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HGOP07DN

HGSEMI · Operational Amplifier · DIP-8

HGOP07DN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOS TRIM passive Offset null (Offset Null 1) pin for input offset voltage adjustment, connected through a 20kΩ potentiometer whose wiper goes to Vcc+.
2 -IN input Inverting input; input voltage range ±13V typical with absolute maximum input voltage ±18V.
3 +IN input Non-inverting input; input voltage range ±13V typical with absolute maximum input voltage ±18V.
4 V- power_in Negative supply (Vcc-); supply range ±3V to ±18V.
5 NC unconnected No connect; not internally connected.
6 OUT output Amplifier output; peak swing ±12V into 10kΩ and ±11.5V into 2kΩ.
7 V+ power_in Positive supply (Vcc+); supply range ±3V to ±18V, absolute maximum ±18V.
8 VOS TRIM passive Offset null (Offset Null 2) pin for input offset voltage adjustment, connected through a 20kΩ potentiometer whose wiper goes to Vcc+.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input offset voltage (HGOP07D) Vio 60 150 uV Vcc=±15V, Tamb=25℃ (table header) 3
Input offset voltage temperature drift DVio 1.8 uV/℃ 3
Input offset current Iio 8 nA 3
Input bias current Iib 28 nA 3
Input common-mode voltage range Vicm -13 13 13.5 V 0℃<Tamb<70℃ 3
Common-mode rejection ratio CMR 100 dB 3
Supply voltage rejection ratio SVR 90 dB 3
Large signal voltage gain Avd 100 V/mV VCC=±15V, RL=2kΩ, VO=±10V 3
Output peak voltage Vopp -12 12 V RL=10kΩ 3
Output peak voltage Vopp -11.5 11.5 V RL=2kΩ 3
Gain bandwidth product GBP 0.5 MHz RL=2kΩ, CL=100pF, f=100KHz 3
Supply voltage Vcc -18 18 V 3
Input voltage Vi -18 18 V 3
Differential input voltage Vid -30 30 V 3
Operating temperature TOPR 0 70 ℃ 3
Storage temperature TSTG -40 150 ℃ 3
Lead temperature (soldering 10s) TLEAD 245 ℃ 10s soldering 3
Supply voltage range 3 18 V Printed as ±3V to ±18V (features summary) 1

CAD (KiCad official)

  • Symbol: HGOP07DN
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: hgop07dn-etched.step / hgop07dn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgop07dn.step / hgop07dn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (8 pp, sha256 17f3df12784e3b9f, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF