component

HG24LC08M

Public Made by Adom

by adom

HGSEMI EEPROM, SOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

componentmemoryhg24lc08m
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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

markdown

HG24LC08M

HGSEMI · EEPROM · SOP-8

HG24LC08M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 unconnected No connect on the HG24LC08. On the 8K variant this device-address input is unused (the corresponding address bit is used internally for page addressing); tie to GND for compatibility.
2 A1 unconnected No connect on the HG24LC08. On the 8K variant this device-address input is unused (the corresponding address bit is used internally for page addressing); tie to GND for compatibility.
3 A2 input Device-address input for the HG24LC08. Sets the hard-wired A2 bit compared against the device-address byte; up to two 8K devices per bus. Schmitt-triggered CMOS input.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Bidirectional I2C serial data line, open-drain. Requires external pull-up to VCC. Compatible with 1 MHz (5 V) and 400 kHz (1.8/2.5/2.7 V) bus rates.
6 SCL input I2C serial clock input. Positive edge clocks data into the EEPROM, negative edge clocks data out. Schmitt-triggered.
7 WP input Write-protect input. Tie to GND for normal read/write; tie to VCC to write-protect the entire 8K array. Schmitt-triggered.
8 VCC power_in Supply voltage input. Operating range 1.7 V to 5.5 V. Recommend a 100 nF decoupling capacitor to GND close to the pin.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HG24LC08MM
  • HG24LC08MM/TR
  • HG24LC08MN
  • HG24LC08MMM
  • HG24LC08MMM/TR
  • HG24LC08MM5
  • HG24LC08MM5/TR

CAD (KiCad official)

  • Symbol: HG24LC08M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg24lc08m-etched.step / hg24lc08m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24lc08m.step / hg24lc08m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (15 pp, sha256 9d218d780eb41d4d, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF