component

HD3SS3212RKSR

Public Made by Adom

by adom

Texas Instruments Analog Switches - Special Purpose, TQFN-20-EP(2.5x4.5). KiCad symbol, footprint and 3D as used on Adom boards; pin functions from the manufacturer datasheet.

componentinterfacehd3ss3212rksrboard-derived

Verified HD3SS3212RKSR

by Claude, at Caleb Taylor's request · last 27 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 4 records

27 Oct 2026Claude, at Caleb Taylor's requestValidated against TI's HD3SS3212 datasheet (SLASE74F, revised September 2016)files match
SymbolFootprint3D modelPinsfor all variants
  • ✓Datasheet: the page already carries TI's current edition (SLASE74F, May 2015, revised September 2016; sha256 111def72b5f44bae matches ti.com/lit/ds/symlink/hd3ss3212.pdf fetched 2026-10-27); edition now recorded
  • ✓Pins 1-20 match the Pin Functions table (p.4-5) and the RKS 20-pin VQFN top view (p.4) by number; renamed to the datasheet's spelling: 2 OEN -> OEn (printed without an overbar), 3 A0P -> A0p, 4 A0N -> A0n, 7 A1P -> A1p, 8 A1N -> A1n, 12 C1N -> C1n, 13 C1P -> C1p, 14 C0N -> C0n, 15 C0P -> C0p, 16 B1N -> B1n, 17 B1P -> B1p, 18 B0N -> B0n, 19 B0P -> B0p; RSVD1, RSVD2, SEL, VCC (printed V with subscript CC), GND 5/11/20 unchanged
  • •Pin 21 is the exposed thermal pad, absent from the Pin Functions table: renamed PAD -> GND (power_in) because the design procedure says 'The thermal pad must be connected to ground' (p.14) and the package notes require it soldered to the PCB (p.20)
  • ✓Pin types agree with the table: VCC P and GND G -> power_in, OEn and SEL I -> input, high-speed ports I/O -> bidirectional, RSVD1/RSVD2 O -> output
  • ✓All 21 descriptions rewritten to the table wording (p.4-5) plus its footnote on the 20-kΩ pulldowns; pin 21 described from p.14 and p.20; earlier text cited p.4 for Vdiff/Vcm/VIH limits that are on p.5 and added a <20 µW figure not in the pin table
  • ✓Footprint vs RKS0020A (p.20-21): 21 pads, e = 0.50 mm; pin 1 on the top edge at the left (top view), 2-9 down the left side, 10/11 on the bottom edge, 12-19 up the right side, 20 top right, as the p.4 pinout; side pads 0.86 x 0.27 at x = ±1.185 (centres 2.37 apart vs TI's (2.3)), end pads at y = ±2.185 (4.37 vs TI's (4.3)); TI's example pads are 0.6 x 0.25, so these are longer and slightly wider and cover terminals b 0.2-0.3, L 0.3-0.5 at the 2.4-2.6 x 4.4-4.6 body edge; pad width 0.27 is under b max 0.30 (TI's own land is 0.25)
  • ✓Exposed pad 21 is 1.00 x 3.00 mm at the centre, equal to the drawing's exposed thermal pad 1 ±0.1 x 3 ±0.1 and TI's (1) x (3) land (p.20-21)
  • •3D body 2.50 x 4.50 x 0.80 mm against 2.4-2.6 x 4.4-4.6, 1 max (p.20); long axis along the footprint's y, pin-1 mark at the top-left end (matching GLB), seated on z = 0. The model is TI's generic RKS package model (source name LSF0108RKSR), not part-specific
  • ✓DigiKey 296-42174-2-ND (tape and reel; DigiKey product URL names HD3SS3212RKSR) and Mouser 595-HD3SS3212RKSR kept and added to specs; orderable HD3SS3212RKSR is the 0 to 70 °C RKS 20-pin part (p.4)
  • ✓Symbol and footprint Datasheet properties point at the manufacturer datasheet URL
  • ✓Symbol Datasheet / MPN / Manufacturer / DigiKey / Mouser / LCSC properties agree with page.json; footprint Datasheet property points at the manufacturer datasheet URL
  • ✓component-page-verify: all checks pass
Evidencedatasheet (Texas Instruments)
Verified files✓ hd3ss3212rksr.kicad_sym✓ hd3ss3212rksr.kicad_mod✓ hd3ss3212rksr.step
9 Oct 2026Claude (AI build)1 of 21 pins have no datasheet description yet (pins 21).superseded
reviewfor all variants
  • •1 of 21 pins have no datasheet description yet (pins 21).
9 Oct 2026Claude (AI build)The source 3D model is TI's generic RKS package model (named LSF0108RKSR); body dimensions...superseded
reviewfor all variants
  • •The source 3D model is TI's generic RKS package model (named LSF0108RKSR); body dimensions match the RKS package but it is not part-specific.
9 Oct 2026Claude (AI build)Automated build checks (awaiting human validation)superseded
SymbolFootprint3D modelPinsfor all variants
  • ✓Footprint extracted pad-for-pad from the source board and normalized to the footprint frame (back-side parts un-mirrored)
  • ✓3D model seated z=0 at footprint origin (placement inverse; method centroid-matched to KiCad library models on 59 cases)
  • ✓adom-lbr generate + lint passed
  • •20 of 21 pins described from the datasheet (adom-ds2sf, page-cited)
  • •Not yet checked by a person: land pattern vs datasheet, pin-1/orientation, 3D body vs drawing
Evidencedatasheet
Verified files! hd3ss3212rksr.kicad_sym! hd3ss3212rksr.kicad_mod✓ hd3ss3212rksr.step
Spot something wrong? Report it as an issue Propose a fix Records are signed by members of adom.
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
hd3ss3212rksr / README.md
History Download
Caleb Publish 0.1.1 147116e 1d ago

HD3SS3212RKSR

Texas Instruments · Analog Switches - Special Purpose · TQFN-20-EP(2.5x4.5)

HD3SS3212RKSR from Texas Instruments, in a TQFN-20-EP(2.5x4.5). Symbol, footprint and 3D model are the ones used on Adom board designs (3D model: KiCad library 3D model WQFN-20-1EP_2.5x4.5mm_P0.5mm_EP1x2.9mm (CC-BY-SA 4.0 with the KiCad library exception)). Pin functions are extracted from the manufacturer datasheet with page references.

Pinout

Pin Name Type Function
1 RSVD1 output Reserved. Can be left not connected or can be fed to VCC. [datasheet p.5]
2 OEn input Active-low chip enable. L: normal operation. H: shutdown. [datasheet p.4]
3 A0p bidirectional Port A, channel 0, high-speed positive signal. A 20-kΩ pulldown is switched in when the port is not selected. [datasheet p.4]
4 A0n bidirectional Port A, channel 0, high-speed negative signal. A 20-kΩ pulldown is switched in when the port is not selected. [datasheet p.4]
5 GND power_in Ground. [datasheet p.4]
6 VCC power_in 3.3-V power. [datasheet p.4]
7 A1p bidirectional Port A, channel 1, high-speed positive signal. A 20-kΩ pulldown is switched in when the port is not selected. [datasheet p.4]
8 A1n bidirectional Port A, channel 1, high-speed negative signal. A 20-kΩ pulldown is switched in when the port is not selected. [datasheet p.4]
9 SEL input Port select pin. L: Port A to Port B. H: Port A to Port C. [datasheet p.4]
10 RSVD2 output Reserved. Can be left not connected or can be fed to VCC. [datasheet p.5]
11 GND power_in Ground. [datasheet p.4]
12 C1n bidirectional Port C, channel 1, high-speed negative signal (connector side). A 20-kΩ pulldown is switched in when the port is not selected. [datasheet p.4]
13 C1p bidirectional Port C, channel 1, high-speed positive signal (connector side). A 20-kΩ pulldown is switched in when the port is not selected. [datasheet p.4]
14 C0n bidirectional Port C, channel 0, high-speed negative signal (connector side). A 20-kΩ pulldown is switched in when the port is not selected. [datasheet p.4]
15 C0p bidirectional Port C, channel 0, high-speed positive signal (connector side). A 20-kΩ pulldown is switched in when the port is not selected. [datasheet p.4]
16 B1n bidirectional Port B, channel 1, high-speed negative signal (connector side). A 20-kΩ pulldown is switched in when the port is not selected. [datasheet p.4]
17 B1p bidirectional Port B, channel 1, high-speed positive signal (connector side). A 20-kΩ pulldown is switched in when the port is not selected. [datasheet p.4]
18 B0n bidirectional Port B, channel 0, high-speed negative signal (connector side). A 20-kΩ pulldown is switched in when the port is not selected. [datasheet p.4]
19 B0p bidirectional Port B, channel 0, high-speed positive signal (connector side). A 20-kΩ pulldown is switched in when the port is not selected (footnote, p.4). [datasheet p.5]
20 GND power_in Ground. [datasheet p.4]
21 GND power_in Exposed thermal pad (not listed in the Pin Functions table). Must be connected to ground and soldered to the PCB for thermal and mechanical performance (RKS0020A note 3, p.20). [datasheet p.14]

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package TQFN-20-EP(2.5x4.5)
Category Interface
Pins 21
LCSC C129320
Mouser 595-HD3SS3212RKSR
DigiKey 296-42174-2-ND
Distributor summary (LCSC listing, not datasheet) 0.6pF 0℃+70℃ 2 2.7V3.6V 2:1 500ns 500ns 5Ω 80ps 8GHz TQFN-20-EP(2.5x4.5) Analog Switches, Multiplexers ROHS

CAD

  • Symbol: hd3ss3212rksr (source library SSMUX_HD3SS3212IRKSR:HD3SS3212IRKSR)
  • Footprint: mux_CDT:HD3SS3212IRKSR_QFN50P450X250X100-21N
  • 3D model path in footprint: ${KIPRJMOD}/hd3ss3212rksr.step
  • 3D files: hd3ss3212rksr-etched.step / hd3ss3212rksr-etched.glb carry the MPN etch as a separate Adom.LaserEtch part; hd3ss3212rksr.step / hd3ss3212rksr.glb are the bare model.
  • EAGLE/Fusion library: hd3ss3212rksr.lbr (adom-lbr)

Provenance

  • Datasheet: Texas Instruments HD3SS3212 datasheet (SLASE74F, revised September 2016, sha256 111def72b5f44bae, retrieved 2026-10-27, tier: mfr)
  • CAD: Footprint and symbol as used on Adom board designs; 3D model: KiCad library 3D model WQFN-20-1EP_2.5x4.5mm_P0.5mm_EP1x2.9mm (CC-BY-SA 4.0 with the KiCad library exception).
  • Pins: KiCad symbol from the source board + adom-ds2sf datasheet extraction (claude-opus-4-7).

Datasheet PDF