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HGV8541MM

Public Made by Adom

by adom

HGSEMI Precision Op Amps, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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HGV8541MM

HGSEMI · Precision Op Amps · MSOP-8

HGV8541MM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connect; not internally connected.
2 -IN A input Inverting input of the amplifier, rail-to-rail with input range 0 V to VS.
3 +IN A input Non-inverting input of the amplifier, rail-to-rail with input range 0 V to VS.
4 V- power_in Negative supply / ground; single-supply operation from 2.7 V to 5.5 V between V+ and V-.
5 NC unconnected No connect; not internally connected.
6 OUT A output Amplifier output, rail-to-rail, with typical short-circuit current of ±60 mA at 5 V.
7 V+ power_in Positive supply, 2.7 V to 5.5 V single supply (absolute maximum 6 V).
8 NC unconnected No connect; not internally connected.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input offset voltage VOS 1 6 mV 3
Input offset voltage over temperature VOS 7 mV −40°C ≤ TA ≤ +125°C 3
Input bias current IB 4 60 pA 3
Input bias current over temperature IB 100 pA −40°C ≤ TA ≤ +85°C 3
Input bias current over temperature IB 1000 pA −40°C ≤ TA ≤ +125°C 3
Input offset current IOS 0.1 30 pA 3
Input offset current over temperature IOS 50 pA −40°C ≤ TA ≤ +85°C 3
Input offset current over temperature IOS 500 pA −40°C ≤ TA ≤ +125°C 3
Input voltage range 0 2.7 V 3
Common-mode rejection ratio CMRR 40 45 dB VCM = 0 V to 2.7 V 3
Common-mode rejection ratio over temperature CMRR 38 dB −40°C ≤ TA ≤ +125°C 3
Large-signal voltage gain AVO 100 500 V/mV RL = 100 kΩ, VO = 0.5 V to 2.2 V 3
Large-signal voltage gain over temperature AVO 50 V/mV −40°C ≤ TA ≤ +85°C 3
Large-signal voltage gain over temperature AVO 2 V/mV −40°C ≤ TA ≤ +125°C 3
High-level output voltage VOH 2.575 2.65 V IL = 1 mA 3
High-level output voltage over temperature VOH 2.55 V −40°C ≤ TA ≤ +125°C 3
Low-level output voltage VOL 35 100 mV IL = 1 mA 3
Low-level output voltage over temperature VOL 125 mV −40°C ≤ TA ≤ +125°C 3
Output current IOUT 15 mA VOUT = VS − 1 V 3
Short-circuit output current ISC -20 20 mA 3
Power supply rejection ratio PSRR 65 76 dB VS = 2.5 V to 6 V 3
Power supply rejection ratio over temperature PSRR 60 dB −40°C ≤ TA ≤ +125°C 3
Supply current per amplifier ISY 38 55 μA VO = 0 V 3
Supply current per amplifier over temperature ISY 75 μA −40°C ≤ TA ≤ +125°C 3
Slew rate SR 0.4 0.75 V/μs RL = 100 kΩ 3
Input voltage noise density in 0.1 pA/√Hz 3
Power supply voltage VS 6 V 6
Differential input voltage -6 6 V 6
Storage temperature range -65 150 °C 6
Operating temperature range -40 125 °C 6
Junction temperature range -65 150 °C 6
Lead temperature (soldering) 300 °C 60 s soldering 6
Input offset voltage drift ΔVOS/ΔT 4 μV/°C −40°C ≤ TA ≤ +125°C 3
Input bias current drift ΔIB/ΔT 100 fA/°C −40°C ≤ TA ≤ +85°C 3
Input bias current drift ΔIB/ΔT 2000 fA/°C −40°C ≤ TA ≤ +125°C 3
Input offset current drift ΔIOS/ΔT 25 fA/°C −40°C ≤ TA ≤ +125°C 3
Closed-loop output impedance ZOUT 50 Ω f = 200 kHz, AV = 1 3
Settling time tS 5 μs to 0.1% (1 V step) 3
Gain-bandwidth product GBP 980 kHz 3
Phase margin ΦM 63 度 3
Voltage noise density en 40 nV/√Hz f = 1 kHz 3
Voltage noise density en 38 nV/√Hz f = 10 kHz 3
Thermal resistance, junction to ambient (MSOP-8) θJA 210 °C/W Worst case, device soldered to circuit board (surface mount) 6
Thermal resistance, junction to case (MSOP-8) θJC 45 °C/W 6

CAD (KiCad official)

  • Symbol: HGV8541MM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: hgv8541mm-etched.step / hgv8541mm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgv8541mm.step / hgv8541mm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (21 pp, sha256 f6d33d03960c465f, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF