component

HD3SS3212RKSR

Public Made by Adom

by adom

Texas Instruments Analog Switches - Special Purpose, TQFN-20-EP(2.5x4.5). KiCad symbol, footprint and 3D as used on Adom boards; pin functions from the manufacturer datasheet.

componentinterfacehd3ss3212rksrboard-derived

Verified HD3SS3212RKSR

by Claude, at Caleb Taylor's request · last 27 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 4 records

27 Oct 2026Claude, at Caleb Taylor's requestValidated against TI's HD3SS3212 datasheet (SLASE74F, revised September 2016)files match
SymbolFootprint3D modelPinsfor all variants
  • ✓Datasheet: the page already carries TI's current edition (SLASE74F, May 2015, revised September 2016; sha256 111def72b5f44bae matches ti.com/lit/ds/symlink/hd3ss3212.pdf fetched 2026-10-27); edition now recorded
  • ✓Pins 1-20 match the Pin Functions table (p.4-5) and the RKS 20-pin VQFN top view (p.4) by number; renamed to the datasheet's spelling: 2 OEN -> OEn (printed without an overbar), 3 A0P -> A0p, 4 A0N -> A0n, 7 A1P -> A1p, 8 A1N -> A1n, 12 C1N -> C1n, 13 C1P -> C1p, 14 C0N -> C0n, 15 C0P -> C0p, 16 B1N -> B1n, 17 B1P -> B1p, 18 B0N -> B0n, 19 B0P -> B0p; RSVD1, RSVD2, SEL, VCC (printed V with subscript CC), GND 5/11/20 unchanged
  • •Pin 21 is the exposed thermal pad, absent from the Pin Functions table: renamed PAD -> GND (power_in) because the design procedure says 'The thermal pad must be connected to ground' (p.14) and the package notes require it soldered to the PCB (p.20)
  • ✓Pin types agree with the table: VCC P and GND G -> power_in, OEn and SEL I -> input, high-speed ports I/O -> bidirectional, RSVD1/RSVD2 O -> output
  • ✓All 21 descriptions rewritten to the table wording (p.4-5) plus its footnote on the 20-kΩ pulldowns; pin 21 described from p.14 and p.20; earlier text cited p.4 for Vdiff/Vcm/VIH limits that are on p.5 and added a <20 µW figure not in the pin table
  • ✓Footprint vs RKS0020A (p.20-21): 21 pads, e = 0.50 mm; pin 1 on the top edge at the left (top view), 2-9 down the left side, 10/11 on the bottom edge, 12-19 up the right side, 20 top right, as the p.4 pinout; side pads 0.86 x 0.27 at x = ±1.185 (centres 2.37 apart vs TI's (2.3)), end pads at y = ±2.185 (4.37 vs TI's (4.3)); TI's example pads are 0.6 x 0.25, so these are longer and slightly wider and cover terminals b 0.2-0.3, L 0.3-0.5 at the 2.4-2.6 x 4.4-4.6 body edge; pad width 0.27 is under b max 0.30 (TI's own land is 0.25)
  • ✓Exposed pad 21 is 1.00 x 3.00 mm at the centre, equal to the drawing's exposed thermal pad 1 ±0.1 x 3 ±0.1 and TI's (1) x (3) land (p.20-21)
  • •3D body 2.50 x 4.50 x 0.80 mm against 2.4-2.6 x 4.4-4.6, 1 max (p.20); long axis along the footprint's y, pin-1 mark at the top-left end (matching GLB), seated on z = 0. The model is TI's generic RKS package model (source name LSF0108RKSR), not part-specific
  • ✓DigiKey 296-42174-2-ND (tape and reel; DigiKey product URL names HD3SS3212RKSR) and Mouser 595-HD3SS3212RKSR kept and added to specs; orderable HD3SS3212RKSR is the 0 to 70 °C RKS 20-pin part (p.4)
  • ✓Symbol and footprint Datasheet properties point at the manufacturer datasheet URL
  • ✓Symbol Datasheet / MPN / Manufacturer / DigiKey / Mouser / LCSC properties agree with page.json; footprint Datasheet property points at the manufacturer datasheet URL
  • ✓component-page-verify: all checks pass
Evidencedatasheet (Texas Instruments)
Verified files✓ hd3ss3212rksr.kicad_sym✓ hd3ss3212rksr.kicad_mod✓ hd3ss3212rksr.step
9 Oct 2026Claude (AI build)1 of 21 pins have no datasheet description yet (pins 21).superseded
reviewfor all variants
  • •1 of 21 pins have no datasheet description yet (pins 21).
9 Oct 2026Claude (AI build)The source 3D model is TI's generic RKS package model (named LSF0108RKSR); body dimensions...superseded
reviewfor all variants
  • •The source 3D model is TI's generic RKS package model (named LSF0108RKSR); body dimensions match the RKS package but it is not part-specific.
9 Oct 2026Claude (AI build)Automated build checks (awaiting human validation)superseded
SymbolFootprint3D modelPinsfor all variants
  • ✓Footprint extracted pad-for-pad from the source board and normalized to the footprint frame (back-side parts un-mirrored)
  • ✓3D model seated z=0 at footprint origin (placement inverse; method centroid-matched to KiCad library models on 59 cases)
  • ✓adom-lbr generate + lint passed
  • •20 of 21 pins described from the datasheet (adom-ds2sf, page-cited)
  • •Not yet checked by a person: land pattern vs datasheet, pin-1/orientation, 3D body vs drawing
Evidencedatasheet
Verified files! hd3ss3212rksr.kicad_sym! hd3ss3212rksr.kicad_mod✓ hd3ss3212rksr.step
Spot something wrong? Report it as an issue Propose a fix Records are signed by members of adom.
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hd3ss3212rksr / hd3ss3212rksr.kicad_mod
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Caleb Publish 0.1.2 54d412a 1d ago
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	(pad "15" smd roundrect
		(at 1.185 0.25)
		(size 0.86 0.27)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.102)
	)
	(pad "16" smd roundrect
		(at 1.185 -0.25)
		(size 0.86 0.27)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.102)
	)
	(pad "17" smd roundrect
		(at 1.185 -0.750001)
		(size 0.86 0.27)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.102)
	)
	(pad "18" smd roundrect
		(at 1.185 -1.25)
		(size 0.86 0.27)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.102)
	)
	(pad "19" smd roundrect
		(at 1.185 -1.749999)
		(size 0.86 0.27)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.102)
	)
	(pad "20" smd roundrect
		(at 0.25 -2.185)
		(size 0.27 0.86)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.102)
	)
	(pad "21" smd rect (at 0 0) (size 1 3) (layers "F.Cu" "F.Mask") (solder_mask_margin 0.102))
	(embedded_fonts no)
	(model "${KIPRJMOD}/hd3ss3212rksr.step"
		(offset (xyz 0 0 0))
		(scale (xyz 1 1 1))
		(rotate (xyz 0 0 0))
	)
)