component

HG24C256CMM

Public Made by Adom

by adom

HGSEMI EEPROM, MSOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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HG24C256CMM

HGSEMI · EEPROM · MSOP-8

HG24C256CMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 E0 input Device address input bit 0. Hard-wired to VCC or GND to set the least-significant bit of the 7-bit I2C slave address, allowing up to 8 devices on the same bus.
2 E1 input Device address input bit 1. Hard-wired to VCC or GND to set the middle bit of the 3-bit hard-coded portion of the I2C slave address.
3 E2 input Device address input bit 2. Hard-wired to VCC or GND to set the most-significant bit of the 3-bit hard-coded portion of the I2C slave address.
4 GND power_in Ground reference for the power supply. Must be connected to the system ground.
5 SDA bidirectional Serial Data. Open-drain bidirectional I2C data line used to serially transfer data to and from the device. Requires an external pull-up resistor to VCC. Includes Schmitt trigger and spike filter.
6 SCL input Serial Clock input. Provides the clock for the I2C interface; data on SDA is latched on the rising edge and clocked out on the falling edge of SCL. Supports 400 kHz standard and up to 1 MHz operation.
7 WP input Write Protection. When tied to VCC, the entire memory array (and Identification Page) is write-protected (read-only); when tied to GND or left floating, write operations are enabled. Driving WP high causes data bytes to be NACKed.
8 VCC power_in Device power supply, 1.7V to 5.5V. Operations at invalid VCC voltages may produce spurious results and should not be attempted; a decoupling capacitor to GND is recommended.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HG24C256CMM/TR
  • HG24C256CMMN
  • HG24C256CMMM/TR
  • HG24C256CMMMT/TR

CAD (KiCad official)

  • Symbol: HG24C256CMM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg24c256cmm-etched.step / hg24c256cmm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24c256cmm.step / hg24c256cmm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (25 pp, sha256 9c3fe59cf82149a2, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF