component
HG24C64CM5
Public Made by Adomby adom
HGSEMI(华冠) , SOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownHG24C64CM5
HGSEMI(华冠) · IC · SOT-23-5
HG24C64CM5 from HGSEMI(华冠), in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SCL | input | Serial Clock input that controls data flow, with input data latched on the rising edge of SCL and output data clocked out on the falling edge. |
| 2 | GND | power_in | Ground reference for the power supply, to be connected to system ground. |
| 3 | SDA | bidirectional | Open-drain bidirectional serial data pin used to transfer data to and from the device. |
| 4 | VCC | power_in | Device power supply pin, 1.7V to 5.5V; operation at invalid VCC voltages may produce spurious results. |
| 5 | WP | input | Write Protection input: connected to VCC the whole memory array is read-only, connected to GND writes are enabled, and floating it is internally pulled down to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI(华冠) |
| Package | SOT-23-5 |
| Category | |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Ambient temperature with power applied | -55 | 130 | °C | 17 | |||
| Lead Temperature (Soldering) | TL | 245 | °C | Soldering, 10 seconds | 17 | ||
| Storage temperature | TSTG | -65 | 150 | °C | 17 | ||
| Supply voltage | VCC | -0.5 | 6 | V | 17 | ||
| Voltage on input Pins | VIN | -0.5 | 6 | V | 17 | ||
| Electrostatic pulse (human body model) | VESD | 6000 | V | Human body model | 17 | ||
| Operating temperature range | -40 | 105 | °C | 17 | |||
| Supply Voltage | VCC | 1.7 | 5.5 | V | 17 | ||
| Supply Current (Read) | ICC1 | 0.1 | mA | VCC= 1.7V, Read at 1MHz | 17 | ||
| Supply Current (Read) | ICC1 | 0.4 | mA | VCC= 5.5V, Read at 400 kHz | 17 | ||
| Supply Current (Read) | ICC1 | 0.5 | mA | VCC= 5.5V, Read at 1MHz | 17 | ||
| Supply Current (Write) | ICC2 | 0.2 | mA | VCC= 1.7V, Write at 400 kHz | 17 | ||
| Supply Current (Write) | ICC2 | 0.5 | mA | VCC= 5.5V, Write at 400 kHz | 17 | ||
| Standby Current | ISB | 0.5 | μA | VCC = 1.7V, VIN = VCC or GND | 17 | ||
| Standby Current | ISB | 1 | μA | VCC = 5.5V, VIN = VCC or GND | 17 | ||
| Input Leakage Current | ILI | 1 | μA | VIN = VCC or GND | 17 | ||
| Output Leakage Current | ILO | 1 | μA | VOUT = VCC or GND | 17 | ||
| Input Low-Level Voltage (SDA, SCL) | VIL | -0.5 | V | 17 | |||
| Low-Level Output Voltage | VOL1 | 0.4 | V | VCC> 2V, IOL= 3mA | 17 | ||
| Low-Level Output Voltage | VOL2 | 0.2 | V | VCC≤2V, IOL= 2mA | 17 | ||
| Input/output Capacitance (SDA) | CI/O | 8 | pF | VI/O = 0V; TA = +25°C, fC = 1MHz, VCC = 1.7V to 5.5V | 19 | ||
| Input Capacitance (other Pins) | CIN | 6 | pF | VIN = 0V; TA = +25°C, fC = 1MHz, VCC = 1.7V to 5.5V | 19 | ||
| Data Retention | DR | 200 | year | TA = +25°C | 19 | ||
| Clock Frequency, SCL (Fast Mode) | fSCL | 400 | kHz | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Clock Frequency, SCL (High Speed Mode) | fSCL | 1000 | kHz | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| Clock Pulse Width Low (Fast Mode) | tLOW | 1300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Clock Pulse Width Low (High Speed Mode) | tLOW | 600 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| Clock Pulse Width High (Fast Mode) | tHIGH | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Clock Pulse Width High (High Speed Mode) | tHIGH | 260 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| SDA Rise Time (Fast Mode) | tR | 300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| SDA Rise Time (High Speed Mode) | tR | 300 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| SDA(Out) Fall Time (Fast Mode) | tF | 300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| SDA(Out) Fall Time (High Speed Mode) | tF | 100 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| Start Hold Time (Fast Mode) | tHD.STA | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Start Hold Time (High Speed Mode) | tHD.STA | 250 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| Start Setup Time (Fast Mode) | tSU.STA | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Start Setup Time (High Speed Mode) | tSU.STA | 250 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| Stop Setup Time (Fast Mode) | tSU.STO | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Stop Setup Time (High Speed Mode) | tSU.STO | 250 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| Bus Free Time between Stop and Next Start (Fast Mode) | tBUF | 1300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Bus Free Time between Stop and Next Start (High Speed Mode) | tBUF | 500 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| Data In Hold Time (Fast Mode) | tHD.DI | 0 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Data In Hold Time (High Speed Mode) | tHD.DI | 0 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| Data In Setup Time (Fast Mode) | tSU.DAT | 100 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Data In Setup Time (High Speed Mode) | tSU.DAT | 50 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| Data Out Hold Time (Fast Mode) | tHD.DAT | 50 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Data Out Hold Time (High Speed Mode) | tHD.DAT | 50 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| SCL Low to Data Out Valid (Fast Mode) | tAA | 100 | 900 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | |
| SCL Low to Data Out Valid (High Speed Mode) | tAA | 50 | 500 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | |
| WP Pin Setup Time (Fast Mode) | tSU.WP | 1200 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| WP Pin Setup Time (High Speed Mode) | tSU.WP | 600 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| WP Pin Hold Time (Fast Mode) | tHD.WP | 1200 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| WP Pin Hold Time (High Speed Mode) | tHD.WP | 600 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| Write Cycle Time (Fast Mode) | tWR | 3 | ms | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Write Cycle Time (High Speed Mode) | tWR | 3 | ms | High Speed Mode, VCC = 1.7V to 5.5V | 18 | ||
| Noise Suppression Time (Fast Mode) | tI | 50 | ns | Fast Mode, VCC = 1.7V to 5.5V | 18 | ||
| Noise Suppression Time (High Speed Mode) | tI | 50 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 18 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | Abs | VESD Electrostatic pulse (human body model) 6000 V Note: Stresses beyond those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. Functional operation | 17 |
CAD (KiCad official)
- Symbol:
HG24C64CM5 - Footprint:
Package_TO_SOT_SMD:SOT-23-5 - 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
hg24c64cm5-etched.step/hg24c64cm5-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hg24c64cm5.step/hg24c64cm5.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI(华冠) datasheet (24 pp, sha256
290584f04f0a3159, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).