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Contents

README

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HG24C32M

HGSEMI · EEPROM · SOIC-8

HG24C32M from HGSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 E0 input Hardware device-address input that must match the E0 bit of the device address; if left floating it is internally pulled down to Vss.
2 E1 input Hardware device-address input that must match the E1 bit of the device address; if left floating it is internally pulled down to Vss.
3 E2 input Hardware device-address input that must match the E2 bit of the device address; if left floating it is internally pulled down to Vss.
4 Vss power_in Ground reference for the VCC supply voltage.
5 SDA bidirectional Open-drain serial data input and output that is normally pulled high by an external device and may be wire-OR'ed with other open-drain or open-collector devices.
6 SCL input Serial clock input that clocks data in on the positive edge and clocks data out on the negative edge.
7 WCB input Active-low write control: when connected to VCC all write operations are inhibited, when connected to Vss normal writes are allowed, and if left floating it is internally pulled down to Vss.
8 VCC power_in Supply voltage, specified at 1.7 V to 5.5 V in operation, with an absolute maximum range of -0.5 V to 6.5 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Storage Temperature TSTG -65 150 °C 4
Ambient operating temperature range TA -40 125 °C 4
Supply Voltage VCC -0.5 6.5 V 4
Input or output range VIO -0.5 6.5 V 4
DC output current IOL 5 mA SDA=0 4
Lead Temperature TL 260 °C Soldering, 10 seconds 4
Input / Output Capacitance (SDA) CI/O 8 pF VI/O=Vss 4
Input Capacitance (E0, E1, E2, WCB, SCL) CIN 6 pF VIN= Vss 4
Supply Voltage VCC 1.7 5.5 V 4
Standby Current Isb 3 uA Vcc = 5.5V, TA = 85°C 4
Standby Current Isb 6 uA Vcc = 5.5V, TA = 105°C 4
Standby Current Isb 10 uA Vcc = 5.5V, TA = 125°C 4
Supply Current (read) ICC1 0.2 1 mA Vcc=5.5V, Read at 400Khz 4
Supply Current (write) ICC2 0.8 2 mA Vcc=5.5V, Write at 400Khz 4
Input Leakage Current ILI 0.1 1 µA VIN = VCC or Vss 4
Output Leakage Current ILO 0.05 1 µA VOUT = VCC or Vss 4
Input Low Level VIL -0.5 V 4
Output Low Level VOL1 0.2 V VCC = 1.7V (SDA); IOL = 0.15 mA 4
Output Low Level VOL2 0.4 V VCC = 3.0V (SDA); IOL = 2.1 mA 4
Clock Frequency, SCL fSCL 400 kHz 1.7≤VCC≤5.5; 400 kHz mode 6
Clock Frequency, SCL fSCL 1000 kHz 1.7≤VCC≤5.5; 1 MHz mode 6
Clock Pulse Width Low tLOW 1.3 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Clock Pulse Width Low tLOW 0.4 µs 1.7≤VCC≤5.5; 1 MHz mode 6
Clock Pulse Width High tHIGH 0.6 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Clock Pulse Width High tHIGH 0.4 µs 1.7≤VCC≤5.5; 1 MHz mode 6
Clock Low to Data Out Valid tAA 0.05 0.9 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Clock Low to Data Out Valid tAA 0.05 0.55 µs 1.7≤VCC≤5.5; 1 MHz mode 6
Noise Suppression Time tI 0.1 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Noise Suppression Time tI 0.05 µs 1.7≤VCC≤5.5; 1 MHz mode 6
Time the bus must be free before a new transmission can start tBUF 1.3 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Time the bus must be free before a new transmission can start tBUF 0.5 µs 1.7≤VCC≤5.5; 1 MHz mode 6
Start Hold Time tHD.STA 0.6 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Start Hold Time tHD.STA 0.25 µs 1.7≤VCC≤5.5; 1 MHz mode 6
Data In Hold Time tHD.DAT 0 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Data In Setup Time tSU.DAT 0.1 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Inputs Rise Time tR 0.3 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Inputs Fall Time tF 0.3 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Inputs Fall Time tF 0.1 µs 1.7≤VCC≤5.5; 1 MHz mode 6
Start Setup Time tSU.STA 0.6 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Start Setup Time tSU.STA 0.25 µs 1.7≤VCC≤5.5; 1 MHz mode 6
Stop Setup Time tSU.STO 0.6 µs 1.7≤VCC≤5.5; 400 kHz mode 6
Stop Setup Time tSU.STO 0.25 µs 1.7≤VCC≤5.5; 1 MHz mode 6
Data Out Hold Time tDH 0.05 µs 1.7≤VCC≤5.5; 400 kHz mode 6
WCB pin Setup Time tSU.WCB 1.2 µs 1.7≤VCC≤5.5; 400 kHz mode 6
WCB pin Setup Time tSU.WCB 0.6 µs 1.7≤VCC≤5.5; 1 MHz mode 6
WCB pin Hold Time tHD.WCB 1.2 µs 1.7≤VCC≤5.5; 400 kHz mode 6
WCB pin Hold Time tHD.WCB 0.6 µs 1.7≤VCC≤5.5; 1 MHz mode 6
Write Cycle Time tWR 5 ms 1.7≤VCC≤5.5; 400 kHz mode 6
Clock Frequency, SCL fSCL 100 kHz 1.7≤VCC≤5.5; 100 kHz mode 5
Clock Pulse Width Low tLOW 4.7 µs 1.7≤VCC≤5.5; 100 kHz mode 5
Clock Pulse Width High tHIGH 4 µs 1.7≤VCC≤5.5; 100 kHz mode 5
Clock Low to Data Out Valid tAA 0.05 3.45 µs 1.7≤VCC≤5.5; 100 kHz mode 5
Time the bus must be free before a new transmission can start tBUF 4.7 µs 1.7≤VCC≤5.5; 100 kHz mode 5
Start Setup Time tSU.STA 4.7 µs 1.7≤VCC≤5.5; 100 kHz mode 5
Start Hold Time tHD.STA 4 µs 1.7≤VCC≤5.5; 100 kHz mode 5

CAD (KiCad official)

  • Symbol: HG24C32M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: hg24c32m-etched.step / hg24c32m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24c32m.step / hg24c32m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (20 pp, sha256 a83336a282838dca, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF