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HGV8542MM

HGSEMI · Operational Amplifier · MSOP-8

HGV8542MM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	OUT A	output	Amplifier A output, rail-to-rail, sources or sinks 15 mA at VS=2.7 V and 30 mA at VS=5 V within 1 V of the supply rail.
2	-IN A	input	Amplifier A inverting input, rail-to-rail, with typical input bias current of 4 pA and input voltage limited to GND to VS.
3	+IN A	input	Amplifier A non-inverting input, rail-to-rail, with typical input bias current of 4 pA and input voltage limited to GND to VS.
4	V-	power_in	Negative supply or ground for a single-supply operation, with a total supply of 2.7 V to 5.5 V (6 V absolute maximum).
5	+IN B	input	Amplifier B non-inverting input, rail-to-rail, with input voltage limited to GND to VS.
6	-IN B	input	Amplifier B inverting input, rail-to-rail, with input voltage limited to GND to VS.
7	OUT B	output	Amplifier B output, rail-to-rail, sources or sinks 15 mA at VS=2.7 V and 30 mA at VS=5 V within 1 V of the supply rail.
8	V+	power_in	Positive supply, 2.7 V to 5.5 V single supply (6 V absolute maximum), with 45 uA typical supply current per amplifier.

Key specifications

Parameter	Value
Manufacturer	HGSEMI
Package	MSOP-8
Category	Amplifiers/Comparators
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Input offset voltage	VOS		1	6	mV		3
Input offset voltage	VOS			7	mV	−40°C ≤ TA ≤ +125°C	3
Input bias current	IB		4	60	pA		3
Input bias current	IB			100	pA	−40°C ≤ TA ≤ +85°C	3
Input bias current	IB			1000	pA	−40°C ≤ TA ≤ +125°C	3
Input offset current	IOS		0.1	30	pA		3
Input offset current	IOS			50	pA	−40°C ≤ TA ≤ +85°C	3
Input offset current	IOS			500	pA	−40°C ≤ TA ≤ +125°C	3
Input voltage range		0		2.7	V		3
Common-mode rejection ratio	CMRR	40	45		dB	VCM = 0 V 至 2.7 V	3
Common-mode rejection ratio	CMRR	38			dB	−40°C ≤ TA ≤ +125°C	3
Large-signal voltage gain	AVO	100	500		V/mV	RL = 100 kΩ, VO = 0.5 V 至 2.2 V	3
Large-signal voltage gain	AVO	50			V/mV	−40°C ≤ TA ≤ +85°C	3
Large-signal voltage gain	AVO	2			V/mV	−40°C ≤ TA ≤ +125°C	3
High-level output voltage	VOH	2.575	2.65		V	IL = 1 mA	3
High-level output voltage	VOH	2.55			V	−40°C ≤ TA ≤ +125°C	3
Low-level output voltage	VOL		35	100	mV	IL = 1 mA	3
Low-level output voltage	VOL			125	mV	−40°C ≤ TA ≤ +125°C	3
Short-circuit output current	ISC	-20		20	mA		3
Power supply rejection ratio	PSRR	65	76		dB	VS = 2.5 V 至 6 V	3
Power supply rejection ratio	PSRR	60			dB	−40°C ≤ TA ≤ +125°C	3
Quiescent supply current per amplifier	ISY		38	55	μA	VO = 0 V	3
Quiescent supply current per amplifier	ISY			75	μA	−40°C ≤ TA ≤ +125°C	3
Slew rate	SR	0.4	0.75		V/μs	RL = 100 kΩ	3
Voltage noise current density	in			0.1	pA/√Hz		3
Input offset voltage drift	ΔVOS/ΔT		4		μV/°C	−40°C ≤ TA ≤ +125°C	3
Input bias current drift	ΔIB/ΔT		100		fA/°C	−40°C ≤ TA ≤ +85°C	3
Input bias current drift	ΔIB/ΔT		2000		fA/°C	−40°C ≤ TA ≤ +125°C	3
Input offset current drift	ΔIOS/ΔT		25		fA/°C	−40°C ≤ TA ≤ +125°C	3
Output current	IOUT		15		mA	VOUT = VS − 1 V	3
Closed-loop output impedance	ZOUT		50		Ω	f = 200 kHz, AV = 1	3
Settling time	tS		5		μs	至 0.1%（1V 阶跃）	3
Gain bandwidth product	GBP		980		kHz		3
Phase margin	ΦM		63		度		3
Voltage noise density	en		40		nV/√Hz	f = 1 kHz	3
Voltage noise density	en		38		nV/√Hz	f = 10 kHz	3
Supply voltage	VS			6	V		6
Differential input voltage		-6		6	V	电源电压低于6V时，差分输入电压等于±VS	6
Storage temperature range		-65		150	°C		6
Operating temperature range		-40		125	°C		6
Junction temperature range		-65		150	°C		6
Lead temperature (soldering)				245	°C	soldering, 10 s	6
Single supply voltage		2.7		5.5	V	单电源供电 (from features list, not an operating-conditions table)	1
Junction-to-ambient thermal resistance (MSOP-8, MM)	θJA		210		°C/W	PCB-mounted, worst case	6
Junction-to-case thermal resistance (MSOP-8, MM)	θJC		45		°C/W		6

CAD (KiCad official)

Symbol: HGV8542MM
Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
3D model: MSOP-8 (KiCad packages3D, STEP)
3D model files: hgv8542mm-etched.step / hgv8542mm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgv8542mm.step / hgv8542mm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: HGSEMI datasheet (22 pp, sha256 8f1c171657a615b7, retrieved 2026-10-17, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF