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Contents

README

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HG487EIM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

HG487EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high when A-B is at least +200 mV and low when A-B is at most -200 mV.
2 RE input Receiver output enable, active low: RO is enabled when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE uses a hot-plug input structure.
3 DE input Driver output enable: the driver outputs are active when DE is high and high-impedance when DE is low; DE low with RE high puts the device into low-power shutdown, and DE uses a hot-plug input structure.
4 DI input Driver input: with DE high, a low on DI drives A/Y low and B/Z high, and a high on DI drives A/Y high and B/Z low.
5 GND power_in Ground.
6 A bidirectional Bus pin A (A/Y): non-inverting driver output and non-inverting bus terminal, as printed in the datasheet pin table as 'receiver non-inverting output and driver non-inverting output'.
7 B bidirectional Bus pin B (B/Z): receiver inverting input and driver inverting output.
8 VCC power_in Positive supply: 4.5 V ≤ VCC ≤ 5.5 V; connect a 0.1 µF capacitor to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (driver, DC characteristics) VCC 4.5 5.5 V 5
Supply voltage (absolute maximum) VCC 6 V 4
Control input voltage (RE, DE) RE, DE -0.3 6 V 4
Driver input voltage (DI) DI -0.3 6 V 4
Driver output voltage (A, B, Y, Z) -7 12 V 4
Receiver input voltage (A, B) -7 12 V 4
Receiver output voltage (RO) RO -0.3 V Printed as (VCC+0.3) V 4
Continuous power dissipation (8SOP) 500 mW TA=+70 C, 8SOP 4
Operating temperature range (HG48_I) -40 85 C HG48_I industrial grade 4
Storage temperature -65 150 C 4
Differential driver output (RS-422 load) VOD 2.7 V Fig.1, RL=100 ohm (RS-422); max printed as VCC 5
Differential driver output (RS-485 load) VOD 2.1 V Fig.1, RL=54 ohm (RS-485); max printed as VCC 5
Differential driver output voltage magnitude change ΔVOD 0.2 V Fig.1, RL=100 ohm or RL=54 ohm 5
Driver common-mode output voltage VOC 3 V Fig.1, RL=100 ohm or RL=54 ohm; min printed as VCC/2 5
Common-mode output voltage magnitude change ΔVOC 0.2 V Fig.1, RL=100 ohm or RL=54 ohm 5
Input high voltage VIH 2 V DE, DI, RE 5
Input low voltage VIL 0.8 V DE, DI 5
Input current (DE, DI, RE) IIN -1 1 uA DE, DI, RE 5
Input current (A, B) full duplex IA, IB 125 uA DE=GND, VCC=GND or VCC, VIN=12V 5
Input current (A, B) full duplex IA, IB -75 uA DE=GND, VCC=GND or VCC, VIN=-7V 5
Output leakage current (Y, Z) full duplex IO 125 uA DE=GND, VCC=GND or VCC, VIN=12V 5
Output leakage current (Y, Z) full duplex IO -100 uA DE=GND, VCC=GND or VCC, VIN=-7V 5
Driver short-circuit output current IOSD 250 mA 0<=VOUT<=12V 5
Driver short-circuit output current IOSD -250 mA -7<=VOUT<=VCC 5
Driver short-circuit foldback output current IOSDF 20 mA VCC-1V<=VOUT<=VCC+0.5V 5
Driver short-circuit foldback output current IOSDF -20 mA -0.5V<=VOUT<=+1V 5
Receiver differential threshold voltage VTH -200 200 mV -7V<=VCM<=12V 5
Receiver output low voltage VOL 0.4 V IO=4mA, VID=-200mV 5
Receiver tri-state output current IOZR -1 1 uA 0<=VO<=VCC 5
Receiver output short-circuit current IOSR -7 95 mA 0V<=VRO<=VCC; printed as ±7 and ±95 5
Supply current (RE=VCC, DE=VCC) Icc 530 900 uA No load, RE=VCC, DI=GND or VCC, DE=VCC 6
Supply current (RE=VCC, DE=GND) Icc 475 600 uA No load, RE=VCC, DI=GND or VCC, DE=GND 6
Supply current (RE=GND, DE=VCC) Icc 530 1000 uA No load, RE=GND, DI=GND or VCC, DE=VCC 6
Supply current (RE=GND, DE=GND) Icc 475 800 uA No load, RE=GND, DI=GND or VCC, DE=GND 6
Standby mode supply current ISHDN 0.05 10 uA DE=GND, RE=VCC 6
ESD IEC61000-4-2 air-gap discharge (A, B, Y, Z) -16 16 kV A, B, Y, Z pins; printed as ±16 kV 6
ESD IEC61000-4-2 contact discharge (A, B, Y, Z) -8 8 kV A, B, Y, Z pins; printed as ±8 kV 6
ESD HBM (all pins) -4 4 kV HBM model, all pins; printed as ±4 kV 6
Driver propagation delay (rise and fall) tDPLH, tDPHL 200 1000 ns Fig.2 and 5, RL=54 ohm, CL=50pF 8
Driver output skew tDSKEW -140 140 ns Fig.2 and 5, RL=54 ohm, CL=50pF; printed as ±140 8
Driver rise and fall time tDR, tDF 250 900 ns Fig.2 and 5, RL=54 ohm, CL=50pF 8
Driver enable to output high tDZH 2500 ns Fig.3 and 6, CL=100pF, S3 closed 8
Driver enable to output low tDZL 2500 ns Fig.3 and 6, CL=100pF, S2 closed 8
Driver output low to disable time tDLZ 100 ns Fig.3 and 6, CL=15pF, S2 closed 8
Driver output high to disable time tDHZ 100 ns Fig.3 and 6, CL=15pF, S3 closed 8
Driver enable from standby to output high tDZH(SHDN) 5500 ns Fig.3 and 6, CL=15pF, S3 closed 8
Driver enable from standby to output low tDZL(SHDN) 5500 ns Fig.3 and 6, CL=15pF, S2 closed 8
Standby time (driver) tSHDN 50 700 ns 8
Receiver propagation delay tRPLH, tRPHL 200 ns Fig.7 and 8, CL=15pF, /VID/>=2.0V, VID<=15ns 8
Receiver output skew tRSKEW -30 30 ns Fig.7 and 8, CL=15pF, /VID/>=2.0V, VID<=15ns; printed as ±30 8
Receiver enable to output low tRZL 50 ns Fig.4 and 9, S1=-1.5V, S2 to VCC 8
Receiver enable to output high tRZH 50 ns Fig.4 and 9, S1=+1.5V, S2 to GND 8
Receiver output low to disable time tRLZ 50 ns Fig.4 and 9, S1=-1.5V, S2 to VCC 8
Receiver output high to disable time tRHZ 50 ns Fig.4 and 9, S1=+1.5V, S2 to GND 8
Receiver enable from standby to output high tRZH(SHDN) 5500 ns Fig.4 and 9, S1=-1.5V, S2 to VCC 8
Receiver enable from standby to output low tRZL(SHDN) 5500 ns Fig.4 and 9, S1=+1.5V, S2 to GND 8
Maximum data rate (driver, 500 kbps variant) fMAX 500 kbps 8

CAD (KiCad official)

  • Symbol: HG487EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg487eim-etched.step / hg487eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg487eim.step / hg487eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (24 pp, sha256 875b683720653634, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF