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Contents

README

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HCPL-2611-000E

Broadcom AVAGO · Logic Output Optoisolators · DIP-8

HCPL-2611-000E from Broadcom AVAGO, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection; the datasheet marks this pin NC in the single-channel 8-pin DIP pinout.
2 ANODE passive Anode of the GaAsP input LED; the selection guide gives an input on-current of 5 mA for this part.
3 CATHODE passive Cathode of the GaAsP input LED, forming the LED drive return path with pin 2.
4 NC unconnected No internal connection; the datasheet marks this pin NC in the single-channel 8-pin DIP pinout.
5 GND power_in Ground reference for the detector IC; a 0.1 µF bypass capacitor must be connected as close as possible between pins 5 and 8.
6 VO output Output of the detector IC, an open-collector Schottky-clamped transistor that is TTL/LSTTL compatible.
7 VE input Enable input that strobes the detector output; the enable function is available on single-channel products only and is defined by the truth table.
8 VCC power_in Supply voltage pin for the detector IC; keep the 0.1 µF bypass capacitor to pin 5 as close as possible.

Key specifications

Parameter Value
Manufacturer Broadcom AVAGO
Package DIP-8
Category Optoisolators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
High Level Output Current IOH 5.5 100 µA VCC = 5.5V, VE = 2.0V, VO = 5.5V, IF = 250 μA 16
Low Level Output Voltage (8-Pin DIP) VOL 0.35 0.6 V VCC = 5.5V, VE = 2.0V, IF = 5 mA, IOL (Sinking) = 13 mA 16
High Level Supply Current (Single Channel) ICCH 7 10 mA VE = 0.5V, VCC = 5.5V, IF = 0 mA 16
Low Level Supply Current (Single Channel) ICCL 9 13 mA VE = 0.5V, VCC = 5.5V, IF = 10 mA 16
High Level Enable Current (Single Channel) IEH -0.7 -1.6 mA VCC = 5.5V, VE = 2.0V 16
Low Level Enable Current IEL -0.9 -1.6 mA VCC = 5.5V, VE = 0.5V 16
High Level Enable Voltage VEH 2 V 16
Low Level Enable Voltage VEL 0.8 V 16
Input Forward Voltage (8-Pin DIP) VF 1.4 1.5 1.75 V TA = 25°C, IF = 10 mA 16
Input Reverse Breakdown Voltage (8-Pin DIP, SO-8) BVR 5 V IR = 10 µA 17
Logic High Common Mode Transient Immunity (HCPL-2611) /CMH/ 15000 25000 V/µs /VCM/ = 1 kV 19
Logic Low Common Mode Transient Immunity (HCPL-2611) /CML/ 15000 25000 V/µs /VCM/ = 1 kV 19
Propagation Delay Time to High Output Level tPLH 20 48 75 ns TA = 25°C RL = 350Ω CL = 15 pF 18
Propagation Delay Time to Low Output Level tPHL 25 50 75 ns TA = 25°C RL = 350Ω CL = 15 pF 18
Pulse Width Distortion (8-Pin DIP, SO-8) /tPHL, tPLH/ 3.5 35 ns RL = 350Ω CL = 15 pF 18
Propagation Delay Skew tPSK 40 ns RL = 350Ω CL = 15 pF 18
Input-Output Momentary Withstand Voltage (8-Pin DIP, SO-8) VISO 3750 Vrms RH 50%, t = 1 min, TA = 25°C 20
Input-Output Insulation Leakage Current (Single 8-Pin DIP) II-O 1 µA 45% RH, t = 5s, VI-O = 3 kVdc, TA = 25°C 20
Input Current, Low Level IFL 0 250 µA 15
Input Current, High Level IFH 5 15 mA 15
Power Supply Voltage VCC 4.5 5.5 V 15
Low Level Enable Voltage VEL 0 0.8 V 15
High Level Enable Voltage VEH 2 V 15
Operating Temperature TA -40 85 °C 15
Fan Out N 5 TTL Loads RL = 1 kΩ 15
Output Pull-up Resistor RL 330 4 Ω, kΩ as printed 15
Storage Temperature TS -55 125 °C 14
Operating Temperature TA -40 85 °C No derating required up to 85°C 14
Average Forward Input Current (Single 8-Pin DIP) IF 20 mA Single 8-Pin DIP 14
Reverse Input Voltage (8-Pin DIP, SO-8) VR 5 V 8-Pin DIP, SO-8 14
Input Power Dissipation (Single 8-Pin DIP) PI 36 mW Single 8-Pin DIP 14
Supply Voltage VCC 7 V 1 minute maximum 14
Enable Input Current IE 5 mA 14
Output Collector Current IO 50 mA 14
Output Collector Voltage VO 7 V 14
Output Collector Power Dissipation (Single 8-Pin DIP) PO 85 mW Single 8-Pin DIP 14
Lead Solder Temperature (Through Hole, 8-Pin DIP) TLS 260 °C 10 s, 1.6 mm below seating plane 14

CAD (KiCad official)

  • Symbol: HCPL-2611-000E
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: hcpl-2611-000e-etched.step / hcpl-2611-000e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hcpl-2611-000e.step / hcpl-2611-000e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Broadcom AVAGO datasheet (30 pp, sha256 98c77824e0842e59, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF