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HG741CM

Public Made by Adom

by adom

HGSEMI Operational Amplifier, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HG741CM

HGSEMI · Operational Amplifier · SOP-8

HG741CM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OFFSET NULL passive Offset null terminal, connected with pin 5 through a 10 kΩ potentiometer whose wiper goes to V- for offset nulling.
2 INVERTING INPUT input Inverting input; differential input voltage up to ±30V and input voltage ±15V absolute maximum.
3 NON-INVERTING INPUT input Non-inverting input; differential input voltage up to ±30V and input voltage ±15V absolute maximum.
4 V- power_in Negative supply voltage (ground in single-supply use); supply voltage rated up to ±22V, and the wiper of the offset-null potentiometer connects here.
5 OFFSET NULL passive Offset null terminal, connected with pin 1 through a 10 kΩ potentiometer whose wiper goes to V- for offset nulling.
6 OUTPUT output Amplifier output with overload protection and continuous short-circuit duration; short-circuit current typically 25 mA at 25°C.
7 V+ power_in Positive supply voltage; supply voltage rated up to ±22V.
8 NC unconnected No internal connection.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage -22 22 V Printed as ±22V 3
Differential Input Voltage -30 30 V Printed as ±30V 3
Input Voltage -15 15 V Printed as ±15V; Note 3: for supplies below ±15V the limit equals the supply voltage 3
Power Dissipation 500 mW Note 2: derate using θjA and Tj max 3
Junction Temperature 100 ˚C HG741 (non-A variant) 3
Operating Temperature Range 0 70 ˚C 3
Storage Temperature Range -65 150 ˚C 3
ESD Tolerance 400 V Note 7 (as printed) 3
Soldering Temperature, M-Package Vapor Phase 215 ˚C M-Package Vapor Phase, 60 seconds 3
Soldering Temperature, M-Package Infrared 215 ˚C M-Package Infrared, 15 seconds 3
Input Offset Voltage 2 6 mW TA=25˚C, RS≤10KΩ (HG741 column) 3
Input Offset Voltage 0.8 3 mW TA=25˚C, RS≤50Ω (HG741 column) 3
Input Offset Current 20 200 nA TA=25˚C 3
Input Offset Current 300 nA TAMIN≤TA≤TAMAX 3
Input Bias Current 80 500 nA TA=25˚C 3
Output Short Circuit Current 25 mA TA=25˚C 4
Supply Current 1.7 2.8 mA TA=25˚C 4
Slew Rate 0.5 V/µs TA=25˚C, Unity Gain 4
Junction to Ambient Thermal Resistance (SOP-8(M)) θjA 195 ˚C/W SOP-8(M) package, junction to ambient 4

CAD (KiCad official)

  • Symbol: HG741CM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg741cm-etched.step / hg741cm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg741cm.step / hg741cm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (7 pp, sha256 2e9b73dccf83701f, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF