# HGV8332M

**HGSEMI** · Operational Amplifier · SOP-8

HGV8332M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTA | output | Amplifier A output, rail-to-rail swing. |
| 2 | INA- | input | Amplifier A inverting input; common-mode range extends to VSS-0.1V to VDD+0.1V. |
| 3 | INA+ | input | Amplifier A non-inverting input; common-mode range extends to VSS-0.1V to VDD+0.1V. |
| 4 | VSS | power_in | Negative supply or ground; for dual-supply operation bypass with a 0.1µF ceramic capacitor. |
| 5 | INB+ | input | Amplifier B non-inverting input; common-mode range extends to VSS-0.1V to VDD+0.1V. |
| 6 | INB- | input | Amplifier B inverting input; common-mode range extends to VSS-0.1V to VDD+0.1V. |
| 7 | OUTB | output | Amplifier B output, rail-to-rail swing. |
| 8 | VDD | power_in | Positive supply, 1.8V to 5.5V single supply; place a 0.1µF ceramic bypass capacitor close to this pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage | VOS |  | 2 | 10 | µV |  | 4 |
| Power Supply Voltage (VDD to Vss) | VDD | -0.5 |  | 7.5 | V |  | 3 |
| PDB Input Voltage |  |  |  | 7 | V |  | 3 |
| Operating Temperature Range |  | -45 |  | 125 | °C |  | 3 |
| Storage Temperature Range |  | -55 |  | 150 | °C |  | 3 |
| Junction Temperature |  |  |  | 160 | °C |  | 3 |
| Lead Temperature (soldering) |  |  |  | 245 | °C | soldering, 10 sec | 3 |
| ESD Susceptibility HBM |  |  |  | 6 | KV | HBM | 3 |
| ESD Susceptibility MM |  |  |  | 400 | V | MM | 3 |
| Single-Supply Operating Voltage |  | 1.8 |  | 5.5 | V | single supply | 1 |
| Package Thermal Resistance, junction-to-ambient (SOP-8) | θJA |  | 125 |  | °C/W | TA=+25℃ | 3 |

## CAD (KiCad official)

- Symbol: `HGV8332M`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `hgv8332m-etched.step` / `hgv8332m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hgv8332m.step` / `hgv8332m.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603058289555365888) (14 pp, sha256 `5955e531301eee19`, retrieved 2026-10-20, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hgv8332m-datasheet.pdf)