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HG4871M
Public Made by Adomby adom
HGSEMI Audio Amplifiers, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHG4871M
HGSEMI · Audio Amplifiers · SOP-8
HG4871M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Shutdown | input | Shutdown control: a high level shuts the power amplifier down, a low level keeps it in normal operation, and the pin must not be left floating because the device may enter an undefined state with no power reduction. |
| 2 | Bypass | passive | Internal common-mode voltage node that requires an external 1μF bypass capacitor; the datasheet recommends 0.1μF to 1μF ceramic for this pin, which affects PSRR and switching noise. |
| 3 | +IN | input | Non-inverting audio input. |
| 4 | -IN | input | Inverting audio input. |
| 5 | VO1 | output | Audio output 1, one side of the bridge-tied-load (BTL) differential output driving the load. |
| 6 | VDD | power_in | Positive power supply, operating range 2.5 V to 5.5 V (absolute maximum 6.0 V). |
| 7 | GND | power_in | Power supply ground. |
| 8 | VO2 | output | Audio output 2, the opposite side of the bridge-tied-load (BTL) differential output driving the load. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (VDD) | VDD | 2.5 | 5.5 | V | 4 | ||
| Storage temperature | Tstg | -65 | 150 | ℃ | 3 | ||
| Input voltage | -0.3 | V | 3 | ||||
| Operating voltage | VDD | 6 | V | 3 | |||
| Junction temperature | 160 | ℃ | 3 | ||||
| Lead temperature (soldering 10s) | TLEAD | 260 | ℃ | Soldering 10s | 3 | ||
| Maximum junction temperature | TJMAX | 150 | ℃ | 7 | |||
| Thermal resistance junction-to-ambient (SOP) | θJA | 140 | ℃/W | SOP package | 3 | ||
| Output offset voltage | Vos | 2 | mV | 4 | |||
| Quiescent current | IQ | 2 | mA | VDD=5V, IO=0 | 4 | ||
| Shutdown current | ISD | 0.1 | μA | VDD=2.5, 5.5V | 4 | ||
| Output power | PO | 2.9 | W | f=1kHz, RL=4Ω, THD=10%, VDD=5V | 4 | ||
| Output power | PO | 2 | W | f=1kHz, RL=4Ω, THD=10%, VDD=4.2V | 4 | ||
| Output power | PO | 1.6 | W | f=1kHz, RL=4Ω, THD=10%, VDD=3.7V | 4 | ||
| Output power | PO | 2.3 | W | f=1kHz, RL=4Ω, THD=1%, VDD=5V | 4 | ||
| Output power | PO | 1.3 | W | f=1kHz, RL=4Ω, THD=1%, VDD=3.7V | 4 | ||
| Output power | PO | 1.72 | W | f=1kHz, RL=8Ω, THD=10%, VDD=5V | 4 | ||
| Output power | PO | 1.2 | W | f=1kHz, RL=8Ω, THD=10%, VDD=4.2V | 4 | ||
| Output power | PO | 0.93 | W | f=1kHz, RL=8Ω, THD=10%, VDD=3.7V | 4 | ||
| Output power | PO | 1.39 | W | f=1kHz, RL=8Ω, THD=1%, VDD=5V | 4 | ||
| Output power | PO | 0.97 | W | f=1kHz, RL=8Ω, THD=1%, VDD=4.2V | 4 | ||
| Output power | PO | 0.75 | W | f=1kHz, RL=8Ω, THD=1%, VDD=3.7V | 4 | ||
| Total harmonic distortion plus noise | THD+N | 0.23 | % | VDD=5V, RL=4Ω, PO=1.8W | 4 | ||
| Total harmonic distortion plus noise | THD+N | 0.08 | % | VDD=5V, RL=8Ω, PO=1W | 4 | ||
| Power supply rejection ratio | PSRR | 80 | dB | Input ac-grounded with Cin=0.47μF, VDD=5V, f=217Hz | 4 | ||
| Power supply rejection ratio | PSRR | 70 | dB | Input ac-grounded with Cin=0.47μF, VDD=5V, f=20kHz | 4 | ||
| Output noise voltage | Vn | 35 | μV | Input ac-grounded with Cin=0.47μF, VDD=5V | 4 | ||
| Signal-to-noise ratio | SNR | 98 | dB | VDD=5V, f=1kHz, THD=1% | 4 | ||
| Shutdown pin high-level input voltage | VSD_H | 0.8 | V | VDD=5V | 4 | ||
| Shutdown pin low-level input voltage | VSD_L | 0.5 | V | VDD=5V | 4 | ||
| Wake-up time | TWU | 200 | ms | 4 |
CAD (KiCad official)
- Symbol:
HG4871M - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hg4871m-etched.step/hg4871m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hg4871m.step/hg4871m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (11 pp, sha256
007b4fb9c06985b8, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).