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HG24C08AM5
Public Made by Adomby adom
HGSEMI EEPROM, SOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHG24C08AM5
HGSEMI · EEPROM · SOT-23-5
HG24C08AM5 from HGSEMI, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SCL | input | Serial clock input used to clock data into the EEPROM on the positive edge and out of the device on the negative edge. |
| 2 | GND | power_in | Ground. |
| 3 | SDA | bidirectional | Bi-directional serial data pin, open-drain driven and may be wire-ORed with other open-drain or open-collector devices. |
| 4 | VCC | power_in | Power supply, VCC = 1.7V to 5.5V operating range (absolute maximum -0.3V to +6.5V). |
| 5 | WP | input | Write protect input: connected to GND allows normal read/write operations, connected to VCC enables hardware write protection of the full array. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOT-23-5 |
| Category | Memory |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Current VCC=5.0V | ICC2 | 1.5 | 2 | mA | VCC=5V;WRITE at 400KHZ | 8 | |
| Supply Current VCC=5.5V | ISB1 | 1.5 | 2 | μA | VIN=VCC or VSS/VCC=1.7V | 8 | |
| Input Leakage Current | IL1 | 0.1 | 30 | μA | VIN=VCC or VSS | 8 | |
| Output Leakage Current | ILO | 0.05 | 2 | μA | VOUT=VCC or VSS | 8 | |
| Input Low Level | VIL1 | -0.3 | V | VCC=1.8V to 5.5V | 8 | ||
| Output Low Level VCC=1.7V | VOL1 | 0.2 | V | IOL=0.15mA | 8 | ||
| Output Low Level VCC=5.0V | VOL2 | 0.4 | V | IOL=3.0mA | 8 | ||
| Input/Output Capacitance(SDA) | CI/O | 8 | pF | VIO=0V | 8 | ||
| Input Capacitance(SCL) | CIN | 6 | pF | VIN=0V | 8 | ||
| DC Supply Voltage | -0.3 | 6.5 | V | 8 | |||
| Operating Ambient Temperature | -40 | 85 | ℃ | 8 | |||
| Storage Temperature | -65 | 150 | ℃ | 8 | |||
| Lead Temperature (Soldering, 10 seconds) | 245 | ℃ | Soldering, 10 seconds | 8 | |||
| Supply Voltage (recommended operating range) | VCC | 1.7 | 5.5 | V | TA = -40℃ to +85℃ | 8 | |
| Clock Frequency, SCL | fSCL | 400 | KHZ | 1.7V≤VCC﹤2.5V | 9 | ||
| Clock Frequency, SCL | fSCL | 1000 | KHZ | 2.5V≤VCC﹤5.5V | 9 | ||
| Clock Pulse Width Low | tLOW | 1.2 | μs | 1.7V≤VCC﹤2.5V | 9 | ||
| Clock Pulse Width Low | tLOW | 0.6 | μs | 2.5V≤VCC﹤5.5V | 9 | ||
| Clock Pulse Width High | tHIGH | 0.6 | μs | 1.7V≤VCC﹤2.5V | 9 | ||
| Clock Pulse Width High | tHIGH | 0.4 | μs | 2.5V≤VCC﹤5.5V | 9 | ||
| Noise Suppression Time | tI | 50 | ns | 1.7V≤VCC﹤2.5V | 9 | ||
| Clock Low to Data Out Valid | tAA | 0.1 | 0.9 | μs | 1.7V≤VCC﹤2.5V | 9 | |
| Clock Low to Data Out Valid | tAA | 0.05 | 0.9 | μs | 2.5V≤VCC﹤5.5V | 9 | |
| Time the bus must be free before a new transmission can start | tBUF | 1.2 | μs | 1.7V≤VCC﹤2.5V | 9 | ||
| Time the bus must be free before a new transmission can start | tBUF | 0.5 | μs | 2.5V≤VCC﹤5.5V | 9 | ||
| Start Hold Time | tHD:STA | 0.6 | μs | 1.7V≤VCC﹤2.5V | 9 | ||
| Start Hold Time | tHD:STA | 0.25 | μs | 2.5V≤VCC﹤5.5V | 9 | ||
| Start Setup Time | tSU:DAT | 0.6 | μs | 1.7V≤VCC﹤2.5V | 9 | ||
| Start Setup Time | tSU:DAT | 0.25 | μs | 2.5V≤VCC﹤5.5V | 9 | ||
| Data In Hold Time | tHD:DAT | 0 | μs | 1.7V≤VCC﹤2.5V | 9 | ||
| Data in Setup Time | tSU:DAT | 100 | ns | 1.7V≤VCC﹤2.5V | 9 | ||
| Input Rise Time(1) | tR | 0.3 | μs | 1.7V≤VCC﹤2.5V | 9 | ||
| Input Fall Time(1) | tF | 0.3 | μs | 1.7V≤VCC﹤2.5V | 9 | ||
| Input Fall Time(1) | tF | 0.1 | μs | 2.5V≤VCC﹤5.5V | 9 | ||
| Stop Setup Time | tSu:STO | 0.6 | μs | 1.7V≤VCC﹤2.5V | 9 | ||
| Stop Setup Time | tSu:STO | 0.25 | μs | 2.5V≤VCC﹤5.5V | 9 | ||
| Data Out Hold Time | tDH | 50 | ns | 1.7V≤VCC﹤2.5V | 9 | ||
| Write Cycle Time | twR | 3.3 | 4 | ms | 1.7V≤VCC﹤2.5V | 9 | |
| Thermal Resistance, Junction-to-Ambient | RθJA | 125 | ℃/W | 8 |
CAD (KiCad official)
- Symbol:
HG24C08AM5 - Footprint:
Package_TO_SOT_SMD:SOT-23-5 - 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
hg24c08am5-etched.step/hg24c08am5-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hg24c08am5.step/hg24c08am5.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (15 pp, sha256
bc083340c6262a31, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).