component
HESDNC3V3B1CL-A
Public Made by Adomby adom
HXY MOSFET ESD Protection Devices, SOD-523. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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HESDNC3V3B1CL-A
HXY MOSFET · ESD Protection Devices · SOD-523
HESDNC3V3B1CL-A from HXY MOSFET, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOD-523 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power | PPP | 100 | W | tp = 8/20 us | 1 | ||
| Maximum lead temperature for soldering | TL | 260 | °C | during 10s | 1 | ||
| Storage Temperature Range | Tstg | -55 | 155 | °C | 1 | ||
| Operating Temperature Range | Top | -40 | 125 | °C | 1 | ||
| Maximum junction temperature | Tj | 150 | °C | 1 | |||
| IEC61000-4-2 ESD air discharge | -15 | 15 | KV | IEC61000-4-2 air discharge | 1 | ||
| IEC61000-4-2 ESD contact discharge | -8 | 8 | KV | IEC61000-4-2 contact discharge | 1 | ||
| IEC61000-4-4 EFT | 40 | A | IEC61000-4-4 | 1 | |||
| ESD Voltage Per Human Body Model | 16 | KV | Human Body Model | 1 | |||
| Reverse Working Voltage | VRWM | 3.3 | V | 2 | |||
| Reverse Leakage Current | IR | 1 | uA | @ VRWM | 2 | ||
| Breakdown Voltage | VBR | 5.6 | V | @ IT = 1.0 mA, pulse test, 25°C | 2 | ||
| Clamping Voltage | VC | 11 | V | @ Max IPP, surge waveform per Figure 1 | 2 | ||
| Peak Pulse Current | IPP | 9 | A | Surge current waveform per Figure 1 | 2 | ||
| Peak Pulse Power | PPK | 100 | W | Surge waveform per Figure 1 | 2 | ||
| Device Capacitance | C | 15 | 7.8 | pF | 2 |
CAD (KiCad official)
- Symbol:
HESDNC3V3B1CL-A - Footprint:
Diode_SMD:D_SOD-523 - 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files:
hesdnc3v3b1cl-a-etched.step/hesdnc3v3b1cl-a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hesdnc3v3b1cl-a.step/hesdnc3v3b1cl-a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (4 pp, sha256
81190b26832bd897, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HESDNC3V3B1CL-A
**HXY MOSFET** · ESD Protection Devices · SOD-523
HESDNC3V3B1CL-A from HXY MOSFET, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOD-523 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power | PPP | | | 100 | W | tp = 8/20 us | 1 |
| Maximum lead temperature for soldering | TL | | | 260 | °C | during 10s | 1 |
| Storage Temperature Range | Tstg | -55 | | 155 | °C | | 1 |
| Operating Temperature Range | Top | -40 | | 125 | °C | | 1 |
| Maximum junction temperature | Tj | | | 150 | °C | | 1 |
| IEC61000-4-2 ESD air discharge | | -15 | | 15 | KV | IEC61000-4-2 air discharge | 1 |
| IEC61000-4-2 ESD contact discharge | | -8 | | 8 | KV | IEC61000-4-2 contact discharge | 1 |
| IEC61000-4-4 EFT | | | | 40 | A | IEC61000-4-4 | 1 |
| ESD Voltage Per Human Body Model | | | | 16 | KV | Human Body Model | 1 |
| Reverse Working Voltage | VRWM | | | 3.3 | V | | 2 |
| Reverse Leakage Current | IR | | | 1 | uA | @ VRWM | 2 |
| Breakdown Voltage | VBR | 5.6 | | | V | @ IT = 1.0 mA, pulse test, 25°C | 2 |
| Clamping Voltage | VC | | | 11 | V | @ Max IPP, surge waveform per Figure 1 | 2 |
| Peak Pulse Current | IPP | | | 9 | A | Surge current waveform per Figure 1 | 2 |
| Peak Pulse Power | PPK | | | 100 | W | Surge waveform per Figure 1 | 2 |
| Device Capacitance | C | | 15 | 7.8 | pF | | 2 |
## CAD (KiCad official)
- Symbol: `HESDNC3V3B1CL-A`
- Footprint: `Diode_SMD:D_SOD-523`
- 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files: `hesdnc3v3b1cl-a-etched.step` / `hesdnc3v3b1cl-a-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hesdnc3v3b1cl-a.step` / `hesdnc3v3b1cl-a.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HXY MOSFET datasheet](docs/hesdnc3v3b1cl-a-datasheet.pdf) (4 pp, sha256 `81190b26832bd897`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hesdnc3v3b1cl-a-datasheet.pdf)