component
HG24C02CM
Public Made by Adomby adom
HGSEMI EEPROM, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHG24C02CM
HGSEMI · EEPROM · SOP-8
HG24C02CM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | E0 | input | Device address input that can be tied to VCC or GND to set the device address (up to eight devices per bus); internally pulled down to GND if left floating. |
| 2 | E1 | input | Device address input that can be tied to VCC or GND to set the device address (up to eight devices per bus); internally pulled down to GND if left floating. |
| 3 | E2 | input | Device address input that can be tied to VCC or GND to set the device address (up to eight devices per bus); internally pulled down to GND if left floating. |
| 4 | GND | power_in | Ground reference for the power supply, to be connected to system ground. |
| 5 | SDA | bidirectional | Serial data pin, open-drain bidirectional input/output used to transfer data to and from the device. |
| 6 | SCL | input | Serial clock input; input data on SDA is latched on the rising edge of SCL and output data is clocked out on the falling edge. |
| 7 | WP | input | Write-protect input: connected to VCC the whole memory array is read-only, connected to GND writes are enabled; internally pulled down to GND if left floating. |
| 8 | VCC | power_in | Device power supply, 1.7V to 5.5V; operation at invalid VCC voltages may produce spurious results. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 1.7 | 5.5 | V | 20 | ||
| Operating Temperature Range | TA | -40 | 105 | °C | 20 | ||
| Ambient temperature with power applied | -55 | 130 | °C | 20 | |||
| Storage temperature | TSTG | -65 | 150 | °C | 20 | ||
| Supply voltage | VCC | -0.5 | 6 | V | 20 | ||
| Voltage on input pins | VIN | -0.5 | 6 | V | 20 | ||
| Electrostatic pulse (human body model) | VESD | 5000 | V | 20 | |||
| Lead Temperature (Soldering) | TL | 245 | °C | Soldering, 10 seconds | 20 | ||
| Supply Current (Read) | ICC1 | 0.1 | mA | VCC= 1.7V, Read at 1MHz | 20 | ||
| Supply Current (Read) | ICC1 | 0.4 | mA | VCC= 5.5V, Read at 400 kHz | 20 | ||
| Supply Current (Read) | ICC1 | 0.5 | mA | VCC= 5.5V, Read at 1MHz | 20 | ||
| Supply Current (Write) | ICC2 | 0.2 | mA | VCC= 1.7V, Write at 400 kHz | 20 | ||
| Supply Current (Write) | ICC2 | 0.5 | mA | VCC= 5.5V, Write at 400 kHz | 20 | ||
| Standby Current | ISB | 0.5 | μA | VCC = 1.7V, VIN = VCC or GND | 20 | ||
| Standby Current | ISB | 1 | μA | VCC = 5.5V, VIN = VCC or GND | 20 | ||
| Input Leakage Current | ILI | 1 | μA | VIN = VCC or GND | 20 | ||
| Output Leakage Current | ILO | 1 | μA | VOUT = VCC or GND | 20 | ||
| Input Low-Level Voltage (SDA, SCL) | VIL | -0.5 | V | 20 | |||
| Low-Level Output Voltage | VOL1 | 0.4 | V | VCC> 2V, IOL= 3mA | 20 | ||
| Low-Level Output Voltage | VOL2 | 0.2 | V | VCC≤2V, IOL= 2mA | 20 | ||
| Clock Frequency, SCL | fSCL | 400 | kHz | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Clock Frequency, SCL | fSCL | 1000 | kHz | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Clock Pulse Width Low | tLOW | 1300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Clock Pulse Width Low | tLOW | 600 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Clock Pulse Width High | tHIGH | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Clock Pulse Width High | tHIGH | 260 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| SDA Rise Time | tR | 300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| SDA(Out) Fall Time | tF | 300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| SDA(Out) Fall Time | tF | 100 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Start Hold Time | tHD.STA | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Start Hold Time | tHD.STA | 250 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Start Setup Time | tSU.STA | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Start Setup Time | tSU.STA | 250 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Stop Setup Time | tSU.STO | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Stop Setup Time | tSU.STO | 250 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Bus Free Time between Stop and Next Start | tBUF | 1300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Bus Free Time between Stop and Next Start | tBUF | 500 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Data In Hold Time | tHD.DI | 0 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Data In Setup Time | tSU.DAT | 100 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Data In Setup Time | tSU.DAT | 50 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Data Out Hold Time | tHD.DAT | 50 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| SCL Low to Data Out Valid | tAA | 100 | 900 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | |
| SCL Low to Data Out Valid | tAA | 50 | 500 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | |
| WP Pin Setup Time | tSU.WP | 1200 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| WP Pin Setup Time | tSU.WP | 600 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| WP Pin Hold Time | tHD.WP | 1200 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| WP Pin Hold Time | tHD.WP | 600 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Write Cycle Time | tWR | 3 | ms | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Noise Suppression Time | tI | 50 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Input/output Capacitance (SDA) | CI/O | 8 | pF | VI/O = 0V | 22 | ||
| Input Capacitance (other Pins) | CIN | 6 | pF | VIN = 0V | 22 | ||
| Data Retention | DR | 200 | year | TA = +25°C | 22 |
CAD (KiCad official)
- Symbol:
HG24C02CM - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hg24c02cm-etched.step/hg24c02cm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hg24c02cm.step/hg24c02cm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (27 pp, sha256
9dbf6583c4c248f6, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).