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HG7550M3-1
Public Made by Adomby adom
HGSEMI Linear Voltage Regulators (LDO), SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHG7550M3-1
HGSEMI · Linear Voltage Regulators (LDO) · SOT-23-3
HG7550M3-1 from HGSEMI, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the regulator. |
| 2 | VIN | power_in | Input supply pin, maximum input voltage 36V; a 10uF polarized capacitor close to the pin is recommended. |
| 3 | VOUT | power_out | Regulated 5.0V output (±2%) pin with up to 100mA output current; requires an output capacitor larger than 2.2uF to ground (10uF recommended). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOT-23-3 |
| Category | Power Supply Chip |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output voltage | VOUT | 4.9 | 5 | 5.1 | V | VIN=VOUT+2V, IOUT=10mA, Ta=25℃ | 6 |
| Output current | IOUT | 100 | 150 | mA | VIN=VOUT+2V, Ta=25℃ | 6 | |
| Load regulation | △VOUT | 25 | 60 | mV | VIN=VOUT+2V, 1mA≤IOUT≤50mA | 6 | |
| Dropout voltage | VDIF | 2 | 4 | mV | IOUT=1mA, △Vo=2% | 6 | |
| Quiescent current | ISS | 2 | 3 | uA | No load | 6 | |
| Input voltage regulation | 0.2 | %/V | Vo+1V≤VIN≤36V, IOUT=1mA | 6 | |||
| Input voltage | VIN | 36 | V | 6 | |||
| Output voltage temperature coefficient | 100 | ppm/℃ | IOUT=10mA, -40℃<Ta<85℃ | 6 | |||
| Supply voltage | VDD | -0.3 | 36 | V | 3 | ||
| Operating ambient temperature | TA | -40 | 85 | ℃ | 3 | ||
| Storage temperature range | TSTG | -45 | 140 | ℃ | 3 | ||
| Lead temperature | TL | 260 | ℃ | soldering 10s | 3 | ||
| Thermal resistance junction to ambient | θJA | 500 | ℃/W | SOT-23-3, no airflow, no heatsink | 3 | ||
| Power dissipation | PD | 0.2 | W | SOT-23-3, Ta=25℃ | 3 |
CAD (KiCad official)
- Symbol:
HG7550M3-1 - Footprint:
Package_TO_SOT_SMD:SOT-23-3 - 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files:
hg7550m3-1-etched.step/hg7550m3-1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hg7550m3-1.step/hg7550m3-1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (11 pp, sha256
d0f82a12b2f9cc7a, retrieved 2026-10-22, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).