component
HD3SS215IRTQR
Public Made by Adomby adom
Texas Instruments Interface - Specialized, QFN-56-EP(8x8). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HD3SS215IRTQR
Texas Instruments · Interface - Specialized · QFN-56-EP(8x8)
HD3SS215IRTQR from Texas Instruments, in a QFN-56-EP(8x8). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AUX_SEL | input | Three-level AUX/DDC selection control pin used together with Dx_SEL to route AUX and DDC channels. |
| 2 | DC0(P) | bidirectional | Port C, Channel 0 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 3 | DC0(N) | bidirectional | Port C, Channel 0 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 4 | GND | power_in | Ground pin. |
| 5 | DC1(P) | bidirectional | Port C, Channel 1 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 6 | DC1(N) | bidirectional | Port C, Channel 1 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 7 | GND | power_in | Ground pin. |
| 8 | DC2(P) | bidirectional | Port C, Channel 2 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 9 | DC2(N) | bidirectional | Port C, Channel 2 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 10 | GND | power_in | Ground pin. |
| 11 | DC3(P) | bidirectional | Port C, Channel 3 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 12 | DC3(N) | bidirectional | Port C, Channel 3 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 13 | AUXC(P) | bidirectional | Port C AUX positive signal for DisplayPort auxiliary channel switching. |
| 14 | AUXC(N) | bidirectional | Port C AUX negative signal for DisplayPort auxiliary channel switching. |
| 15 | HPDC | bidirectional | Port C hot plug detect signal, switched between the source and sink ports. |
| 16 | HPDA | bidirectional | Port A hot plug detect signal, switched between the source and sink ports. |
| 17 | HPDB | bidirectional | Port B hot plug detect signal, switched between the source and sink ports. |
| 18 | DDCCLK_C | bidirectional | Port C DDC clock signal; absolute maximum rating is -0.5 V to 6 V. |
| 19 | VDD | power_in | 3.3 V positive power supply, recommended range 3 V to 3.6 V. |
| 20 | NC | unconnected | Not connected. |
| 21 | NC | unconnected | Not connected. |
| 22 | DDCCLK_B | bidirectional | Port B DDC clock signal; absolute maximum rating is -0.5 V to 6 V. |
| 23 | DDCDAT_B | bidirectional | Port B DDC data signal; absolute maximum rating is -0.5 V to 6 V. |
| 24 | AUXB(P) | bidirectional | Port B AUX positive signal for DisplayPort auxiliary channel switching. |
| 25 | AUXB(N) | bidirectional | Port B AUX negative signal for DisplayPort auxiliary channel switching. |
| 26 | DDCDAT_C | bidirectional | Port C DDC data signal; absolute maximum rating is -0.5 V to 6 V. |
| 27 | DDCCLK_A | bidirectional | Port A DDC clock signal; absolute maximum rating is -0.5 V to 6 V. |
| 28 | DDCDAT_A | bidirectional | Port A DDC data signal; absolute maximum rating is -0.5 V to 6 V. |
| 29 | AUXA(N) | bidirectional | Port A AUX negative signal for DisplayPort auxiliary channel switching. |
| 30 | AUXA(P) | bidirectional | Port A AUX positive signal for DisplayPort auxiliary channel switching. |
| 31 | DB3(N) | bidirectional | Port B, Channel 3 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 32 | DB3(P) | bidirectional | Port B, Channel 3 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 33 | GND | power_in | Ground pin. |
| 34 | DB2(N) | bidirectional | Port B, Channel 2 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 35 | DB2(P) | bidirectional | Port B, Channel 2 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 36 | GND | power_in | Ground pin. |
| 37 | DB1(N) | bidirectional | Port B, Channel 1 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 38 | DB1(P) | bidirectional | Port B, Channel 1 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 39 | GND | power_in | Ground pin. |
| 40 | DB0(N) | bidirectional | Port B, Channel 0 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 41 | DB0(P) | bidirectional | Port B, Channel 0 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 42 | NC | unconnected | Not connected. |
| 43 | OE | input | Output enable: OE high is normal operation and OE low places the device in standby mode to save power. |
| 44 | DA3(N) | bidirectional | Port A, Channel 3 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 45 | DA3(P) | bidirectional | Port A, Channel 3 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 46 | GND | power_in | Ground pin. |
| 47 | DA2(N) | bidirectional | Port A, Channel 2 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 48 | DA2(P) | bidirectional | Port A, Channel 2 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 49 | GND | power_in | Ground pin. |
| 50 | DA1(N) | bidirectional | Port A, Channel 1 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 51 | DA1(P) | bidirectional | Port A, Channel 1 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 52 | GND | power_in | Ground pin. |
| 53 | DA0(N) | bidirectional | Port A, Channel 0 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 54 | DA0(P) | bidirectional | Port A, Channel 0 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 55 | VDD | power_in | 3.3 V positive power supply, recommended range 3 V to 3.6 V. |
| 56 | Dx_SEL | input | Three-level high-speed port selection control pin that selects the active port. |
| 57 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-56-EP(8x8) |
| Category | Interface ICs |
| Pins | 57 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage VDD (abs max) | VDD | -0.5 | 4 | V | 7 | ||
| Differential I/O voltage (abs max) | -0.5 | 4 | V | Differential I/O | 7 | ||
| AUX_SEL, Dx_SEL voltage (abs max) | -0.5 | 4 | V | AUX_SEL, Dx_SEL | 7 | ||
| HPDx, DDCCLK_X, DDCDAT_X voltage (abs max) | -0.5 | 6 | V | HPDx, DDCCLK_X, DDCDAT_X | 7 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 7 | ||
| ESD HBM | V(ESD) | -1500 | 1500 | V | Human body model, ANSI/ESDA/JEDEC JS-001, all pins | 7 | |
| ESD CDM | V(ESD) | -1250 | 1250 | V | Charged device model, JESD22-C101, all pins | 7 | |
| Main power supply | VDD | 3 | 3.3 | 3.6 | V | 7 | |
| Operating free-air temperature HD3SS215I | TA | -40 | 85 | °C | HD3SS215I | 7 | |
| AC coupling capacitor | CAC | 75 | 100 | 200 | nF | 7 | |
| Junction-to-ambient thermal resistance | RθJA | 90.5 | °C/W | RTQ (56 pin) | 7 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 41.9 | °C/W | RTQ (56 pin) | 7 | ||
| Junction-to-board thermal resistance | RθJB | 53.9 | °C/W | RTQ (56 pin) | 7 | ||
| Junction-to-top characterization parameter | ψJT | 1.8 | °C/W | RTQ (56 pin) | 7 | ||
| Junction-to-board characterization parameter | ψJB | 53.4 | °C/W | RTQ (56 pin) | 7 | ||
| Supply voltage | VDD | 3 | 3.3 | 3.6 | V | 8 | |
| Input high voltage, control pins | VIH | 2 | V | Control Pins, Signal Pins (Dx_SEL, AUX_SEL, OE); max VDD | 8 | ||
