component

HG24C04CMM

Public Made by Adom

by adom

HGSEMI EEPROM, MSOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Datasheet

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Contents

README

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HG24C04CMM

HGSEMI · EEPROM · MSOP-8

HG24C04CMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection. Leave floating or tie to GND for best noise immunity.
2 E1 input Device address input bit 1. Hard-wire to VCC or GND to set the slave address bit (E1) used in the I2C device address byte. Internally pulled to GND if left floating.
3 E2 input Device address input bit 2. Hard-wire to VCC or GND to set the slave address bit (E2) used in the I2C device address byte. Internally pulled to GND if left floating.
4 GND power_in Ground reference for the power supply. Connect to system ground.
5 SDA bidirectional I2C serial data. Open-drain bidirectional line used to transfer address and data between master and device; requires an external pull-up resistor to VCC.
6 SCL input I2C serial clock input. Data on SDA is latched on the rising edge and clocked out on the falling edge of SCL. Requires an external pull-up resistor to VCC.
7 WP input Hardware write-protect input. When tied to VCC the entire memory array is write-protected (read-only); when tied to GND writes are enabled. Internally pulled to GND if left floating.
8 VCC power_in Device power supply, 1.7 V to 5.5 V. Decouple with a local bypass capacitor to GND.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HG24C04CMM
  • HG24C04CMM/TR
  • HG24C04CMMM
  • HG24C04CMMM/TR
  • HG24C04CMMN
  • HG24C04CMMMT
  • HG24C04CMMMT/TR
  • HG24C04CMMDQ
  • HG24C04CMMDQ/TR
  • HG24C04CMMM5
  • HG24C04CMMM5/TR

CAD (KiCad official)

  • Symbol: HG24C04CMM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg24c04cmm-etched.step / hg24c04cmm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24c04cmm.step / hg24c04cmm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (25 pp, sha256 595b3211a0b1550b, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF