# HG24C08CMM

**HGSEMI** · EEPROM · MSOP-8

HG24C08CMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection. May be left floating or tied to GND. |
| 2 | NC | unconnected | No internal connection. May be left floating or tied to GND. |
| 3 | E2 | input | Device address input. Hard-wired to VCC or GND to set the E2 address bit for bus multi-drop (up to 8 devices with two device-type identifiers). Internally pulled down to GND when left floating. |
| 4 | GND | power_in | Ground reference for the power supply. Connect to system ground. |
| 5 | SDA | bidirectional | Serial data. Open-drain bidirectional I/O for the 2-wire I2C interface; requires an external pull-up to VCC. Data is transferred MSB-first, latched on rising SCL and driven on falling SCL. |
| 6 | SCL | input | Serial clock input for the 2-wire I2C interface. Supports up to 400 kHz standard and 1 MHz high-speed transfer rates; requires an external pull-up to VCC. |
| 7 | WP | input | Hardware write-protect input. Tie to VCC to make the whole memory array read-only; tie to GND to enable writes. Internally pulled down to GND when left floating. When driven high, only the device address and word address bytes are ACKed; data bytes are NACKed. |
| 8 | VCC | power_in | Device power supply, 1.7 V to 5.5 V. Operation outside this range may produce spurious results and must be avoided. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Memory |
| Pins | 8 |

## Ordering variants

Same part, different packaging or reel option.

- `HG24C08CMM`
- `HG24C08CMM/TR`
- `HG24C08CN`
- `HG24C08CM/TR`
- `HG24C08CMT/TR`
- `HG24C08CDQ/TR`
- `HG24C08CM5/TR`

## CAD (KiCad official)

- Symbol: `HG24C08CMM`
- Footprint: `Package_SO:MSOP-8_3x3mm_P0.65mm`
- 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files: `hg24c08cmm-etched.step` / `hg24c08cmm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hg24c08cmm.step` / `hg24c08cmm.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](docs/hg24c08cmm-datasheet.pdf) (25 pp, sha256 `90e20e751b466cc6`, retrieved 2026-08-17, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hg24c08cmm-datasheet.pdf)