| Input high voltage, HPD and DDC | VIH | 2 | 5.5 | V | HPD and DDC | 8 | |
| Input low voltage | VIL | -0.1 | 0.8 | V | Control Pins, Signal Pins (Dx_SEL, AUX_SEL, OE) | 8 | |
| Differential voltage | VI/O_Diff | 0 | 1.8 | Vpp | Switch I/O diff voltage | 8 | |
| Common voltage | VCM | 0 | 3.3 | V | Switch common mode voltage | 8 | |
| Input high current | IIH | 1 | µA | VDD = 3.6 V, VIN = VDD | 8 | ||
| Input mid current | IIM | 1 | µA | VDD = 3.6 V, VIN = VDD/2 | 8 | ||
| Input low current | IIL | 0.01 | 1 | µA | VDD = 3.6 V, VIN = GND | 8 | |
| Leakage current Dx_SEL, AUX_SEL (OE high) | ILK | 0.01 | 2 | µA | VDD = 3.6 V, VIN = 2 V, OE = 3.3 V | 8 | |
| Leakage current Dx_SEL, AUX_SEL (OE low) | ILK | 0.01 | 2 | µA | VDD = 3.6 V, VIN = 2 V, OE = 0 V | 8 | |
| Leakage current HPDx/DDCx | ILK | 0.01 | 5 | µA | VDD = 3.6 V, VIN = 2 V, OE = 0 V; Dx_SEL = 3.3 V | 8 | |
| Device shut down current | IOFF | 8 | µA | VDD = 3.6 V, OE = GND | 8 | ||
| Supply current | IDD | 2.5 | 3.2 | mA | VDD = 3.6 V, Dx_SEL= VDD; AUX_SEL = GND; Outputs Floating | 8 | |
| ON resistance (high speed) | RON | 8 | 14 | Ω | VCM = 0 V-3.3 V, IO = -1mA | 8 | |
| On resistance match | ΔRON | 1.5 | Ω | VCM = 0 V-3. 3V, IO = -1 mA | 8 | ||
| On resistance flatness | RFLAT_ON | 1.3 | Ω | VCM = 0 V-3.3 V | 8 | ||
| ON resistance on AUX channel | RON(AUX) | 5 | 8 | Ω | VCM = 0 V-3.3 V, IO = -8 mA | 8 | |
| ON resistance on DDC channel | RON(DDC) | 30 | 40 | Ω | VCM = 0.4 V, IO = -3 mA | 8 | |
| Switch propagation delay | tPD | 200 | ps | RSC and RLOAD = 50 Ω, See Figure 2 | 9 | ||
| Time from OE high to valid data | ton(OE_L-H) | 1 | 2 | µs | RSC and RLOAD = 50 Ω, VCM = 3 V - 3.3 V | 9 | |
| Time from OE low to Z-state | toff(OE_H-L) | 15 | 50 | µs | RSC and RLOAD = 50 Ω, VCM = 3 V - 3.3 V | 9 | |
| Port switch-over time | tSWITCH_OVER | 0.7 | 1 | µs | RSC and RLOAD = 50 Ω, See Figure 1 | 9 | |
| Dx_SEL/AUX_SEL-to-Switch ton (HPD) | ton | 0.7 | 1 | µs | RLOAD = 125k Ω, See Figure 1 | 9 | |
| Dx_SEL/AUX_SEL-to-Switch toff (HPD) | toff | 0.7 | 20 | µs | RLOAD = 125k Ω, See Figure 1 | 9 | |
| Inter-pair output skew | tSK(O) | 30 | ps | RSC and RLOAD = 50 Ω, See Figure 2 | 9 | ||
| Intra-pair output skew | tSK(b-b) | 1 | 5 | ps | RSC and RLOAD = 50 Ω, See Figure 2 | 9 | |
| Differential return loss 1.35 GHz | RL | -17 | dB | RTQ package, 1.35 GHz | 9 | ||
| Differential return loss 3 GHz | RL | -13 | dB | RTQ package, 3 GHz | 9 | ||
| Differential crosstalk | XTALK | -35 | dB | RTQ package, 2.7 GHz | 9 | ||
| Differential off-isolation | OIRR | -16 | dB | RTQ package, 3 GHz | 9 | ||
| Differential insertion loss 1.35 GHz | IL | -2 | dB | RTQ package, f = 1.35 GHz | 9 | ||
| Differential insertion loss 3 GHz | IL | -2.4 | dB | RTQ package, f = 3 GHz | 9 | ||
| Differential -3-dB bandwidth | BWDx | 5 | GHz | RTQ package | 9 | ||
| AUX -3-dB bandwidth | BWAUX | 720 | MHz | 9 |
CAD (KiCad official)
- Symbol:
HD3SS215IRTQR - Footprint:
Package_DFN_QFN:QFN-56-1EP_8x8mm_P0.5mm_EP4.5x5.2mm - 3D model: QFN-56-EP(8x8) (KiCad packages3D, STEP)
- 3D model files:
hd3ss215irtqr-etched.step/hd3ss215irtqr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hd3ss215irtqr.step/hd3ss215irtqr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (34 pp, sha256
e0d86e6316704cbf, retrieved 2026-10-31, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HD3SS215IRTQR
**Texas Instruments** · Interface - Specialized · QFN-56-EP(8x8)
HD3SS215IRTQR from Texas Instruments, in a QFN-56-EP(8x8). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AUX_SEL | input | Three-level AUX/DDC selection control pin used together with Dx_SEL to route AUX and DDC channels. |
| 2 | DC0(P) | bidirectional | Port C, Channel 0 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 3 | DC0(N) | bidirectional | Port C, Channel 0 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 4 | GND | power_in | Ground pin. |
| 5 | DC1(P) | bidirectional | Port C, Channel 1 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 6 | DC1(N) | bidirectional | Port C, Channel 1 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 7 | GND | power_in | Ground pin. |
| 8 | DC2(P) | bidirectional | Port C, Channel 2 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 9 | DC2(N) | bidirectional | Port C, Channel 2 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 10 | GND | power_in | Ground pin. |
| 11 | DC3(P) | bidirectional | Port C, Channel 3 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 12 | DC3(N) | bidirectional | Port C, Channel 3 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 13 | AUXC(P) | bidirectional | Port C AUX positive signal for DisplayPort auxiliary channel switching. |
| 14 | AUXC(N) | bidirectional | Port C AUX negative signal for DisplayPort auxiliary channel switching. |
| 15 | HPDC | bidirectional | Port C hot plug detect signal, switched between the source and sink ports. |
| 16 | HPDA | bidirectional | Port A hot plug detect signal, switched between the source and sink ports. |
| 17 | HPDB | bidirectional | Port B hot plug detect signal, switched between the source and sink ports. |
| 18 | DDCCLK_C | bidirectional | Port C DDC clock signal; absolute maximum rating is -0.5 V to 6 V. |
| 19 | VDD | power_in | 3.3 V positive power supply, recommended range 3 V to 3.6 V. |
| 20 | NC | unconnected | Not connected. |
| 21 | NC | unconnected | Not connected. |
| 22 | DDCCLK_B | bidirectional | Port B DDC clock signal; absolute maximum rating is -0.5 V to 6 V. |
| 23 | DDCDAT_B | bidirectional | Port B DDC data signal; absolute maximum rating is -0.5 V to 6 V. |
| 24 | AUXB(P) | bidirectional | Port B AUX positive signal for DisplayPort auxiliary channel switching. |
| 25 | AUXB(N) | bidirectional | Port B AUX negative signal for DisplayPort auxiliary channel switching. |
| 26 | DDCDAT_C | bidirectional | Port C DDC data signal; absolute maximum rating is -0.5 V to 6 V. |
| 27 | DDCCLK_A | bidirectional | Port A DDC clock signal; absolute maximum rating is -0.5 V to 6 V. |
| 28 | DDCDAT_A | bidirectional | Port A DDC data signal; absolute maximum rating is -0.5 V to 6 V. |
| 29 | AUXA(N) | bidirectional | Port A AUX negative signal for DisplayPort auxiliary channel switching. |
| 30 | AUXA(P) | bidirectional | Port A AUX positive signal for DisplayPort auxiliary channel switching. |
| 31 | DB3(N) | bidirectional | Port B, Channel 3 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 32 | DB3(P) | bidirectional | Port B, Channel 3 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 33 | GND | power_in | Ground pin. |
| 34 | DB2(N) | bidirectional | Port B, Channel 2 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 35 | DB2(P) | bidirectional | Port B, Channel 2 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 36 | GND | power_in | Ground pin. |
| 37 | DB1(N) | bidirectional | Port B, Channel 1 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 38 | DB1(P) | bidirectional | Port B, Channel 1 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 39 | GND | power_in | Ground pin. |
| 40 | DB0(N) | bidirectional | Port B, Channel 0 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 41 | DB0(P) | bidirectional | Port B, Channel 0 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 42 | NC | unconnected | Not connected. |
| 43 | OE | input | Output enable: OE high is normal operation and OE low places the device in standby mode to save power. |
| 44 | DA3(N) | bidirectional | Port A, Channel 3 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 45 | DA3(P) | bidirectional | Port A, Channel 3 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 46 | GND | power_in | Ground pin. |
| 47 | DA2(N) | bidirectional | Port A, Channel 2 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 48 | DA2(P) | bidirectional | Port A, Channel 2 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 49 | GND | power_in | Ground pin. |
| 50 | DA1(N) | bidirectional | Port A, Channel 1 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 51 | DA1(P) | bidirectional | Port A, Channel 1 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 52 | GND | power_in | Ground pin. |
| 53 | DA0(N) | bidirectional | Port A, Channel 0 high-speed negative signal; the switch supports data rates up to 6 Gbps. |
| 54 | DA0(P) | bidirectional | Port A, Channel 0 high-speed positive signal; the switch supports data rates up to 6 Gbps. |
| 55 | VDD | power_in | 3.3 V positive power supply, recommended range 3 V to 3.6 V. |
| 56 | Dx_SEL | input | Three-level high-speed port selection control pin that selects the active port. |
| 57 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-56-EP(8x8) |
| Category | Interface ICs |
| Pins | 57 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage VDD (abs max) | VDD | -0.5 | | 4 | V | | 7 |
| Differential I/O voltage (abs max) | | -0.5 | | 4 | V | Differential I/O | 7 |
| AUX_SEL, Dx_SEL voltage (abs max) | | -0.5 | | 4 | V | AUX_SEL, Dx_SEL | 7 |
| HPDx, DDCCLK_X, DDCDAT_X voltage (abs max) | | -0.5 | | 6 | V | HPDx, DDCCLK_X, DDCDAT_X | 7 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 7 |
| ESD HBM | V(ESD) | -1500 | | 1500 | V | Human body model, ANSI/ESDA/JEDEC JS-001, all pins | 7 |
| ESD CDM | V(ESD) | -1250 | | 1250 | V | Charged device model, JESD22-C101, all pins | 7 |
| Main power supply | VDD | 3 | 3.3 | 3.6 | V | | 7 |
| Operating free-air temperature HD3SS215I | TA | -40 | | 85 | °C | HD3SS215I | 7 |
| AC coupling capacitor | CAC | 75 | 100 | 200 | nF | | 7 |
| Junction-to-ambient thermal resistance | RθJA | | 90.5 | | °C/W | RTQ (56 pin) | 7 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 41.9 | | °C/W | RTQ (56 pin) | 7 |
| Junction-to-board thermal resistance | RθJB | | 53.9 | | °C/W | RTQ (56 pin) | 7 |
| Junction-to-top characterization parameter | ψJT | | 1.8 | | °C/W | RTQ (56 pin) | 7 |
| Junction-to-board characterization parameter | ψJB | | 53.4 | | °C/W | RTQ (56 pin) | 7 |
| Supply voltage | VDD | 3 | 3.3 | 3.6 | V | | 8 |
| Input high voltage, control pins | VIH | 2 | | | V | Control Pins, Signal Pins (Dx_SEL, AUX_SEL, OE); max VDD | 8 |
| Input high voltage, HPD and DDC | VIH | 2 | | 5.5 | V | HPD and DDC | 8 |
| Input low voltage | VIL | -0.1 | | 0.8 | V | Control Pins, Signal Pins (Dx_SEL, AUX_SEL, OE) | 8 |
| Differential voltage | VI/O_Diff | 0 | | 1.8 | Vpp | Switch I/O diff voltage | 8 |
| Common voltage | VCM | 0 | | 3.3 | V | Switch common mode voltage | 8 |
| Input high current | IIH | | | 1 | µA | VDD = 3.6 V, VIN = VDD | 8 |
| Input mid current | IIM | | | 1 | µA | VDD = 3.6 V, VIN = VDD/2 | 8 |
| Input low current | IIL | | 0.01 | 1 | µA | VDD = 3.6 V, VIN = GND | 8 |
| Leakage current Dx_SEL, AUX_SEL (OE high) | ILK | | 0.01 | 2 | µA | VDD = 3.6 V, VIN = 2 V, OE = 3.3 V | 8 |
| Leakage current Dx_SEL, AUX_SEL (OE low) | ILK | | 0.01 | 2 | µA | VDD = 3.6 V, VIN = 2 V, OE = 0 V | 8 |
| Leakage current HPDx/DDCx | ILK | | 0.01 | 5 | µA | VDD = 3.6 V, VIN = 2 V, OE = 0 V; Dx_SEL = 3.3 V | 8 |
| Device shut down current | IOFF | | | 8 | µA | VDD = 3.6 V, OE = GND | 8 |
| Supply current | IDD | | 2.5 | 3.2 | mA | VDD = 3.6 V, Dx_SEL= VDD; AUX_SEL = GND; Outputs Floating | 8 |
| ON resistance (high speed) | RON | | 8 | 14 | Ω | VCM = 0 V-3.3 V, IO = -1mA | 8 |
| On resistance match | ΔRON | | | 1.5 | Ω | VCM = 0 V-3. 3V, IO = -1 mA | 8 |
| On resistance flatness | RFLAT_ON | | | 1.3 | Ω | VCM = 0 V-3.3 V | 8 |
| ON resistance on AUX channel | RON(AUX) | | 5 | 8 | Ω | VCM = 0 V-3.3 V, IO = -8 mA | 8 |
| ON resistance on DDC channel | RON(DDC) | | 30 | 40 | Ω | VCM = 0.4 V, IO = -3 mA | 8 |
| Switch propagation delay | tPD | | | 200 | ps | RSC and RLOAD = 50 Ω, See Figure 2 | 9 |
| Time from OE high to valid data | ton(OE_L-H) | | 1 | 2 | µs | RSC and RLOAD = 50 Ω, VCM = 3 V - 3.3 V | 9 |
| Time from OE low to Z-state | toff(OE_H-L) | | 15 | 50 | µs | RSC and RLOAD = 50 Ω, VCM = 3 V - 3.3 V | 9 |
| Port switch-over time | tSWITCH_OVER | | 0.7 | 1 | µs | RSC and RLOAD = 50 Ω, See Figure 1 | 9 |
| Dx_SEL/AUX_SEL-to-Switch ton (HPD) | ton | | 0.7 | 1 | µs | RLOAD = 125k Ω, See Figure 1 | 9 |
| Dx_SEL/AUX_SEL-to-Switch toff (HPD) | toff | | 0.7 | 20 | µs | RLOAD = 125k Ω, See Figure 1 | 9 |
| Inter-pair output skew | tSK(O) | | | 30 | ps | RSC and RLOAD = 50 Ω, See Figure 2 | 9 |
| Intra-pair output skew | tSK(b-b) | | 1 | 5 | ps | RSC and RLOAD = 50 Ω, See Figure 2 | 9 |
| Differential return loss 1.35 GHz | RL | | -17 | | dB | RTQ package, 1.35 GHz | 9 |
| Differential return loss 3 GHz | RL | | -13 | | dB | RTQ package, 3 GHz | 9 |
| Differential crosstalk | XTALK | | -35 | | dB | RTQ package, 2.7 GHz | 9 |
| Differential off-isolation | OIRR | | -16 | | dB | RTQ package, 3 GHz | 9 |
| Differential insertion loss 1.35 GHz | IL | | -2 | | dB | RTQ package, f = 1.35 GHz | 9 |
| Differential insertion loss 3 GHz | IL | | -2.4 | | dB | RTQ package, f = 3 GHz | 9 |
| Differential -3-dB bandwidth | BWDx | | 5 | | GHz | RTQ package | 9 |
| AUX -3-dB bandwidth | BWAUX | | 720 | | MHz | | 9 |
## CAD (KiCad official)
- Symbol: `HD3SS215IRTQR`
- Footprint: `Package_DFN_QFN:QFN-56-1EP_8x8mm_P0.5mm_EP4.5x5.2mm`
- 3D model: QFN-56-EP(8x8) (KiCad packages3D, STEP)
- 3D model files: `hd3ss215irtqr-etched.step` / `hd3ss215irtqr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hd3ss215irtqr.step` / `hd3ss215irtqr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/hd3ss215irtqr.pdf) (34 pp, sha256 `e0d86e6316704cbf`, retrieved 2026-10-31, tier: manufacturer)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hd3ss215irtqr-datasheet.pdf)