# HE24C64TSH

**HUAHONG** · EEPROM · TSSOP-8

HE24C64TSH from HUAHONG, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Device address input hard wired to select one of eight 64K devices on a single bus; must match the A0 bit of the device address word. |
| 2 | A1 | input | Device address input hard wired to select one of eight 64K devices on a single bus; must match the A1 bit of the device address word. |
| 3 | A2 | input | Device address input hard wired to select one of eight 64K devices on a single bus; must match the A2 bit of the device address word. |
| 4 | GND | power_in | Ground. |
| 5 | SDA | bidirectional | Bidirectional serial data pin, open-drain driven, may be wire-ORed with other open-drain or open-collector devices and needs an external pull-up. |
| 6 | SCL | input | Serial clock input that clocks data into the EEPROM on the positive edge and out on the negative edge, with up to 1 MHz at 2.5V to 5.5V. |
| 7 | WP | input | Write protect input: normal read/write when connected to GND, and the full 64K array is write-protected when connected to VCC. |
| 8 | VCC | power_in | Power supply, 1.7V to 5.5V operating range (absolute maximum -0.3V to +6.5V). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HUAHONG |
| Package | TSSOP-8 |
| Category | Memory |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | Vcc | 1.7 |  | 5.5 | V |  | 9 |
| DC Supply Voltage |  | -0.3 |  | 6.5 | V |  | 9 |
| Input / Output Voltage |  | -0.3 |  |  | V | Min referenced to GND; max printed as VCC+0.3V | 9 |
| Operating Ambient Temperature |  | -40 |  | 85 | ℃ |  | 1 |
| Storage Temperature |  | -65 |  | 150 | ℃ |  | 9 |
| Supply Current | ICC1 |  | 0.14 | 0.3 | mA | VCC = 5.0V; READ at 400KHz | 9 |
| Supply Current | ICC2 |  | 0.28 | 0.5 | mA | VCC = 5.0V; WRITE at 400KHz | 9 |
| Standby Current | ISB |  | 0.03 | 0.5 | μA | VIN=VCC or GND | 9 |
| Input Leakage Current | ILI |  | 0.1 | 1 | μA | VIN=VCC or GND | 9 |
| Output Leakage Current | ILO |  | 0.05 | 1 | μA | VOUT=VCC or GND | 9 |
| Input Low Level | VIL1 | -0.3 |  |  | V | Vcc=1.7V to 5.5V | 9 |
| Output Low Level | VOL3 |  |  | 0.4 | V | VCC =5.0V; IOL=3.0mA | 9 |
| Output Low Level | VOL1 |  |  | 0.2 | V | VCC =1.7V; IOL=0.15mA | 9 |
| Input/Output Capacitance (SDA) | CI/O |  |  | 8 | pF | TA=25℃, f=1.0 MHz, VCC=+1.7V; VI/O = 0V | 10 |
| Input Capacitance (A0, A1, A2, SCL) | CIN |  |  | 6 | pF | TA=25℃, f=1.0 MHz, VCC=+1.7V; VIN = 0V | 10 |
| Clock Frequency, SCL | fSCL |  |  | 400 | KHz | 1.7V < Vcc < 2.5V | 10 |
| Clock Frequency, SCL | fSCL |  |  | 1000 | KHz | 2.5V < Vcc < 5.5V | 10 |
| Clock Pulse Width Low | tLOW | 1.2 |  |  | s | 1.7V < Vcc < 2.5V | 10 |
| Clock Pulse Width Low | tLOW | 0.6 |  |  | s | 2.5V < Vcc < 5.5V | 10 |
| Clock Pulse Width High | tHIGH | 0.6 |  |  | s | 1.7V < Vcc < 2.5V | 10 |
| Clock Pulse Width High | tHIGH | 0.4 |  |  | s | 2.5V < Vcc < 5.5V | 10 |
| Noise Suppression Time | tI |  |  | 50 | ns | 1.7V < Vcc < 2.5V | 10 |
| Noise Suppression Time | tI |  |  | 40 | ns | 2.5V < Vcc < 5.5V | 10 |
| Clock Low to Data Out Valid | tAA | 0.05 |  | 0.9 | s | 1.7V < Vcc < 2.5V | 10 |
| Clock Low to Data Out Valid | tAA | 0.05 |  | 0.55 | s | 2.5V < Vcc < 5.5V | 10 |
| Time the bus must be free before a new transmission can start | tBUF | 0.5 |  |  | s | 1.7V < Vcc < 2.5V | 10 |
| Start Hold Time | tHD.STA | 0.25 |  |  | s | 1.7V < Vcc < 2.5V | 10 |
| Start Setup Time | tSU.STA | 0.25 |  |  | s | 1.7V < Vcc < 2.5V | 10 |
| Data In Hold Time | tHD.DAT | 0 |  |  | s | 1.7V < Vcc < 2.5V | 10 |
| Data In Setup Time | tSU.DAT | 100 |  |  | ns | 1.7V < Vcc < 2.5V | 10 |
| Inputs Rise Time | tR |  |  | 0.3 | us | 1.7V < Vcc < 2.5V | 10 |
| Inputs Fall Time | tF |  |  | 0.3 | us | 1.7V < Vcc < 2.5V | 10 |
| Stop Setup Time | tSU.STO | 0.25 |  |  | s | 1.7V < Vcc < 2.5V | 10 |
| Data Out Hold Time | tDH | 50 |  |  | ns | 1.7V < Vcc < 2.5V | 10 |
| Write Cycle Time | tWR |  | 1.9 | 3 | ms | 1.7V < Vcc < 2.5V; 5.0V, 25℃, Byte Mode | 10 |

## CAD (KiCad official)

- Symbol: `HE24C64TSH`
- Footprint: `Package_SO:TSSOP-8_3x3mm_P0.65mm`
- 3D model: TSSOP-8 (KiCad packages3D, STEP)
- 3D model files: `he24c64tsh-etched.step` / `he24c64tsh-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `he24c64tsh.step` / `he24c64tsh.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HUAHONG datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588917105516793856) (16 pp, sha256 `78a38da23411c3f9`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/he24c64tsh-datasheet.pdf)