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HG741N

HGSEMI · Operational Amplifier · DIP-8

HG741N from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OFFSET NULL passive Offset null terminal, connected with a 10 kΩ potentiometer whose wiper goes to V- to trim the input offset voltage (adjustment range ±15 mV typ at VS=±20V).
2 INVERTING INPUT input Inverting input of the op amp, with differential input voltage limited to ±30V and input voltage to ±15V (not exceeding the supply voltage when supplies are below ±15V).
3 NON-INVERTING INPUT input Non-inverting input of the op amp, with differential input voltage limited to ±30V and input voltage to ±15V (not exceeding the supply voltage when supplies are below ±15V).
4 V- power_in Negative supply pin, with the supply voltage limited to ±22V absolute maximum.
5 OFFSET NULL passive Offset null terminal, connected with a 10 kΩ potentiometer whose wiper goes to V- to trim the input offset voltage (adjustment range ±15 mV typ at VS=±20V).
6 OUTPUT output Op amp output with continuous short-circuit protection and typical short-circuit current of 25 mA at TA=25°C.
7 V+ power_in Positive supply pin, with the supply voltage limited to ±22V absolute maximum.
8 NC unconnected No internal connection.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Operational Amplifier/Comparator
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage -22 22 V 3
Power Dissipation 500 mW Note 2 3
Differential Input Voltage -30 30 V 3
Input Voltage -15 15 V Note 3 3
Operating Temperature Range 0 70 ˚C 3
Junction Temperature 150 ˚C 3
Soldering Information 260 ˚C 10 seconds 3
Storage Temperature Range -65 150 ˚C 3
ESD Tolerance 400 V Note 7 3
Junction to Ambient Thermal Resistance (DIP(B)) θjA 100 ˚C/W DIP(B) package, junction to ambient 5

CAD (KiCad official)

  • Symbol: HG741N
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: hg741n-etched.step / hg741n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg741n.step / hg741n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (9 pp, sha256 1f62f769ec73d28f, retrieved 2026-11-04, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF