component

HG24C02MM

Public Made by Adom

by adom

HGSEMI EEPROM, MSOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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HG24C02MM

HGSEMI · EEPROM · MSOP-8

HG24C02MM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 E0 input Hardware slave-address bit 0. Tie to VCC or VSS to set the least-significant device-address bit; internally pulled down to VSS if left floating so a total of up to 8 devices can share the bus.
2 E1 input Hardware slave-address bit 1. Tie to VCC or VSS to set the middle device-address bit; internally pulled down to VSS if left floating.
3 E2 input Hardware slave-address bit 2. Tie to VCC or VSS to set the most-significant device-address bit; internally pulled down to VSS if left floating.
4 VSS power_in Ground reference for the VCC supply.
5 SDA bidirectional I2C serial data. Open-drain bidirectional line for serial data transfer; requires an external pull-up resistor to VCC and may be wire-OR'ed with other open-drain devices on the bus.
6 SCL input I2C serial clock input. Positive edge clocks data into the device; negative edge clocks data out. Supports 100 kHz, 400 kHz, and 1 MHz modes.
7 WCB input Write control (active-low enable). When tied to VCC, all writes to the memory array are inhibited; when tied to VSS, normal write operation is permitted. Internally pulled down to VSS if left floating.
8 VCC power_in Positive supply voltage, 1.7 V to 5.5 V (absolute max 6.5 V). Read ICC typ 0.2 mA @ 400 kHz; write ICC typ 0.8 mA @ 400 kHz; standby ~1 uA @ 3.3 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HG24C02MM/TR
  • HG24C02N
  • HG24C02M/TR
  • HG24C02M-4K/TR
  • HG24C02MT/TR
  • HG24C02DQ3/TR
  • HG24C02DQ2/TR
  • HG24C02M5/TR

CAD (KiCad official)

  • Symbol: HG24C02MM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg24c02mm-etched.step / hg24c02mm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24c02mm.step / hg24c02mm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (18 pp, sha256 ac9e22c1abbbd678, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF