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HCPL-7800-000E

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Broadcom AVAGO Operational Amplifier, DIP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.

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Contents

README

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HCPL-7800-000E

Broadcom AVAGO · Operational Amplifier · DIP-8

HCPL-7800-000E from Broadcom AVAGO, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Input-side supply, nominally +5 V referenced to GND1. A 0.1 µF bypass capacitor must be connected between pins 1 and 4.
2 VIN+ input Non-inverting analog input to the isolated Σ-Δ modulator. Differential input pair with VIN- (pin 3), intended for sensing the small voltage across an external current-sense shunt resistor.
3 VIN- input Inverting analog input to the isolated Σ-Δ modulator. Differential pair with VIN+ (pin 2); commonly tied to the sense-resistor low side / GND1.
4 GND1 power_in Input-side ground, return for VDD1 and reference for the VIN+/VIN- differential input pair.
5 GND2 power_in Output-side ground, return for VDD2 and reference for the VOUT+/VOUT- differential output pair. Galvanically isolated from GND1 across the optical isolation barrier.
6 VOUT- output Inverting analog output on the isolated (output) side. Forms a differential output pair with VOUT+ (pin 7); typically fed into an external op-amp to produce a single-ended signal proportional to the sensed input.
7 VOUT+ output Non-inverting analog output on the isolated (output) side. Differential pair with VOUT- (pin 6).
8 VDD2 power_in Output-side supply, nominally +5 V referenced to GND2. A 0.1 µF bypass capacitor must be connected between pins 5 and 8.

Key specifications

Parameter Value
Manufacturer Broadcom AVAGO
Package DIP-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HCPL-7800-000E
  • HCPL-7800-000E-300E
  • HCPL-7800-000E#300
  • HCPL-7800-000E-500E
  • HCPL-7800-000E#500

CAD (KiCad official)

  • Symbol: HCPL-7800-000E
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: hcpl-7800-000e-etched.step / hcpl-7800-000e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hcpl-7800-000e.step / hcpl-7800-000e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Broadcom AVAGO datasheet (18 pp, sha256 bf4bdf348aba0c52, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF