HG487EIN

HGSEMI · RS-485 / RS-422 ICs · DIP-8

HG487EIN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output: with RE low, RO goes high when A - B is at least +200 mV and goes low when A - B is at most -200 mV.
2	RE	input	Receiver output enable: RO is active when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure.
3	DE	input	Driver output enable: the driver outputs are active when DE is high and high-impedance when DE is low; DE high with RE low... see shutdown note, and DE has a hot-plug input structure.
4	DI	input	Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5	GND	power_in	Ground.
6	A	bidirectional	Non-inverting bus terminal A, acting as the receiver non-inverting input and driver non-inverting output as used in the A - B receiver function and the driver outputs.
7	B	bidirectional	Inverting bus terminal B, acting as the receiver inverting input and driver inverting output.
8	VCC	power_in	Positive supply, 4.5 V to 5.5 V; bypass with a 0.1 µF capacitor to ground.

Key specifications

Parameter	Value
Manufacturer	HGSEMI
Package	DIP-8
Category	Interface
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage	VCC	4.5		5.5	V		5
Operating temperature range (industrial grade)		-40		85	°C	HG48_I	4
Supply voltage (absolute maximum)	VCC			6	V		4
Control input voltage		-0.3		6	V	RE, DE	4
Driver input voltage		-0.3		6	V	DI	4
Driver output voltage		-7		12	V	A, B, Y, Z	4
Receiver input voltage		-7		12	V	A, B	4
Receiver output voltage		-0.3			V	RO; printed upper limit is (VCC+0.3)	4
Continuous power dissipation, 8-pin plastic DIP				725	mW	TA=+70°C	4
Storage temperature		-65		150	°C		4
Differential driver output voltage	VOD	2.7			V	Fig.1, RL=100Ω (RS-422)	5
Differential driver output voltage	VOD	2.1			V	Fig.1, RL=54Ω (RS-485)	5
Change in magnitude of differential output voltage	ΔVOD			0.2	V	Fig.1, RL=100Ω or RL=54Ω	5
Driver common-mode output voltage	VOC			3	V	Fig.1, RL=100Ω or RL=54Ω	5
Input high voltage	VIH	2			V	DE, DI, RE	5
Input low voltage	VIL			0.8	V	DE, DI	5
Input current	IIN	-1		1	μA	DE, DI, RE	5
Input current (A, B), full duplex	IA, IB			125	μA	DE=GND, VCC=GND or VCC, VIN=12V	5
Input current (A, B), full duplex	IA, IB	-75			μA	DE=GND, VCC=GND or VCC, VIN=-7V	5
Output leakage current (Y, Z), full duplex	IO			125	μA	DE=GND, VCC=GND or VCC, VIN=12V	5
Output leakage current (Y, Z), full duplex	IO	-100			μA	DE=GND, VCC=GND or VCC, VIN=-7V	5
Driver short-circuit output current	IOSD			250	mA	0≤VOUT≤12V	5
Driver short-circuit output current	IOSD	-250			mA	-7≤VOUT≤VCC	5
Driver short-circuit foldback output current	IOSDF			20	mA	VCC-1V≤VOUT≤VCC+0.5V	5
Driver short-circuit foldback output current	IOSDF	-20			mA	-0.5V≤VOUT≤+1V	5
Receiver differential threshold voltage	VTH	-200		200	mV	-7V≤VCM≤12V	5
Receiver output low voltage	VOL			0.4	V	IO=4mA, VID=-200mV	5
Receiver tri-state output current	IOZR	-1		1	μA	0≤VO≤VCC	5
Receiver output short-circuit current	IOSR		7	95	mA	0V≤VRO≤VCC; printed ±7 (typ) and ±95 (max)	5
Supply current	Icc		530	900	μA	No load, RE=VCC, DI=GND or VCC, DE=VCC	6
Supply current	Icc		475	600	μA	No load, RE=VCC, DI=GND or VCC, DE=GND	6
Supply current	Icc		530	1000	μA	No load, RE=GND, DI=GND or VCC, DE=VCC	6
Supply current	Icc		475	800	μA	No load, RE=GND, DI=GND or VCC, DE=GND	6
Standby mode supply current	ISHDN		0.05	10	μA	DE=GND, RE=VCC	6
ESD protection, IEC61000-4-2 air-gap discharge (A, B, Y, Z)		-16		16	kV	IEC61000-4-2 air-gap; printed ±16	6
ESD protection, IEC61000-4-2 contact discharge (A, B, Y, Z)		-8		8	kV	IEC61000-4-2 contact; printed ±8	6
ESD protection, human body model (all pins)		-4		4	kV	HBM; printed ±4	6
Driver propagation delay	tDPLH, tDPHL	200		1000	ns	Fig.2 and 5, RL=54Ω, CL=50pF	8
Driver output skew /tDPLH - tDPHL/	tDSKEW	-140		140	ns	Fig.2 and 5, RL=54Ω, CL=50pF; printed ±140	8
Driver rise and fall time	tDR, tDF	250		900	ns	Fig.2 and 5, RL=54Ω, CL=50pF	8
Driver enable to output high	tDZH			2500	ns	Fig.3 and 6, CL=100pF, S3 closed	8
Driver enable to output low	tDZL			2500	ns	Fig.3 and 6, CL=100pF, S2 closed	8
Driver disable time from low	tDLZ			100	ns	Fig.3 and 6, CL=15pF, S2 closed	8
Driver disable time from high	tDHZ			100	ns	Fig.3 and 6, CL=15pF, S3 closed	8
Driver enable from standby to output high	tDZH(SHDN)			5500	ns	Fig.3 and 6, CL=15pF, S3 closed	8
Driver enable from standby to output low	tDZL(SHDN)			5500	ns	Fig.3 and 6, CL=15pF, S2 closed	8
Standby time (driver)	tSHDN	50		700	ns		8
Maximum data rate (driver)	fMAX			500	kbps		8
Receiver propagation delay	tRPLH, tRPHL			200	ns	Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns	8
Receiver output skew /tRPLH - tRPHL/	tRSKEW	-30		30	ns	Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns; printed ±30	8
Receiver enable to output low	tRZL			50	ns	Fig.4 and 9, S1=-1.5V, S2 to VCC	8
Receiver enable to output high	tRZH			50	ns	Fig.4 and 9, S1=+1.5V, S2 to GND	8
Receiver disable time from low	tRLZ			50	ns	Fig.4 and 9, S1=-1.5V, S2 to VCC	8
Receiver disable time from high	tRHZ			50	ns	Fig.4 and 9, S1=+1.5V, S2 to GND	8
Receiver enable from standby to output high	tRZH(SHDN)			5500	ns	Fig.4 and 9, S1=-1.5V, S2 to VCC	8
Receiver enable from standby to output low	tRZL(SHDN)			5500	ns	Fig.4 and 9, S1=+1.5V, S2 to GND	8
Standby time (receiver)	tSHDN	50		700	ns		8
Thermal shutdown temperature	TTS		165		°C		5
Thermal shutdown hysteresis	TTSH		15		°C		5
Receiver input impedance	RIN		96		kΩ	-7V≤VCM≤12V	5

CAD (KiCad official)

Symbol: HG487EIN
Footprint: Package_DIP:DIP-8_W7.62mm
3D model: DIP-8 (KiCad packages3D, STEP)
3D model files: hg487ein-etched.step / hg487ein-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg487ein.step / hg487ein.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: HGSEMI datasheet (24 pp, sha256 875b683720653634, retrieved 2026-10-16, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

# HG487EIN

**HGSEMI** · RS-485 / RS-422 ICs · DIP-8

HG487EIN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output: with RE low, RO goes high when A - B is at least +200 mV and goes low when A - B is at most -200 mV. |
| 2 | RE | input | Receiver output enable: RO is active when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure. |
| 3 | DE | input | Driver output enable: the driver outputs are active when DE is high and high-impedance when DE is low; DE high with RE low... see shutdown note, and DE has a hot-plug input structure. |
| 4 | DI | input | Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low. |
| 5 | GND | power_in | Ground. |
| 6 | A | bidirectional | Non-inverting bus terminal A, acting as the receiver non-inverting input and driver non-inverting output as used in the A - B receiver function and the driver outputs. |
| 7 | B | bidirectional | Inverting bus terminal B, acting as the receiver inverting input and driver inverting output. |
| 8 | VCC | power_in | Positive supply, 4.5 V to 5.5 V; bypass with a 0.1 µF capacitor to ground. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-8 |
| Category | Interface |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 4.5 |  | 5.5 | V |  | 5 |
| Operating temperature range (industrial grade) |  | -40 |  | 85 | °C | HG48_I | 4 |
| Supply voltage (absolute maximum) | VCC |  |  | 6 | V |  | 4 |
| Control input voltage |  | -0.3 |  | 6 | V | RE, DE | 4 |
| Driver input voltage |  | -0.3 |  | 6 | V | DI | 4 |
| Driver output voltage |  | -7 |  | 12 | V | A, B, Y, Z | 4 |
| Receiver input voltage |  | -7 |  | 12 | V | A, B | 4 |
| Receiver output voltage |  | -0.3 |  |  | V | RO; printed upper limit is (VCC+0.3) | 4 |
| Continuous power dissipation, 8-pin plastic DIP |  |  |  | 725 | mW | TA=+70°C | 4 |
| Storage temperature |  | -65 |  | 150 | °C |  | 4 |
| Differential driver output voltage | VOD | 2.7 |  |  | V | Fig.1, RL=100Ω (RS-422) | 5 |
| Differential driver output voltage | VOD | 2.1 |  |  | V | Fig.1, RL=54Ω (RS-485) | 5 |
| Change in magnitude of differential output voltage | ΔVOD |  |  | 0.2 | V | Fig.1, RL=100Ω or RL=54Ω | 5 |
| Driver common-mode output voltage | VOC |  |  | 3 | V | Fig.1, RL=100Ω or RL=54Ω | 5 |
| Input high voltage | VIH | 2 |  |  | V | DE, DI, RE | 5 |
| Input low voltage | VIL |  |  | 0.8 | V | DE, DI | 5 |
| Input current | IIN | -1 |  | 1 | μA | DE, DI, RE | 5 |
| Input current (A, B), full duplex | IA, IB |  |  | 125 | μA | DE=GND, VCC=GND or VCC, VIN=12V | 5 |
| Input current (A, B), full duplex | IA, IB | -75 |  |  | μA | DE=GND, VCC=GND or VCC, VIN=-7V | 5 |
| Output leakage current (Y, Z), full duplex | IO |  |  | 125 | μA | DE=GND, VCC=GND or VCC, VIN=12V | 5 |
| Output leakage current (Y, Z), full duplex | IO | -100 |  |  | μA | DE=GND, VCC=GND or VCC, VIN=-7V | 5 |
| Driver short-circuit output current | IOSD |  |  | 250 | mA | 0≤VOUT≤12V | 5 |
| Driver short-circuit output current | IOSD | -250 |  |  | mA | -7≤VOUT≤VCC | 5 |
| Driver short-circuit foldback output current | IOSDF |  |  | 20 | mA | VCC-1V≤VOUT≤VCC+0.5V | 5 |
| Driver short-circuit foldback output current | IOSDF | -20 |  |  | mA | -0.5V≤VOUT≤+1V | 5 |
| Receiver differential threshold voltage | VTH | -200 |  | 200 | mV | -7V≤VCM≤12V | 5 |
| Receiver output low voltage | VOL |  |  | 0.4 | V | IO=4mA, VID=-200mV | 5 |
| Receiver tri-state output current | IOZR | -1 |  | 1 | μA | 0≤VO≤VCC | 5 |
| Receiver output short-circuit current | IOSR |  | 7 | 95 | mA | 0V≤VRO≤VCC; printed ±7 (typ) and ±95 (max) | 5 |
| Supply current | Icc |  | 530 | 900 | μA | No load, RE=VCC, DI=GND or VCC, DE=VCC | 6 |
| Supply current | Icc |  | 475 | 600 | μA | No load, RE=VCC, DI=GND or VCC, DE=GND | 6 |
| Supply current | Icc |  | 530 | 1000 | μA | No load, RE=GND, DI=GND or VCC, DE=VCC | 6 |
| Supply current | Icc |  | 475 | 800 | μA | No load, RE=GND, DI=GND or VCC, DE=GND | 6 |
| Standby mode supply current | ISHDN |  | 0.05 | 10 | μA | DE=GND, RE=VCC | 6 |
| ESD protection, IEC61000-4-2 air-gap discharge (A, B, Y, Z) |  | -16 |  | 16 | kV | IEC61000-4-2 air-gap; printed ±16 | 6 |
| ESD protection, IEC61000-4-2 contact discharge (A, B, Y, Z) |  | -8 |  | 8 | kV | IEC61000-4-2 contact; printed ±8 | 6 |
| ESD protection, human body model (all pins) |  | -4 |  | 4 | kV | HBM; printed ±4 | 6 |
| Driver propagation delay | tDPLH, tDPHL | 200 |  | 1000 | ns | Fig.2 and 5, RL=54Ω, CL=50pF | 8 |
| Driver output skew /tDPLH - tDPHL/ | tDSKEW | -140 |  | 140 | ns | Fig.2 and 5, RL=54Ω, CL=50pF; printed ±140 | 8 |
| Driver rise and fall time | tDR, tDF | 250 |  | 900 | ns | Fig.2 and 5, RL=54Ω, CL=50pF | 8 |
| Driver enable to output high | tDZH |  |  | 2500 | ns | Fig.3 and 6, CL=100pF, S3 closed | 8 |
| Driver enable to output low | tDZL |  |  | 2500 | ns | Fig.3 and 6, CL=100pF, S2 closed | 8 |
| Driver disable time from low | tDLZ |  |  | 100 | ns | Fig.3 and 6, CL=15pF, S2 closed | 8 |
| Driver disable time from high | tDHZ |  |  | 100 | ns | Fig.3 and 6, CL=15pF, S3 closed | 8 |
| Driver enable from standby to output high | tDZH(SHDN) |  |  | 5500 | ns | Fig.3 and 6, CL=15pF, S3 closed | 8 |
| Driver enable from standby to output low | tDZL(SHDN) |  |  | 5500 | ns | Fig.3 and 6, CL=15pF, S2 closed | 8 |
| Standby time (driver) | tSHDN | 50 |  | 700 | ns |  | 8 |
| Maximum data rate (driver) | fMAX |  |  | 500 | kbps |  | 8 |
| Receiver propagation delay | tRPLH, tRPHL |  |  | 200 | ns | Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns | 8 |
| Receiver output skew /tRPLH - tRPHL/ | tRSKEW | -30 |  | 30 | ns | Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns; printed ±30 | 8 |
| Receiver enable to output low | tRZL |  |  | 50 | ns | Fig.4 and 9, S1=-1.5V, S2 to VCC | 8 |
| Receiver enable to output high | tRZH |  |  | 50 | ns | Fig.4 and 9, S1=+1.5V, S2 to GND | 8 |
| Receiver disable time from low | tRLZ |  |  | 50 | ns | Fig.4 and 9, S1=-1.5V, S2 to VCC | 8 |
| Receiver disable time from high | tRHZ |  |  | 50 | ns | Fig.4 and 9, S1=+1.5V, S2 to GND | 8 |
| Receiver enable from standby to output high | tRZH(SHDN) |  |  | 5500 | ns | Fig.4 and 9, S1=-1.5V, S2 to VCC | 8 |
| Receiver enable from standby to output low | tRZL(SHDN) |  |  | 5500 | ns | Fig.4 and 9, S1=+1.5V, S2 to GND | 8 |
| Standby time (receiver) | tSHDN | 50 |  | 700 | ns |  | 8 |
| Thermal shutdown temperature | TTS |  | 165 |  | °C |  | 5 |
| Thermal shutdown hysteresis | TTSH |  | 15 |  | °C |  | 5 |
| Receiver input impedance | RIN |  | 96 |  | kΩ | -7V≤VCM≤12V | 5 |

## CAD (KiCad official)

- Symbol: `HG487EIN`
- Footprint: `Package_DIP:DIP-8_W7.62mm`
- 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files: `hg487ein-etched.step` / `hg487ein-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hg487ein.step` / `hg487ein.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603086099308818432) (24 pp, sha256 `875b683720653634`, retrieved 2026-10-16, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hg487ein-datasheet.pdf)