component

HG25Q80M

Public Made by Adom

by adom

HGSEMI NOR FLASH, SOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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HG25Q80M

HGSEMI · NOR FLASH · SOP-8

HG25Q80M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS# input SPI Chip Select (active low). Drives the device active when low; when high the device is deselected, DO is high-impedance, and current drops to standby (or deep-power-down) levels. Must transition from high to low after power-up before the first instruction is accepted.
2 DO/IO1 bidirectional Serial Data Output (O1). Data is shifted out on the falling edge of CLK, MSB first. Becomes bidirectional IO1 during Dual SPI (Fast Read Dual Output 3Bh) operations, carrying D7,D5,D3,D1 of dual output data.
3 WP# input Write Protect (active low). Used with Status Register bits SRP, BP0/BP1/BP2 to hardware-protect part or all of the memory array from Write Status Register, Program, and Erase operations. Should be tied high if unused.
4 VSS power_in Device ground reference (0 V).
5 DI/IO0 bidirectional Serial Data Input (IO0). Instructions, addresses, and data are shifted in on the rising edge of CLK, MSB first. Becomes bidirectional IO0 during Dual SPI (Fast Read Dual Output 3Bh) operations, carrying D6,D4,D2,D0 of dual output data.
6 CLK input SPI Serial Clock input. Provides the timing for all serial input and output; supports SPI Mode 0 (CPOL=0/CPHA=0) and Mode 3 (CPOL=1/CPHA=1). Maximum 104 MHz.
7 NC unconnected No internal connection. May be left floating or tied to VSS.
8 VCC power_in Positive power supply, 2.7 V to 3.6 V. Typical active current 6 mA; typical power-down current 0.5 µA. Bypass with a 100 nF ceramic capacitor placed close to the pin.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HG25Q80MM/TR
  • HG25Q80MMW/TR
  • HG25Q80MMT/TR
  • HG25Q80MDQ/TR
  • HG25Q80MDQ4/TR

CAD (KiCad official)

  • Symbol: HG25Q80M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg25q80m-etched.step / hg25q80m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg25q80m.step / hg25q80m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (29 pp, sha256 23a4259d464161ce, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF