component
HG24C128N
Public Made by Adomby adom
HGSEMI EEPROM, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 3d ago |
| viewers | 3d ago |
| hg24c128n-etched.glb | 3d ago |
| hg24c128n-etched.step | 3d ago |
| hg24c128n-hero.glb | 3d ago |
| hg24c128n-hero.overlay.json | 3d ago |
| hg24c128n.glb | 3d ago |
| hg24c128n.kicad_mod | 3d ago |
| hg24c128n.kicad_sym | 3d ago |
| hg24c128n.lbr | 3d ago |
| hg24c128n.step | 3d ago |
| package.json | 3d ago |
| page.json | 3d ago |
| README.md | 3d ago |
HG24C128N
HGSEMI · EEPROM · DIP-8
HG24C128N from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | E0 | input | Device address input E0, compared against the E0 bit of the device address; left floating it is internally pulled down to Vss. |
| 2 | E1 | input | Device address input E1, compared against the E1 bit of the device address; left floating it is internally pulled down to Vss. |
| 3 | E2 | input | Device address input E2, compared against the E2 bit of the device address; left floating it is internally pulled down to Vss, allowing up to eight devices on one bus. |
| 4 | Vss | power_in | Ground reference for the VCC supply voltage. |
| 5 | SDA | bidirectional | Serial data input and output; open-drain driven and may be wire-OR'ed with other open-drain or open-collector devices, with an external pull-up required. |
| 6 | SCL | input | Serial clock input; data is clocked in on the positive edge and clocked out on the negative edge of SCL. |
| 7 | WCB | input | Write control, active low: connecting WCB to VCC inhibits all write operations, connecting it to Vss allows normal writes, and if left floating it is internally pulled down to Vss. |
| 8 | VCC | power_in | Supply voltage, specified from 1.7 V to 5.5 V in the DC characteristics (absolute maximum -0.5 V to 6.5 V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage Temperature | TSTG | -65 | 150 | °C | 5 | ||
| Ambient operating temperature range | TA | -40 | 125 | °C | 5 | ||
| Supply Voltage | VCC | -0.5 | 6.5 | V | 5 | ||
| Input or output range | VIO | -0.5 | 6.5 | V | 5 | ||
| DC output current | IOL | 5 | mA | SDA=0 | 5 | ||
| Lead Temperature | TL | 260 | °C | Soldering, 10 seconds | 5 | ||
| Supply Voltage | VCC | 1.7 | 5.5 | V | 5 | ||
| Input / Output Capacitance (SDA) | CI/O | 8 | pF | VI/O= Vss | 5 | ||
| Input Capacitance (E0, E1, E2, WCB, SCL) | CIN | 6 | pF | VIN= Vss | 5 | ||
| Standby Current | Isb | 1 | µA | Vcc = 3.3V, TA = 85°C | 5 | ||
| Standby Current | Isb | 2 | µA | Vcc = 5.5V, TA = 85°C | 5 | ||
| Standby Current | Isb | 3 | µA | Vcc = 5.5V, TA = 105°C | 5 | ||
| Supply Current (read) | ICC1 | 0.2 | 0.4 | mA | Vcc = 5.5V, Read at 400Khz | 5 | |
| Supply Current (write) | ICC2 | 0.8 | 1.6 | mA | Vcc = 5.5V, Write at 400Khz | 5 | |
| Input Leakage Current | ILI | 0.1 | 1 | µA | VIN = VCC or Vss | 5 | |
| Output Leakage Current | ILO | 0.05 | 1 | µA | VOUT = VCC or Vss | 5 | |
| Input Low Level | VIL | -0.5 | V | 5 | |||
| Output Low Level (SDA), VCC = 1.7V | VOL1 | 0.2 | V | VCC = 1.7V (SDA); IOL = 0.15 mA | 5 | ||
| Output Low Level (SDA), VCC = 3.0V | VOL2 | 0.4 | V | VCC = 3.0V (SDA); IOL = 2.1 mA | 5 | ||
| The minimum duration for ensuring initialization will occur | tPWD | 300 | us | 8 | |||
| VCC Rise Time | tVR | 1 | 500000 | us/V | 8 |
CAD (KiCad official)
- Symbol:
HG24C128N - Footprint:
Package_DIP:DIP-8_W7.62mm - 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files:
hg24c128n-etched.step/hg24c128n-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hg24c128n.step/hg24c128n.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (20 pp, sha256
17783f1cc8fc6b15, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).