component
HFMC308
Public Made by Adomby adom
LRC Diodes - General Purpose, SMC. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownHFMC308
LRC · Diodes - General Purpose · SMC
HFMC308 from LRC, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LRC |
| Package | SMC |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | 1000 | V | Ta = 25°C | 1 | ||
| Maximum RMS voltage | VRMS | 700 | V | Ta = 25°C | 1 | ||
| Maximum DC blocking voltage | VDC | 1000 | V | Ta = 25°C | 1 | ||
| Maximum average forward rectified current | IF(AV) | 3 | A | TC = 75°C | 1 | ||
| Peak forward surge current | IFSM | 80 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) | 1 | ||
| Operating junction and storage temperature range | TJ, TSTG | -50 | 150 | °C | 1 | ||
| Maximum instantaneous forward voltage | VF | 1.7 | V | IF = 3.0A, Ta = 25°C | 1 | ||
| Maximum DC reverse current | IR | 5 | µA | TA = 25°C, at rated DC blocking voltage | 1 | ||
| Maximum DC reverse current | IR | 100 | µA | TJ = 125°C, at rated DC blocking voltage | 1 | ||
| Typical reverse recovery time | trr | 75 | ns | IF = 0.5A, IR = 1.0A, IRR = 0.25A | 1 | ||
| Typical junction capacitance | CJ | 15 | pF | 4.0V, 1MHz | 1 | ||
| Typical thermal resistance, junction to ambient | RθJA | 80 | ℃/W | Mounted on 0.31 x 0.31" (8.0 x 8.0mm) copper pads to each terminal | 1 | ||
| Typical thermal resistance, junction to case | RθJC | 20 | ℃/W | Mounted on 0.31 x 0.31" (8.0 x 8.0mm) copper pads to each terminal | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 1. Mounted on 0.31 x 0.31” (8.0 x 8.0mm) copper pads to each terminal | 1 |
CAD (KiCad official)
- Symbol:
HFMC308 - Footprint:
Diode_SMD:D_SMC - 3D model: SMC (KiCad packages3D, STEP)
- 3D model files:
hfmc308-etched.step/hfmc308-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hfmc308.step/hfmc308.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: LRC datasheet (3 pp, sha256
49180626a79fcca0, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).