# HGD032N04A

**CRMICRO** · MOSFETs · TO-252

HGD032N04A from CRMICRO, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-to-source voltage rated ±18 V, with threshold VGS(TH) of 1.0 V min to 2.5 V max at ID = 250µA. |
| 2 | D | passive | Drain; VDSS 40 V, continuous drain current 145 A silicon limited and 60 A package limited at TC = 25 °C, pulsed 240 A. |
| 3 | S | passive | Source; continuous body-diode source current 60 A at TC = 25 °C, pulsed 240 A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | CRMICRO |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain to Source Breakdown Voltage | VDSS | 40 |  |  | V | VGS=0V, ID=250µA | 2 |
| Drain to Source Leakage Current | IDSS |  |  | 1 | µA | VDS =40V, VGS= 0V, Tj = 25℃ | 2 |
| Drain to Source Leakage Current | IDSS |  |  | 100 | µA | VDS =32V, VGS= 0V, Tj = 125℃ | 2 |
| Gate to Source Forward Leakage | IGSS(F) |  |  | 100 | nA | VGS=18V | 2 |
| Gate to Source Reverse Leakage | IGSS(R) |  |  | -100 | nA | VGS =-18V | 2 |
| Drain-to-Source On-Resistance | RDS(ON) |  | 2.5 | 3.2 | mΩ | VGS=10V,ID=30A | 2 |
| Drain-to-Source On-Resistance | RDS(ON) |  | 3.3 | 4.1 | mΩ | VGS=4.5V,ID=25A | 2 |
| Gate Threshold Voltage | VGS(TH) | 1 |  | 2.5 | V | VDS = VGS, ID = 250µA | 2 |
| Continuous Source Current (Body Diode) | IS |  |  | 60 | A | TC = 25 °C | 3 |
| Maximum Pulsed Current (Body Diode) | ISM |  |  | 240 | A |  | 3 |
| Diode Forward Voltage | VSD |  |  | 1.2 | V | IS=30A,VGS=0V | 3 |
| Drain-to-Source Voltage | VDSS |  |  | 40 | V |  | 1 |
| Continuous Drain Current | ID |  |  | 145 | A | TC = 25 °C | 1 |
| Continuous Drain Current (Package Limited) | ID |  |  | 60 | A | TC = 25 °C, package limited | 1 |
| Continuous Drain Current | ID |  |  | 60 | A | TC = 100 °C | 1 |
| Pulsed Drain Current | IDM |  |  | 240 | A | TC = 25 °C, repetitive rating; pulse width limited by maximum junction temperature | 1 |
| Gate-to-Source Voltage | VGS | -18 |  | 18 | V |  | 1 |
| Avalanche Energy | EAS |  |  | 336 | mJ | L=0.5mH,VDD=20V,Ias=36.7A Start TJ=25℃ | 1 |
| Power Dissipation | PD |  |  | 96 | W | TC = 25 °C | 1 |
| Operating Junction Temperature | TJ |  |  | 150 | ℃ |  | 1 |
| Storage Temperature Range | Tstg | -55 |  | 150 | ℃ |  | 1 |
| Junction-to-Case Thermal Resistance | RθJC |  |  | 1.25 | ℃/W |  | 3 |
| Junction-to-Ambient Thermal Resistance | RθJA |  |  | 62.5 | ℃/W |  | 3 |

## CAD (KiCad official)

- Symbol: `HGD032N04A`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `hgd032n04a-etched.step` / `hgd032n04a-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hgd032n04a.step` / `hgd032n04a.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [CRMICRO datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590918675334066176) (10 pp, sha256 `3ea16b0b4f76e4d8`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hgd032n04a-datasheet.pdf)