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HG809SM3

Public Made by Adom

by adom

HGSEMI Supervisor And Reset ICs, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HG809SM3

HGSEMI · Supervisor And Reset ICs · SOT-23-3

HG809SM3 from HGSEMI, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Chip ground pin.
2 RESET output Reset output: VOL is at most 0.3 V at ISINK = 1.2 mA when VCC = Vthmin, and VOH is at least 0.8×VCC at ISOURCE = 500 µA when VCC > Vthmax; the absolute range is -0.3 V to VCC+0.3 V.
3 VCC power_in Chip supply input; operating range is 1.0 V to 6.0 V, and the absolute maximum input voltage is 6.5 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating voltage VCC 1 6 V 3
Reset voltage (multiplier of nominal Vth(E); nominal 2.93 V for HG809SM3) Vth（1） 0.975 1.025 x Vth(E) VCC=Vth+0.5V to Vth，空载，VRESET =VCC to GND 3
Power-on reset time (R/S/T group, applies to S variant) Trp 80 350 ms VCC=0to3.5V，空载 3
Reset output low voltage VOL 0.3 V VCC=Vthmin，ISINK=1.2mA 3
Reset output high voltage (multiplier of VCC) VOH 0.8 x VCC VCC>Vthmax，ISOURCE=500uA 3
Temperature coefficient (printed ±150 ppm/℃) ΔVth/(Vth*ΔTa) -150 150 ppm/℃ -40℃≤Ta≤85℃ 3
Input voltage (absolute maximum) VCC 6.5 V 3
Reset output voltage (lower limit; upper limit printed as VCC+0.3 V) VRESET -0.3 V 3
Power dissipation, SOT-23 PD 200 mW 3
Operating temperature range Tw -40 85 ℃ 3
Storage temperature range Tc -55 125 ℃ 3
Operating junction temperature range Tj -40 85 ℃ 3
Soldering temperature Th 260 ℃ 10s 3

CAD (KiCad official)

  • Symbol: HG809SM3
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: hg809sm3-etched.step / hg809sm3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg809sm3.step / hg809sm3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (6 pp, sha256 4dd29334cac9e274, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF