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Contents

README

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HG24C128MM

HGSEMI · EEPROM · MSOP-8

HG24C128MM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input bit 0. Hardwired to VCC or GND to set part of the 3-bit I2C device address, allowing up to 8 devices on a bus. Internally biased to a logic low if left floating (when VCC-plane coupling is <3 pF); tie to GND for coupling >3 pF.
2 A1 input Device address input bit 1. Hardwired to VCC or GND to set part of the 3-bit I2C device address. Internally biased to a logic low if left floating (when VCC-plane coupling is <3 pF); tie to GND for coupling >3 pF.
3 NC unconnected No connect. Leave unconnected.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Serial data line for the two-wire (I2C) interface. Bi-directional, open-drain output requiring an external pull-up resistor; may be wire-ORed with other open-drain/open-collector devices.
6 SCL input Serial clock input for the two-wire (I2C) interface. Positive edge clocks data into the EEPROM and negative edge clocks data out. Supports 1 MHz at 5V and 400 kHz at 1.8/2.7/3.3V.
7 WP input Write protect input. Tie to GND for normal read/write; tie to VCC to inhibit all writes to the memory array (hardware data protection). Internally biased to a logic low if left floating (VCC-plane coupling <3 pF); tie to GND for coupling >3 pF.
8 VCC power_in Positive supply voltage input. Operating range 1.8V to 5.5V. Standby current ISB = 3 µA at 5.5V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HG24C128MM/TR
  • HG24C128MMM/TR
  • HG24C128MMN

CAD (KiCad official)

  • Symbol: HG24C128MM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg24c128mm-etched.step / hg24c128mm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24c128mm.step / hg24c128mm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (14 pp, sha256 a9630ce0b45ca10b, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF