component

HG9200AM

Public Made by Adom

by adom

HGSEMI Audio Interface ICs, SOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

markdown

HG9200AM

HGSEMI · Audio Interface ICs · SOP-8

HG9200AM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CE input Chip enable, active low. CMOS input with internal pull-high resistor. When CE is pulled low, the oscillator starts and the DTMF signal is transmitted from the DTMF pin.
2 X2 output Oscillator output. Together with X1 forms the 3.579545 MHz crystal oscillator using an on-chip inverter, bias resistor, and load capacitance.
3 X1 input Oscillator input. Connect a standard 3.579545 MHz crystal between X1 and X2 to implement the system clock. Internal ~10 MΩ feedback bias resistor and integrated load capacitors (~20 pF / ~10 pF).
4 VSS power_in Negative power supply / ground reference. Tie to system ground (0 V).
5 CLK input Data synchronous clock input for serial mode. CMOS input with internal pull-high resistor. Serial data on DATA is latched on the falling edge of CLK. Max clock rate 500 kHz (typ 100 kHz).
6 DATA input Serial data input. CMOS input with internal pull-high resistor. Each DTMF digit is selected by a 5-bit serial code (D0 = LSB, D4 = MSB) clocked in on CLK falling edges.
7 DTMF output DTMF signal output. CMOS analog output; typical AC level 0.15 Vrms into 5 kΩ load. DC level 0.45·VDD to 0.75·VDD. Drives external audio/telephone line interface.
8 VDD power_in Positive power supply. Operating range 2.0 V to 5.5 V. Absolute maximum 6 V. Typical operating current 240 µA at 2.5 V, 950 µA at 5.0 V; standby current ≤2 µA.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HG9200AMM/TR
  • HG9200AMM
  • HG9200AMN
  • HG9200AMBM/TR

CAD (KiCad official)

  • Symbol: HG9200AM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg9200am-etched.step / hg9200am-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg9200am.step / hg9200am.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (12 pp, sha256 e155baa26afbb02c, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF