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HGA1040M

Public Made by Adom

by adom

HGSEMI CAN Transceivers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HGA1040M

HGSEMI · CAN Transceivers · SOIC-8

HGA1040M from HGSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TXD input Transmit data input: the pin has an internal pull-up to VCC so it stays recessive when unused, and if it is held low longer than the dominant timeout tdom (300 to 1000 µs) the transmitter is disabled.
2 GND power_in Ground reference for the transceiver.
3 VCC power_in Supply voltage, operating range 4.75 V to 5.25 V; absolute maximum 6 V with no time limit.
4 RXD output Receive data output that reads the bus state; it goes floating when VCC is lost to prevent reverse current into the pin.
5 SPLIT output Common-mode voltage stabilization output that regulates to 0.5 VCC in normal mode (output voltage 0.3 to 0.7 VCC for −500 µA < IO < 500 µA) and is left floating in standby mode; connect it to the centre tap of a split termination.
6 CANL bidirectional Low-level CAN bus line; dominant output voltage is 0.5 V to 1.75 V (typ. 1.4 V) with TXD low, and its absolute DC rating is −27 V to 40 V.
7 CANH bidirectional High-level CAN bus line; dominant output voltage is 3 V to 4.25 V (typ. 3.6 V) with TXD low, and its absolute DC rating is −27 V to 40 V.
8 STB input Standby mode control: a low level selects normal mode and a high level selects standby; the pin has an internal pull-up to VCC, so it enters standby when left unconnected, and VIH is 2 V to VCC+0.3 V with VIL of −0.3 V to 0.8 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOIC-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC, no time limit (absolute maximum) VCC -0.3 6 V 无时间限制 4
Supply voltage VCC, operating range VCC 4.75 5.25 V 4
CANH pin DC voltage (absolute maximum) VCANH -27 40 V 0 < VCC < 5.25 V，无时间限制 4
CANL pin DC voltage (absolute maximum) VCANL -27 40 V 0 < VCC < 5.25 V，无时间限制 4
SPLIT pin DC voltage (absolute maximum) VSPLIT -27 40 V 0 < VCC < 5.25 V，无时间限制 4
Transient voltage on CANL, CANH and SPLIT per ISO7637 (absolute maximum) VTRT -200 200 V 根据 ISO7637 4
ESD voltage, human body model, pins CANL, CANH, SPLIT (absolute maximum) VESD -6 6 kV 人体模型；引脚 CANL、CANH、SPLIT，注意 1 4
ESD voltage, human body model, other pins (absolute maximum) VESD -4 4 kV 人体模型；其他引脚，注意 1 4
ESD voltage, machine model (absolute maximum) VESD -200 200 V 机器模型，注意 2 4
Actual junction temperature (absolute maximum) TVJ -40 150 ℃ 注意 3 4
Storage temperature (absolute maximum) TSTG -55 150 ℃ 4
Pin temperature, soldering (absolute maximum) TLEAD 260 ℃ 焊接 10s 4
Supply current, standby mode ICC 5 10 15 µA 待机模式 5
Supply current, normal mode recessive ICC 2.5 5 10 mA 正常模式：隐性 VTXD = VCC 5
Supply current, normal mode dominant ICC 30 50 70 mA 正常模式：显性 VTXD = 0V 5
TXD high-level input voltage VIH 2 V 5
TXD low-level input voltage VIL -0.3 0.8 V 5
TXD high-level input current IIH -5 0 5 µA VTXD = VCC 5
TXD low-level input current IIL -100 -200 -300 µA 正常模式：VTXD = 0V 5
TXD input capacitance GI 5 10 pF 未测试 5
STB high-level input voltage VIH 2 V 5
STB low-level input voltage VIL -0.3 0.8 V 5
STB low-level input current IIL -1 -4 -10 µA VSTB = 0V 5
RXD high-level output current IOH -0.1 -0.4 -1 mA 正常模式：VRXD = VCC −0.4V 5
RXD low-level output current IOL 2 6 20 mA VRXD = 0.4V 5
SPLIT leakage current, standby mode /IL/ 0 5 µA 待机模式：−22V＜VSPLIT＜35V 5
CANH dominant output voltage V(CANH)(dom) 3 3.6 4.25 V VTXD = 0V 5
CANL dominant output voltage V(CANL)(dom) 0.5 1.4 1.75 V VTXD = 0V 5
Dominant output voltage matching VO(Dom)(m) -100 0 150 mV 6
Differential bus output voltage, dominant VO(dif)(bus) 1.5 3 V VTXD = 0V；显性；45Ω＜RL＜65Ω 6
Differential bus output voltage, recessive VO(dif)(bus) -50 50 mV VTXD = VCC；隐性；空载 6
CANL recessive output voltage, normal mode V(CANL)(reces) 2 3 V 正常模式：VTXD = VCC；无负载 6
CANL recessive output voltage, standby mode V(CANL)(reces) -0.1 0 0.1 V 待机模式；无负载 6
CANH short-circuit output current IO(CANH)(sc) -40 -70 -95 mA VTXD = 0V； VCANH = 0V 6
CANL short-circuit output current IO(CANL)(sc) 40 70 100 mA VTXD = 0V； VCANL = 40V 6
CANL recessive output current IO(CANL)(reces) -2.5 2.5 mA −27V＜VCAN＜32V 6
Differential receiver threshold voltage, normal mode Vdif(th) 0.5 0.7 0.9 V 正常模式：−12V＜VCANH＜12V；−12V＜VCANL＜12V 6
Differential receiver threshold voltage, standby mode Vdif(th) 0.5 0.7 1.15 V 待机模式：−12V＜VCANH＜12V；−12V＜VCANL＜12V 6
Differential receiver hysteresis voltage Vdif(hys) 50 70 100 mV 正常模式：−12V＜VCANH＜12V；−12V＜VCANL＜12V 6
Input leakage current ILI -5 0 5 µA VCC = 0V；VCANH = VCANL= 5V 6
Common-mode input resistance Ri(cm) 15 25 35 kΩ 正常/待机模式 6
Common-mode input resistance matching Ri(cm)(m) -3 0 3 % VCANH = VCANL 6
Differential input resistance Ri(dif) 25 50 75 kΩ 正常/待机模式 6
Common-mode input capacitance Ci(cm) 20 pF VTXD = VCC；未测试 6
Differential input capacitance Ci(dif) 10 pF VTXD = VCC；未测试 6
TXD to bus active propagation delay td(TXD-BUSon) 25 70 110 ns 正常模式 6
TXD to bus inactive propagation delay td(TXD-BUSoff) 10 50 95 ns 6
Bus active to RXD propagation delay td(BUSon-RXD) 15 65 115 ns 6
Bus inactive to RXD propagation delay td(BUSoff-RXD) 35 100 160 ns 6
TXD to RXD propagation delay tPD(TXD-RXD) 40 255 ns VSTB = 0V 7
TXD dominant timeout time tdom(TXD) 300 600 1000 µs VTXD = 0V 7
Dominant time for wake-up via bus, standby mode tBUS 0.75 1.75 5 µs 待机模式 7
Standby to normal mode delay td(stb-norm) 5 7.5 10 µs 正常模式 7
Thermal shutdown junction temperature Tj(sd) 155 165 180 ℃ 7
STB high-level input current IIH 0 µA VSTB = VCC 5

CAD (KiCad official)

  • Symbol: HGA1040M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: hga1040m-etched.step / hga1040m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hga1040m.step / hga1040m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (12 pp, sha256 ce551fd1da6d9ae3, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF