
Phase margin ΦM 63 度 3
Voltage noise density en 40 nV/√Hz f = 1 kHz 3
Voltage noise density en 38 nV/√Hz f = 10 kHz 3
Current noise density in 0.1 pA/√Hz 3

CAD (KiCad official)

  • Symbol: HGV8544M
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOP-14 (KiCad packages3D, STEP)
  • 3D model files: hgv8544m-etched.step / hgv8544m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgv8544m.step / hgv8544m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (21 pp, sha256 ef6bf274fdb87fbf, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF