component

HG24C256MM

Public Made by Adom

by adom

HGSEMI EEPROM, MSOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

markdown

HG24C256MM

HGSEMI · EEPROM · MSOP-8

HG24C256MM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input bit 0. Hardwire to VCC or GND to set the device's chip-select address, allowing up to four/eight 24Cxx devices on one I2C bus. Internally pulled to GND when floating (if board VCC-plane coupling <3 pF); otherwise tie to GND.
2 A1 input Device address input bit 1. Hardwire to VCC or GND to set the device's chip-select address. Internally pulled to GND when floating (if board VCC-plane coupling <3 pF); otherwise tie to GND.
3 NC unconnected No connect. Leave floating or tie to GND.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Serial data. Bi-directional open-drain line for I2C data transfer; requires an external pull-up resistor to VCC. May be wire-ORed with other open-drain/open-collector devices.
6 SCL input Serial clock input. Positive edge clocks data into the EEPROM; negative edge clocks data out. Max 1 MHz at 5V, 400 kHz at 1.8/2.7/3.3V.
7 WP input Write protect input. Tie to GND for normal read/write; tie to VCC to inhibit all writes to the memory array (full array hardware write protect). Internally pulled to GND when floating (if VCC-plane coupling <3 pF); otherwise tie to GND.
8 VCC power_in Power supply input. Operating range 1.8V to 5.5V; absolute max 6.5V. Standby current typ. 3 µA at 5.5V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HG24C256MM/TR
  • HG24C256MMM/TR
  • HG24C256MMN

CAD (KiCad official)

  • Symbol: HG24C256MM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg24c256mm-etched.step / hg24c256mm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24c256mm.step / hg24c256mm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (14 pp, sha256 a9630ce0b45ca10b, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF