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HCPL-4503-500E

Broadcom Limited · Transistor, Photovoltaic Output Optoisolators · DIP-8

HCPL-4503-500E from Broadcom Limited, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection on this package; leave unconnected.
2 ANODE input LED anode; the LED reverse input voltage (pin 3-2) is limited to 5 V and the average forward input current to 25 mA.
3 CATHODE input LED cathode; the reverse LED input voltage (pin 3-2) is limited to 5 V.
4 NC unconnected No internal connection on this package; leave unconnected.
5 GND power_in Ground and reference for the supply (pin 8-5, max 30 V) and output (pin 6-5, max 20 V); a 0.1 µF bypass capacitor should be connected between pins 5 and 8.
6 VO output Open-collector output, rated 8 mA average and 16 mA peak output current, with output voltage limited to -0.5 V to 20 V referenced to pin 5.
7 NC unconnected No connection on the HCPL-4502/4503 (the base-current rating applies only to other devices in the family).
8 VCC power_in Supply voltage, rated -0.5 V to 30 V referenced to pin 5; a 0.1 µF bypass capacitor should be connected between pins 5 and 8.

Key specifications

Parameter Value
Manufacturer Broadcom Limited
Package DIP-8
Category Optoisolators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Storage Temperature TS -55 125 °C 9
Operating Temperature (8-Pin DIP) TA -55 100 °C 9
Average Forward Input Current IF(AVG) 25 mA Note 1: derate linearly above 70°C free-air at 0.8 mA/°C (8-Pin DIP) 9
Peak Transient Input Current IF(TRANS) 1 A ≤1 µs pulse width, 300 pps (8-Pin DIP) 9
Reverse LED Input Voltage (Pin 3-2) VR 5 V 8-Pin DIP 9
Input Power Dissipation PIN 45 mW Note 3: derate linearly above 70°C at 0.9 mW/°C (8-Pin DIP) 9
Average Output Current (Pin 6) IO(AVG) 8 mA 9
Peak Output Current IO(PEAK) 16 mA 9
Supply Voltage (Pin 8-5) VCC -0.5 30 V 9
Output Voltage (Pin 6-5) VO -0.5 20 V 9
Output Power Dissipation PO 100 mW Note 4: derate linearly above 70°C at 2.0 mW/°C (8-Pin DIP) 9
Lead Solder Temperature (through-hole parts only) TLS 260 °C 1.6 mm below seating plane, 10 seconds (8-Pin DIP) 9
Recommended operating temperature TA 0 70 °C Guaranteed performance over recommended temperature 10
Current Transfer Ratio (HCPL-4502/3) CTR 19 % TA = 25°C, VO = 0.4 V, IF = 16 mA, VCC = 4.5 V 10
Logic Low Output Voltage (HCPL-4502/3) VOL 0.1 0.4 V TA = 25°C, IO = 3.0 mA, IF = 16 mA, VCC = 4.5 V 10
Logic High Output Current IOH 0.003 0.5 µA TA = 25°C, VO = VCC = 5.5 V, IF = 0 mA 10
Logic High Output Current IOH 0.01 1 µA TA = 25°C, VO = VCC = 15 V 10
Logic High Output Current IOH 50 µA VO = VCC = 15 V 10
Logic Low Supply Current ICCL 50 200 µA IF = 16 mA, VO = Open, VCC = 15 V 10
Logic High Supply Current ICCH 0.02 1 µA TA = 25°C, IF = 16 mA, VO = Open, VCC = 15 V 10
Input Forward Voltage (8-Pin DIP) VF 1.5 1.7 V TA = 25°C, IF = 16 mA 10
Input Reverse Breakdown Voltage (8-Pin DIP) BVR 5 V IR = 10 µA 10
Propagation Delay Time to Logic Low (HCPL-4502/3) tPHL 0.2 0.8 µs TA = 25°C, RL = 1.9 kΩ 11
Propagation Delay Time to Logic High (HCPL-4502/3) tPLH 0.6 0.8 µs TA = 25°C, RL = 1.9 kΩ 11
Common Mode Transient Immunity at Logic High (HCPL-4503) /CMH/ 15 30 kV/µs IF = 0 mA, TA = 25°C, VCM = 1500 Vp-p, CL = 15 pF, RL = 1.9 kΩ 11
Common Mode Transient Immunity at Logic Low (HCPL-4503) /CML/ 15 30 kV/µs IF = 16 mA, TA = 25°C, VCM = 1500 Vp-p, CL = 15 pF, RL = 1.9 kΩ 11
Input-Output Momentary Withstand Voltage (8-Pin DIP) VISO 3750 V rms RH < 50%, t = 1 min., TA = 25°C 12
Input-Output Leakage Current (8-Pin DIP) II-O 1 µA 45% RH, t = 5 s, VI-O = 3 kVdc, TA = 25°C 12

CAD (KiCad official)

  • Symbol: HCPL-4503-500E
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: hcpl-4503-500e-etched.step / hcpl-4503-500e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hcpl-4503-500e.step / hcpl-4503-500e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Broadcom Limited datasheet (16 pp, sha256 d0469b65d9f7cd39, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF