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HG7530MK-1

HGSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89

HG7530MK-1 from HGSEMI, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin (地) of the LDO, serving as the common return for the input and output.
2 VIN power_in Input pin; the datasheet rates the supply voltage from -0.3V to +36V and requires VIN of at least VOUT+2V for the stated test conditions.
3 VOUT power_out Regulated output pin; the 7530-1 version gives 3.0V nominal with up to 100mA output current, and an output capacitor greater than 2.2uF to ground is required.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOT-89
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
输出电压 (output voltage, 7530-1 +3.0V) VOUT 2.94 3 3.06 V VIN=VOUT+2V IOUT=10mA 3
输出电流 (output current) IOUT 70 100 mA VIN=VOUT+2V 3
负载调节率 (load regulation) △VOUT 25 60 mV VIN=VOUT+2V 1mA ≤IOUT≤50mA 3
Dropout 电压 (dropout voltage) VDIF 2 4 mV IOUT=1mA, △Vo=2% 3
静态电流 (quiescent current) ISS 2 3 uA 无负载 3
输入电压调节率 (input voltage regulation) 0.2 %/V Vo+1V≤VIN≤36V IOUT=1mA 3
输入电压 (input voltage) VIN 36 V 3
电源供应电压 (supply voltage, absolute maximum) -0.3 36 V 2
储存温度范围 (storage temperature) -45 140 ℃ 2
工作环境温度 (operating ambient temperature) -40 85 ℃ 2
输出电容 (output capacitor to GND) 2.2 uF 输出到地 ESR compensation; 注: 大于2.2uF 6
功耗 (power dissipation, SOT89 package) PD 0.5 W SOT89 package, stated in application note example 6
温度系数 (temperature coefficient of VOUT) 100 ppm/℃ IOUT=10mA -40℃<Ta<85℃ 3

CAD (KiCad official)

  • Symbol: HG7530MK-1
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89 (KiCad packages3D, STEP)
  • 3D model files: hg7530mk-1-etched.step / hg7530mk-1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg7530mk-1.step / hg7530mk-1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (9 pp, sha256 01d3c233b2403b00, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF