component

HG24C256CN

Public Made by Adom

by adom

HGSEMI EEPROM, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentmemoryhg24c256cnfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 1d ago
viewers hg24c256cn: viewers · Ray 1d ago
hg24c256cn-etched.glb Publish 0.1.0 · Ray 1d ago
hg24c256cn-etched.step hg24c256cn: factory component page (tier=lcsc) · Ray 1d ago
hg24c256cn-hero.glb hg24c256cn: hero GLB from the etched model (keeps the MPN mark) · Ray 1d ago
hg24c256cn-hero.overlay.json Publish 0.1.0 · Ray 1d ago
hg24c256cn.glb Publish 0.1.0 · Ray 1d ago
hg24c256cn.kicad_mod Publish 0.1.0 · Ray 1d ago
hg24c256cn.kicad_sym Publish 0.1.0 · Ray 1d ago
hg24c256cn.lbr Publish 0.1.0 · Ray 1d ago
hg24c256cn.step Publish 0.1.0 · Ray 1d ago
package.json Publish 0.1.0 · Ray 1d ago
page.json Set visibility: public · Ray 1d ago
README.md Publish 0.1.0 · Ray 1d ago

HG24C256CN

HGSEMI · EEPROM · DIP-8

HG24C256CN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 E0 input Device address input selecting the least-significant bit of the I2C slave address; connect directly to VCC or GND, allowing up to eight devices on the same bus.
2 E1 input Device address input selecting the middle bit of the I2C slave address; connect directly to VCC or GND, allowing up to eight devices on the same bus.
3 E2 input Device address input selecting the upper bit of the I2C slave address; connect directly to VCC or GND, allowing up to eight devices on the same bus.
4 GND power_in Ground reference for the power supply; connect to system ground.
5 SDA bidirectional Serial data pin, an open-drain bidirectional input/output used to transfer data to and from the device.
6 SCL input Serial clock input that clocks data to and from the device; input data is latched on the rising edge and output data is clocked out on the falling edge.
7 WP input Write protect input; connected to VCC the entire memory array is write-protected (read-only), connected to GND or left floating write operations are enabled.
8 VCC power_in Device power supply, 1.7V to 5.5V; operation at invalid VCC voltages may produce spurious results.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient temperature with power applied TA -40 105 °C 18
Storage temperature TSTG -65 150 °C 18
Supply voltage VCC -0.5 6 V 18
Voltage on input pins VIN -0.5 6 V 18
Lead temperature (soldering) TL 245 °C 10 seconds soldering 18
Ambient temperature operating range TA -40 105 °C Operating range 18
Supply voltage VCC 1.7 5.5 V Operating range 18
Power-On Reset Time tPOR 10 ms 6
Power-On Reset Voltage VPOR 1.6 V 6
Brown-out Reset Voltage VBOR 0.8 V 6
Time from Power-On to First Command tINIT 10 ms 6
Warm Power Cycle Off Time tPOFF 1 ms 6
Supply Current (Read) ICC1 0.15 mA VCC = 1.7V, Read at 1MHz 18
Supply Current (Read) ICC1 0.4 mA VCC = 5.5V, Read at 400 kHz 18
Supply Current (Read) ICC1 0.5 mA VCC = 5.5V, Read at 1MHz 18
Supply Current (Write) ICC2 0.5 mA VCC = 1.7V, Write at 400 kHz 18
Supply Current (Write) ICC2 1 mA VCC = 5.5V, Write at 400 kHz 18
Standby Current ISB 0.5 μA VCC = 1.7V, VIN = VCC or GND 18
Standby Current ISB 1 μA VCC = 5.5V, VIN = VCC or GND 18
Input Leakage Current ILI 1 μA VIN = VCC or GND 18
Output Leakage Current ILO 1 μA VOUT = VCC or GND 18
Input Low-Level Voltage (SDA, SCL) VIL -0.5 V 18
Low-Level Output Voltage VOL1 0.4 V VCC > 2V, IOL = 3mA 18
Low-Level Output Voltage VOL2 0.2 V VCC ≤ 2V, IOL = 2mA 18
Clock Frequency, SCL fSCL 400 kHz Fast column, VCC = 1.7V to 5.5V 19
Clock Frequency, SCL fSCL 1000 kHz High Speed column, VCC = 1.7V to 5.5V 19
Clock Pulse Width Low tLOW 1300 ns Fast column, VCC = 1.7V to 5.5V 19
Clock Pulse Width Low tLOW 600 ns High Speed column, VCC = 1.7V to 5.5V 19
Clock Pulse Width High tHIGH 600 ns Fast column, VCC = 1.7V to 5.5V 19
Clock Pulse Width High tHIGH 260 ns High Speed column, VCC = 1.7V to 5.5V 19
SDA Rise Time tR 300 ns Fast column; ensured by characterization only 19
SDA(Out) Fall Time tF 300 ns Fast column; ensured by characterization only 19
SDA(Out) Fall Time tF 100 ns High Speed column; ensured by characterization only 19
Start Hold Time tHD.STA 600 ns Fast column, VCC = 1.7V to 5.5V 19
Start Hold Time tHD.STA 250 ns High Speed column, VCC = 1.7V to 5.5V 19
Start Setup Time tSU.STA 600 ns Fast column, VCC = 1.7V to 5.5V 19
Start Setup Time tSU.STA 250 ns High Speed column, VCC = 1.7V to 5.5V 19
Stop Setup Time tSU.STO 600 ns Fast column, VCC = 1.7V to 5.5V 19
Stop Setup Time tSU.STO 250 ns High Speed column, VCC = 1.7V to 5.5V 19
Bus Free Time between Stop and Next Start tBUF 1300 ns Fast column, VCC = 1.7V to 5.5V 19
Bus Free Time between Stop and Next Start tBUF 500 ns High Speed column, VCC = 1.7V to 5.5V 19
Data In Hold Time tHD.DI 0 ns Fast column, VCC = 1.7V to 5.5V 19
Data In Setup Time tSU.DAT 100 ns Fast column, VCC = 1.7V to 5.5V 19
Data In Setup Time tSU.DAT 50 ns High Speed column, VCC = 1.7V to 5.5V 19
Data Out Hold Time tHD.DAT 50 ns Fast column, VCC = 1.7V to 5.5V 19
SCL Low to Data Out Valid tAA 100 900 ns Fast column, VCC = 1.7V to 5.5V 19
SCL Low to Data Out Valid tAA 50 500 ns High Speed column, VCC = 1.7V to 5.5V 19
WP Pin Setup Time tSU.WP 1200 ns Fast column, VCC = 1.7V to 5.5V 19
WP Pin Setup Time tSU.WP 600 ns High Speed column, VCC = 1.7V to 5.5V 19
WP Pin Hold Time tHD.WP 1200 ns Fast column, VCC = 1.7V to 5.5V 19
WP Pin Hold Time tHD.WP 600 ns High Speed column, VCC = 1.7V to 5.5V 19
Write Cycle Time tWR 5 ms Fast column, VCC = 1.7V to 5.5V 19
Noise Suppression Time tI 50 ns Fast column 19
Input/output Capacitance (SDA) CI/O 8 pF VI/O = 0V, TA = +25°C, fC = 1MHz 21
Input Capacitance (SA0, SA1, SA2, SCL) CIN 6 pF VIN = 0V, TA = +25°C, fC = 1MHz 21

CAD (KiCad official)

  • Symbol: HG24C256CN
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: hg24c256cn-etched.step / hg24c256cn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24c256cn.step / hg24c256cn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (25 pp, sha256 8e3c4bf03cc6d1be, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF