# HG809TM3

**HGSEMI** · Supervisor And Reset ICs · SOT-23-3

HG809TM3 from HGSEMI, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Chip ground terminal; the datasheet gives no voltage limit for this pin. |
| 2 | RESET | output | Reset output (VRESET); with VCC=Vthmin and ISINK=1.2mA, VOL is at most 0.3V, and with VCC>Vthmax and ISOURCE=500uA, VOH is at least 0.8VCC. |
| 3 | VCC | power_in | Chip supply input, operating range 1.0V to 6.0V, with an absolute maximum of 6.5V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOT-23-3 |
| Category | Power Management (PMIC) |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating voltage (VCC) | VCC | 1 |  | 6 | V |  | 2 |
| Power-up reset time (R/S/T variant) | Trp | 80 |  | 350 | ms | VCC=0to3.5V，空载 | 3 |
| Reset voltage temperature coefficient | ΔVth/(Vth*ΔTa) | -150 |  | 150 | ppm/℃ | -40℃≤Ta≤85℃ | 3 |
| Reset output low voltage | VOL |  |  | 0.3 | V | VCC=Vthmin，ISINK=1.2mA | 3 |
| Reset output high voltage | VOH | 0.8 |  |  | V | VCC>Vthmax，ISOURCE=500uA; printed limit is 0.8VCC | 3 |
| Input voltage (VCC) absolute maximum | VCC |  |  | 6.5 | V |  | 3 |
| Reset output voltage (VRESET) | VRESET | -0.3 |  |  | V | printed range -0.3 to VCC+0.3 | 3 |
| Power dissipation | PD |  |  | 200 | mW | SOT-23 | 3 |
| Operating temperature range | Tw | -40 |  | 85 | ℃ |  | 3 |
| Storage temperature range | Tc | -55 |  | 125 | ℃ |  | 3 |
| Operating junction temperature range | Tj | -40 |  | 85 | ℃ |  | 3 |
| Soldering temperature | Th |  |  | 260 | ℃ | 10s | 3 |

## CAD (KiCad official)

- Symbol: `HG809TM3`
- Footprint: `Package_TO_SOT_SMD:SOT-23-3`
- 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files: `hg809tm3-etched.step` / `hg809tm3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hg809tm3.step` / `hg809tm3.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757917781314949120) (6 pp, sha256 `4dd29334cac9e274`, retrieved 2026-10-19, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hg809tm3-datasheet.pdf)