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Contents

README

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HG376M5

HGSEMI · Precision Op Amps · SOT-23-5

HG376M5 from HGSEMI, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT output Amplifier output, rail-to-rail swing, with output current of 30mA typical and short-circuit limit of 43mA.
2 VSS power_in Negative supply or ground; for dual-supply operation bypass VSS to ground with a 0.1µF ceramic capacitor.
3 IN+ input Non-inverting input, rail-to-rail with common-mode range from VSS-0.1V to VDD+0.1V.
4 IN- input Inverting input, rail-to-rail with common-mode range from VSS-0.1V to VDD+0.1V.
5 VDD power_in Positive supply, 1.8V to 5.5V single-supply operation (7.5V absolute max), bypass with a 0.1µF ceramic capacitor close to the pin.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOT-23-5
Category Amplifiers/Comparators
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power Supply Voltage (VDD to Vss) VDD -0.5 7.5 V VDD to Vss 3
Operating Temperature Range -45 125 °C 3
Junction Temperature 160 °C 3
Storage Temperature Range -55 150 °C 3
Lead Temperature 245 °C soldering, 10sec 3
ESD Susceptibility HBM 6 KV HBM 3
ESD Susceptibility MM 400 V MM 3
Input Offset Voltage VOS 1 30 µV VS = +5V, VCM = +2.5V, VO = +2.5V, TA = +25℃ 4
Input Offset Voltage Drift ∆VOS/∆T 10 50 nV/℃ VS = +5V, VCM = +2.5V, VO = +2.5V, TA = +25℃ 4
Quiescent Current IQ 550 µA VO = 0V, RL = 0Ω 4
Input Bias Current IB 20 pA VS = +5V, VCM = +2.5V, VO = +2.5V, TA = +25℃ 4
Gain-Bandwidth Product GBP 4.5 MHz G = +100 4
Single-supply operating voltage VDD 1.8 5.5 V single supply 7
Dual-supply operating voltage 0.9 2.75 V dual supply, ±VDD/VSS 7
Package Thermal Resistance, junction-to-ambient θJA 190 °C/W SOT23-5, TA=+25℃ 3

CAD (KiCad official)

  • Symbol: HG376M5
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: hg376m5-etched.step / hg376m5-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg376m5.step / hg376m5.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (14 pp, sha256 014f81a3a7ad091e, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF