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HG7533MK-1

HGSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89-3

HG7533MK-1 from HGSEMI, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin for the regulator; the datasheet gives no additional limits for this pin.
2 VIN power_in Input supply pin with an absolute maximum rating of -0.3V to +36V, and the specified output requires VIN of at least VOUT+2V under test conditions.
3 VOUT power_out Regulated 3.3V output (HG7533-1) rated for 100mA typical (70mA minimum at VIN=VOUT+2V), and the datasheet requires an output-to-ground capacitor greater than 2.2uF.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOT-89-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage (VIN) VIN 36 V 3
Output voltage (7533-1, +3.3V) VOUT 3.234 3.3 3.366 V Ta=25℃, VIN=VOUT+2V, IOUT=10mA 3
Output current IOUT 70 100 mA VIN=VOUT+2V 3
Load regulation △VOUT 25 60 mV VIN=VOUT+2V, 1mA ≤IOUT≤50mA 3
Dropout voltage VDIF 2 4 mV IOUT=1mA, △Vo=2% 3
Quiescent current (no load) ISS 2 3 uA No load 3
Input voltage regulation (line regulation) 0.2 %/V Vo+1V≤VIN≤36V, IOUT=1mA 3
Supply voltage (absolute maximum) -0.3 36 V 2
Operating ambient temperature -40 85 ℃ 2
Storage temperature range -45 140 ℃ 2
Thermal resistance junction-to-ambient, SOT89 θJA 200 ℃/W SOT89; no ambient airflow, no heatsink 2
Power dissipation, SOT89 PD 0.5 W SOT89; Ta=25℃ 2
Output capacitor to GND 2.2 uF Output to GND, usage notes (phase compensation uses ESR) 5
Input and output polarized capacitor (recommended) 10 uF Recommended; placed close to VIN and VOUT pins 5
Temperature coefficient 100 ppm/℃ IOUT=10mA, -40℃<Ta<85℃ 3

CAD (KiCad official)

  • Symbol: HG7533MK-1
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: hg7533mk-1-etched.step / hg7533mk-1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg7533mk-1.step / hg7533mk-1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (8 pp, sha256 e17aedb4156facfc, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF