component

HCS300T-I

Public Made by Adom

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Microchip Tech Interface - Specialized, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterface icshcs300t-ifactory-2.0.0extractor-text

Verified HCS300T-I

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: HCS300T-I · SOIC-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 36-page datasheet
  • •distributor (warn): no ['digikey', 'mouser'] number
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-4vksl7q9/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ hcs300t-i.kicad_sym✓ hcs300t-i.kicad_mod✓ hcs300t-i.step
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3D Model

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Symbol & Footprint

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Contents

README

markdown

HCS300T-I

Microchip Tech · Interface - Specialized · SOIC-8

HCS300T-I from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S0 input Switch input 0 (button input with internal pull-down resistor).
2 S1 input Switch input 1 (button input with internal pull-down resistor).
3 S2 input Switch input 2, also the clock pin when in Programming mode.
4 S3 input Switch input 3 (button input with internal pull-down resistor).
5 VSS power_in Ground reference.
6 PWM bidirectional Pulse Width Modulation (PWM) output pin, also the data pin for Programming mode.
7 LED output Cathode connection for LED, with current limiting on the LED output.
8 VDD power_in Positive supply voltage, 2.0V to 6.3V operation.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD -0.3 6.6 V 21
Input voltage (lower bound; upper is VDD + 0.3) VIN -0.3 V -0.3 to VDD + 0.3 21
Output voltage (lower bound; upper is VDD + 0.3) VOUT -0.3 V -0.3 to VDD + 0.3 21
Max output current IOUT 50 mA 21
Storage temperature TSTG -55 125 °C 21
Lead soldering temp TLSOL 300 °C 21
ESD rating VESD 4000 V 21
Operating supply voltage VDD 2 6.3 V 2.0V - 6.3V operation 1
Operating temperature (Industrial) Tamb -40 85 °C Industrial (I) 21
Operating current (avg), 2.0V<VDD<3.0 ICC 0.2 1 mA VDD = 3.0V, no load 21
Operating current (avg), 3.0<VDD<6.3 ICC 1 2.5 mA VDD = 6.3V, no load 21
Standby current, 2.0V<VDD<3.0 ICCS 0.1 1 μA 21
Standby current, 3.0<VDD<6.3 ICCS 0.1 1 μA 21
Auto-shutoff current, 2.0V<VDD<3.0 ICCS 40 75 μA Does not include input pull-down resistor current; characterized not tested 21
Auto-shutoff current, 3.0<VDD<6.3 ICCS 160 650 μA Does not include input pull-down resistor current; characterized not tested 21
Low level input voltage (lower bound; upper is 0.15VDD) VIL -0.3 V max 0.15VDD 21
LED sink current, 2.0V<VDD<3.0 ILED 1 1.8 2.5 mA VLED = 1.5V, VDD = 3.0V, VLOW Sel = 0 21
LED sink current, 3.0<VDD<6.3 ILED 2 2.7 3.7 mA VLED = 1.5V, VDD = 6.3V, VLOW Sel = 1 21
Pull-down resistance; S0-S3, 2.0V<VDD<3.0 RS0-3 40 60 80 kΩ VDD = 4.0V 21
Pull-down resistance; S0-S3, 3.0<VDD<6.3 RS0-3 40 60 80 kΩ VDD = 4.0V 21
Pull-down resistance; PWM, 2.0V<VDD<3.0 RPWM 80 120 160 kΩ VDD = 4.0V 21
Pull-down resistance; PWM, 3.0<VDD<6.3 RPWM 80 120 160 kΩ VDD = 4.0V 21
Transmit delay from button detect TTD 10 26 ms VDD = +3.5 to 13.0V 22
Debounce delay TDB 6 15 ms VDD = +3.5 to 13.0V 22
Auto-shutoff time-out period TTO 20 120 s VDD = +3.5 to 13.0V 22

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Package: P = Plastic DIP (300 mil Body), 8-lead SN = Plastic SOIC (150 mil Body), 8-lead 33

CAD (KiCad official)

  • Symbol: HCS300T-I
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: hcs300t-i-etched.step / hcs300t-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hcs300t-i.step / hcs300t-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (36 pp, sha256 e0d7d03adb2340b5, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF