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Contents

README

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HGV8541M

HGSEMI · Operational Amplifier · SOP-8

HGV8541M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection. Leave floating or tie to ground for best PCB practice.
2 -IN input Inverting input of the operational amplifier. Rail-to-rail input range from GND (0 V) to VS (up to 5.5 V). Very low input bias current (4 pA typ) enables high-impedance source usage.
3 +IN input Non-inverting input of the operational amplifier. Rail-to-rail common-mode range from GND (0 V) to VS. Very low input bias current (4 pA typ).
4 V- power_in Negative supply / ground pin. Tie to GND in single-supply operation, or to the negative rail in split-supply operation. Total supply span (V+ minus V-) must not exceed 6 V absolute maximum.
5 NC unconnected No internal connection. Leave floating or tie to ground for best PCB practice.
6 OUT output Rail-to-rail amplifier output. Drives up to ~15 mA (VOUT = VS - 1 V) with short-circuit current ±20 mA. Closed-loop output impedance ~50 Ω at 200 kHz, AV=1.
7 V+ power_in Positive supply pin. Single-supply operation from 2.7 V to 5.5 V (absolute maximum 6 V). Supply current is only 45 uA typical per amplifier. Decouple with a local 0.1 uF ceramic capacitor to V-.
8 NC unconnected No internal connection. Leave floating or tie to ground for best PCB practice.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HGV8541MM5
  • HGV8541MM7
  • HGV8541MM
  • HGV8541MMM
  • HGV8541MDQ3

CAD (KiCad official)

  • Symbol: HGV8541M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hgv8541m-etched.step / hgv8541m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgv8541m.step / hgv8541m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (23 pp, sha256 eef28e61ba02a7d3, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF