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HG24C512N

Public Made by Adom

by adom

HGSEMI EEPROM, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HG24C512N

HGSEMI · EEPROM · DIP-8

HG24C512N from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device/page address input that must match its hardwired level to select one of up to four devices on the bus; if left unconnected it defaults to zero.
2 A1 input Device address input that must match its hardwired level to select one of up to four devices on the bus; if left unconnected it defaults to zero.
3 NC unconnected No connect; the pin is not connected internally.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Open-drain serial data pin for bidirectional transfer that is normally pulled high by an external device and may be wire-ORed with other open-drain devices.
6 SCL input Serial clock input: data is clocked into the device on the positive edge and clocked out on the negative edge, with Schmitt-trigger filtered inputs.
7 WP input Write protect: tying it to GND allows normal writes, tying it to VCC inhibits all write operations, and it is internally pulled down to GND if left unconnected.
8 VCC power_in Supply voltage; the datasheet gives 1.8 V to 3.6 V, 2.7 V to 5.5 V, or 4.5 V to 5.5 V depending on the version.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Temperature -55 125 °C 2
Storage Temperature -65 150 °C 2
Voltage on Any Pin with Respect to Ground -1 7 V 2
Maximum Operating Voltage 6.25 V 2
DC Output Current 5 mA 2
Industrial Ambient Operating Temperature TAI -40 85 °C VCC = +1.8V to +5.5V 3
Commercial Ambient Operating Temperature TAC 0 70 °C VCC = +1.8V to +5.5V 3
Supply Voltage (1.8V option) VCC1 1.8 3.6 V 3
Supply Voltage (2.7V option) VCC2 2.7 5.5 V 3
Supply Voltage (5.0V option) VCC3 4.5 5.5 V 3
Input Capacitance (SDA) CI/O 8 pF VI/O = 0V 3
Input Capacitance (A0, A1, SCL) CIN 6 pF VIN = 0V 3
Supply Current READ ICC1 1 2 mA VCC = 5.0V READ at 400 kHz 3
Supply Current WRITE ICC2 2 3 mA VCC = 5.0V WRITE at 400 kHz 3
Standby Current (1.8V option) ISB1 0.2 µA VCC = 1.8V; VIN = VCC or VSS 3
Standby Current (1.8V option) ISB1 2 µA VCC = 3.6V 3
Standby Current (2.7V option) ISB2 0.6 µA VCC = 2.7V; VIN = VCC or VSS 3
Standby Current (2.7V option) ISB2 6 µA VCC = 5.5V 3
Standby Current (5.0V option) ISB3 6 µA VCC = 4.5-5.5V; VIN = VCC or VSS 3
Input Leakage Current ILI 0.1 3 µA VIN = VCC or VSS 3
Output Leakage Current ILO 0.05 3 µA VOUT = VCC or VSS 3
Input Low Level VIL -0.6 V 3
Output Low Level VOL2 0.4 V VCC = 3.0V; IOL = 2.1 mA 3
Output Low Level VOL1 0.2 V VCC = 1.8V; IOL = 0.15 mA 3
Clock Frequency, SCL (1.8V option) fSCL 100 kHz 1.8V option; CL = 100 pF 4
Clock Frequency, SCL (2.7V option) fSCL 400 kHz 2.7V option; CL = 100 pF 4
Clock Frequency, SCL (5.0V option) fSCL 1000 kHz 5.0V option; CL = 100 pF 4
Clock Pulse Width Low (1.8V option) tLOW 4.7 µs 1.8V option; CL = 100 pF 4
Clock Pulse Width Low (2.7V option) tLOW 1.3 µs 2.7V option; CL = 100 pF 4
Clock Pulse Width Low (5.0V option) tLOW 0.6 µs 5.0V option; CL = 100 pF 4
Clock Pulse Width High (1.8V option) tHIGH 4 µs 1.8V option; CL = 100 pF 4
Clock Pulse Width High (2.7V option) tHIGH 1 µs 2.7V option; CL = 100 pF 4
Clock Pulse Width High (5.0V option) tHIGH 0.4 µs 5.0V option; CL = 100 pF 4
Clock Low to Data Out Valid (1.8V option) tAA 0.1 4.5 µs 1.8V option; CL = 100 pF 4
Clock Low to Data Out Valid (2.7V option) tAA 0.05 0.9 µs 2.7V option; CL = 100 pF 4
Clock Low to Data Out Valid (5.0V option) tAA 0.05 0.55 µs 5.0V option; CL = 100 pF 4
Bus Free Time before New Transmission (1.8V option) tBUF 4.7 µs 1.8V option; CL = 100 pF 4
Bus Free Time before New Transmission (2.7V option) tBUF 1.3 µs 2.7V option; CL = 100 pF 4
Bus Free Time before New Transmission (5.0V option) tBUF 0.5 µs 5.0V option; CL = 100 pF 4
Start Hold Time (1.8V option) tHD.STA 4 µs 1.8V option; CL = 100 pF 4
Start Hold Time (2.7V option) tHD.STA 0.6 µs 2.7V option; CL = 100 pF 4
Start Hold Time (5.0V option) tHD.STA 0.25 µs 5.0V option; CL = 100 pF 4
Start Set-up Time (1.8V option) tSU.STA 4.7 µs 1.8V option; CL = 100 pF 4
Start Set-up Time (2.7V option) tSU.STA 0.6 µs 2.7V option; CL = 100 pF 4
Start Set-up Time (5.0V option) tSU.STA 0.25 µs 5.0V option; CL = 100 pF 4
Data In Hold Time (1.8V option) tHD.DAT 0 µs 1.8V option; CL = 100 pF 4
Data In Hold Time (2.7V option) tHD.DAT 0 µs 2.7V option; CL = 100 pF 4
Data In Hold Time (5.0V option) tHD.DAT 0 µs 5.0V option; CL = 100 pF 4
Data In Set-up Time (1.8V option) tSU.DAT 200 ns 1.8V option; CL = 100 pF 4
Data In Set-up Time (2.7V option) tSU.DAT 100 ns 2.7V option; CL = 100 pF 4
Data In Set-up Time (5.0V option) tSU.DAT 100 ns 5.0V option; CL = 100 pF 4
Inputs Rise Time (1.8V option) tR 1 µs 1.8V option; CL = 100 pF 4
Inputs Rise Time (2.7V option) tR 0.3 µs 2.7V option; CL = 100 pF 4
Inputs Rise Time (5.0V option) tR 0.3 µs 5.0V option; CL = 100 pF 4
Inputs Fall Time (1.8V option) tF 300 ns 1.8V option; CL = 100 pF 4
Inputs Fall Time (2.7V option) tF 300 ns 2.7V option; CL = 100 pF 4
Inputs Fall Time (5.0V option) tF 100 ns 5.0V option; CL = 100 pF 4
Stop Set-up Time (1.8V option) tSU.STO 4.7 µs 1.8V option; CL = 100 pF 4
Stop Set-up Time (2.7V option) tSU.STO 0.6 µs 2.7V option; CL = 100 pF 4
Stop Set-up Time (5.0V option) tSU.STO 0.25 µs 5.0V option; CL = 100 pF 4
Data Out Hold Time (1.8V option) tDH 100 ns 1.8V option; CL = 100 pF 4
Data Out Hold Time (2.7V option) tDH 50 ns 2.7V option; CL = 100 pF 4
Data Out Hold Time (5.0V option) tDH 50 ns 5.0V option; CL = 100 pF 4
Write Cycle Time (1.8V option) tWR 20 ms 1.8V option 4
Write Cycle Time (2.7V option) tWR 10 ms 2.7V option 4
Write Cycle Time (5.0V option) tWR 10 ms 5.0V option 4
Endurance 100 K Write Cycles 5.0V, 25°C, Page Mode 4

CAD (KiCad official)

  • Symbol: HG24C512N
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: hg24c512n-etched.step / hg24c512n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24c512n.step / hg24c512n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (9 pp, sha256 20bf3579d7cbd823, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF