component

HG24LC32M

Public Made by Adom

by adom

HGSEMI EEPROM, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentmemoryhg24lc32mfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 4d ago
viewers hg24lc32m: viewers · Ray 4d ago
hg24lc32m-etched.glb Publish 0.1.0 · Ray 4d ago
hg24lc32m-etched.step hg24lc32m: factory component page (tier=lcsc) · Ray 4d ago
hg24lc32m-hero.glb hg24lc32m: hero GLB from the etched model (keeps the MPN mark) · Ray 4d ago
hg24lc32m-hero.overlay.json Publish 0.1.0 · Ray 4d ago
hg24lc32m.glb Publish 0.1.0 · Ray 4d ago
hg24lc32m.kicad_mod Publish 0.1.0 · Ray 4d ago
hg24lc32m.kicad_sym Publish 0.1.0 · Ray 4d ago
hg24lc32m.lbr Publish 0.1.0 · Ray 4d ago
hg24lc32m.step Publish 0.1.0 · Ray 4d ago
package.json Publish 0.1.0 · Ray 4d ago
page.json Set visibility: public · Ray 4d ago
README.md Publish 0.1.0 · Ray 4d ago

HG24LC32M

HGSEMI · EEPROM · SOP-8

HG24LC32M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input, hard wired; up to eight 32K/64K devices can share one bus.
2 A1 input Device address input, hard wired; up to eight 32K/64K devices can share one bus.
3 A2 input Device address input, hard wired; up to eight 32K/64K devices can share one bus.
4 GND power_in Ground.
5 SDA bidirectional Bidirectional open-drain serial data pin that may be wire-ORed with other open-drain or open-collector devices and needs an external pull-up.
6 SCL input Serial clock input that clocks data into the device on the positive edge and out on the negative edge.
7 WP input Write protect input; connected to GND allows normal read/write, connected to VCC enables hardware write protection.
8 VCC power_in Power supply, 1.7V to 5.5V operating range.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage Vcc 1.7 5.5 V 8
Operating Ambient Temperature TA -40 85 ℃ 8
DC Supply Voltage -0.3 6.5 V 8
Input / Output Voltage -0.3 0.3 V below GND / V above VCC min = GND-0.3V; max = VCC+0.3V 8
Storage Temperature -65 150 ℃ 8
Supply Current Vcc=5.0V Icc1 0.4 1 mA Vcc=5.0V; Read @100KHz 8
Supply Current Vcc=5.0V Icc2 2 3 mA Vcc=5.0V; Write @100KHz 8
Standby Current ISB 2 uA Vin=Vcc or GND 8
Input Leakage Current ILI 3 uA Vin=Vcc or GND 8
Output Leakage Current ILO 0.05 3 uA Vout=Vcc or GND 8
Input Low Level VIL -0.6 0.3 V max = Vcc×0.3 (unit: ×Vcc); min -0.6 V 8
Input High Level VIH 0.7 0.5 ×Vcc (min) / V added to Vcc (max) min = Vcc×0.7; max = Vcc + 0.5 V 8
Output Low Level Vcc=5.0V VOL3 0.4 V IOL=3.0mA 8
Output Low Level Vcc=3.0V VOL2 0.4 V IOL=2.1mA 8
Output Low Level Vcc=1.8V VOL1 0.2 V IOL=0.15mA 8
Input/Output Capacitance (SDA) CI/O 8 pF VI/O = 0V 9
Input Capacitance (A0, A1, A2, SCL) CIN 6 pF VIN = 0V 9
Clock Frequency, SCL fSCL 400 KHz 1.8-volt column 9
Clock Frequency, SCL fSCL 1000 KHz 5.0-volt column 9
Clock Pulse Width Low tLOW 1.2 us 1.8-volt column 9
Clock Pulse Width Low tLOW 0.6 us 5.0-volt column 9
Clock Pulse Width High tHIGH 0.6 us 1.8-volt column 9
Clock Pulse Width High tHIGH 0.4 us 5.0-volt column 9
Noise Suppression Time tI 50 us 1.8-volt column 9
Noise Suppression Time tI 40 us 5.0-volt column 9
Clock Low to Data Out Valid tAA 0.05 0.9 us 1.8-volt column 9
Clock Low to Data Out Valid tAA 0.05 0.55 us 5.0-volt column 9
Time the bus must be free before a new transmission can start tBUF 1.2 us 1.8-volt column 9
Time the bus must be free before a new transmission can start tBUF 0.5 us 5.0-volt column 9
Start Hold Time tHD.STA 0.6 us 1.8-volt column 9
Start Hold Time tHD.STA 0.25 us 5.0-volt column 9
Start Setup Time tSU.STA 0.6 us 1.8-volt column 9
Start Setup Time tSU.STA 0.25 us 5.0-volt column 9
Data In Hold Time tHD.DAT 0 us 1.8-volt column 9
Data In Setup Time tSU.DAT 100 ns 1.8-volt column 9
Inputs Rise Time tR 0.3 us 1.8-volt column 9
Inputs Fall Time tF 300 ns 1.8-volt column 9
Inputs Fall Time tF 100 ns 5.0-volt column 9
Stop Setup Time tSU.STO 0.6 us 1.8-volt column 9
Stop Setup Time tSU.STO 0.25 us 5.0-volt column 9
Data Out Hold Time tDH 50 ns 1.8-volt column 9
Write Cycle Time tWR 5 ms 1.8-volt column 9
Endurance 1 M write cycles 5.0V, 25℃, Byte Mode 9

CAD (KiCad official)

  • Symbol: HG24LC32M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg24lc32m-etched.step / hg24lc32m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24lc32m.step / hg24lc32m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (13 pp, sha256 d5c12a9dcc262df8, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF